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PACKAGING ARTICLES



Amkor Technology licenses proprietary copper pillar wafer bump technology to GLOBALFOUNDRIES

12/16/2014  Amkor Technology, Inc., a provider of semiconductor assembly and test services, today announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology.

Synopsys and imec expand TCAD collaboration to 5nm and beyond

12/16/2014  Synopsys, Inc. today announced the expansion of its collaboration with imec (nanoelectronics research center imec) to nanowire and other devices (FinFETs, Tunnel-FETs) targeting the 5-nanometer (nm) technology node and beyond.

Worth the detour: European 3D TSV Summit 2015 offers new outlooks on 2.5 and 3D technology

12/16/2014  With just over a month left to go, industry experts are looking forward to the third edition of the European 3D TSV Summit (Jan 19-21, 2015 in Grenoble, France), this year focusing on “Enabling Smarter Systems.”

Innovation in the shadow of volcanic change

12/16/2014  The semiconductor equipment and materials industry is currently enjoying a double-digit annual growth rate and good prospects looking forward to 2015.

Stacking 2-dimensional materials may lower cost of semiconductor devices

12/12/2014  A team of researchers led by North Carolina State University has found that stacking materials that are only one atom thick can create semiconductor junctions that transfer charge efficiently, regardless of whether the crystalline structure of the materials is mismatched - lowering the manufacturing cost for a wide variety of semiconductor devices such as solar cells, lasers and LEDs.

Global Semiconductor Alliance announces 2014 Award recipients

12/12/2014  GSA members identified the Most Respected Public Semiconductor Company Award winners by casting ballots for the industry’s most respected companies for its products, vision and future opportunities.

?System Plus analyzes the world's smallest ?microbolometer-based thermal imaging ?camera core released by FLIR

12/11/2014  Initially focused on the military, uncooled thermal camera sales have grown significantly due to substantial cost reduction of micro bolometers and growing adoption in commercial markets, including thermography, automotive and surveillance applications.

Leti will discuss CoolCube technology for 3D transistor stacking at workshop preceding IEDM 2014

12/11/2014  CEA-Leti will present its latest results on CoolCube, the technique for stacking transistors sequentially in the same process flow for 3D-VLSI, at a Dec. 14 workshop in San Francisco, Calif.

Intel announces IoT platform

12/11/2014  Intel Corporation today announced the Intel IoT Platform, an end-to-end reference model designed to unify and simplify connectivity and security for the Internet of Things (IoT).

John Neuffer named president and CEO of SIA

12/11/2014  The Semiconductor Industry Association (SIA) announced that John Neuffer has been named president & CEO of the association.

3D TSV begins

12/10/2014  “Engineering samples have already started to ship and preparation is on-going for entering volume manufacturing,” announces Yole.

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

12/09/2014  Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

TSMC recognizes outstanding suppliers at Supply Chain Management Forum

12/09/2014  TSMC held its 14th annual Supply Chain Management forum on December 4, 2014 to show appreciation for the support and contributions of its suppliers in 2014, and to recognize nine outstanding equipment and materials suppliers.

SEMI reports third quarter 2014 worldwide semiconductor equipment figures

12/09/2014  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 8.82 billion in the third quarter of 2014.

Crossbar to demonstrate resistive RRAM innovation at IEDM 2014

12/09/2014  Crossbar, Inc., a start-up company pioneering a new category of very high capacity and high-performance non-volatile memory, today announced it will be disclosing another major technology breakthrough in their development of Resistive RAM (RRAM) at next week’s IEEE International Electron Devices Meeting (IEDM).

Veeco completes acquisition of Solid State Equipment Holdings LLC

12/08/2014  Veeco Instruments Inc. announced that it has acquired privately held Solid State Equipment Holdings LLC (“SSEC”), based in Horsham, Pennsylvania.

ON Semiconductor adds new distribution partners to expand business in Japan and Asia-Pacific

12/04/2014  ON Semiconductor has announced new distribution channel partner agreements with two multi-national electronics trading franchises based in Japan. Ryosan Co., Ltd. and Macnica Inc. join the roster of ON Semiconductor channel sales partners to help expand domestic sales within Japan and work to drive sales growth in China and other Asia-Pacific geographies.

What to expect from the 3rd Edition of the European 3D TSV Summit

12/04/2014  Interview with SEMI Europe’s Yann Guillou gives attendees a preview of the event.

Global semiconductor sales increase in October; Substantial growth projected for 2014

12/03/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $29.7 billion for the month of October 2014, an increase of 9.6 percent from the October 2013 total.

Wireless nanorod-nanotube film enables light stimulation of blind retina

12/03/2014  Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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