01/12/2015  The Internet of Everything, cloud computing/big data and 3-D printing are the three technologies most likely to transform the world during the next five years, according to IHS Technology.

01/12/2015  Graphene combined with the insulting power of boron nitride enables light control in tiny circuits with dramatically reduced energy loss.

01/12/2015  SEMI today announced details from the SEMI World Fab Forecast Report illuminating the state of the semiconductor manufacturing industry, coincident with convening SEMI’s Industry Strategy Symposium (ISS) in Half Moon Bay, Calif.

01/09/2015  Silicon Space Technology, an industry innovator in high-temp and rad-hard embedded system solutions, announced today the company has partnered with GLOBALFOUNDRIES to build commercial-ready products for extreme environments and applications.

01/09/2015  With new cost-sensitive semiconductor devices driving capacity demand, 200mm wafer size and currently existing (legacy) fabs are seeing a renaissance, SEMI completed a thorough study of the secondary fab equipment market to identify the market size and to capture key trends and issues impacting this industry segment.

01/09/2015  GLOBALFOUNDRIES and Linear Dimensions Semiconductor Inc. today announced that they are working together to manufacture a 14-channel programmable reference from Linear Dimensions for multiple markets including IoT (Internet of Things) sensor and wearable device applications.

01/07/2015  SEMI today announced a “Call for Papers” for SEMICON West, North America’s premier microelectronics event, to be held July 14-16 at the Moscone Center in San Francisco, Calif.

01/06/2015  ON Semiconductor has successfully characterized and demonstrated its first fully-functional stacked CMOS imaging sensor featuring a smaller die footprint, higher pixel performance and better power consumption compared to traditional monolithic non-stacked designs.

01/06/2015  SEMI Europe will ring in the New Year by holding the first major, international 3D TSV event of 2015. On January 19-21, members of the 3D TSV industry will convene in Grenoble, France for the 3rd edition of the European 3D TSV Summit.

01/05/2015  Chinese IC manufacturer Shanghai Huali Microelectronics Corporation gave a presentation on its outlook for the Internet of Things (IoT) market and the wide application of its specialty technology at the 2014 China Semiconductor Industry Association IC Design Branch Annual Conference ("ICCAD"), which was recently held at Hong Kong Science Park.

01/05/2015  MEMSensing Microsystems Co. and Semiconductor Manufacturing International Corporation jointly announced the launch of the world's smallest 3-axis accelerometer MSA330, which utilizes SMIC's CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.

12/23/2014  There is an old proverb that states “All things Come to Those Who Wait.” I personally am not the waiting type wanting to get things done ASAP but most civilizations look at patience as a virtue.

12/23/2014  The future of the semiconductor industry continues to shine brightly.

12/23/2014  Worldwide semiconductor market revenue is on track to achieve a 9.4 percent expansion this year, with broad-based growth across multiple chip segments driving the best industry performance since 2010.

12/19/2014  Given the current buzz around the Internet of Things (IoT), it is easy to lose sight of the challenges – both economic and technical.

12/18/2014  Defects that aren’t detected inline cost fabs the most.

12/18/2014  Cross section sample preparation is demonstrated using a workflow that combines High Accuracy Cleaving I(HAC) and Broad Ion Beam (BIB) milling.

12/18/2014  North America-based manufacturers of semiconductor equipment posted $1.22 billion in orders worldwide in November 2014 (three-month average basis) and a book-to-bill ratio of 1.02, according to the November EMDS Book-to-Bill Report published today by SEMI.

12/18/2014  LSA technology plays an enabling role to overcoming manufacturing challenges for sub-20nm logic devices.

12/17/2014  At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip.