09/18/2014  ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

09/18/2014  EMCORE Corporation, a provider of compound semiconductor-based components and subsystems for the fiber optic and space solar power industries, today announced a transition plan of its Chief Executive Officer position in connection with the announced sale of its Space Photovoltaics business.

09/18/2014  Silicon has few serious competitors as the material of choice in the electronics industry. Yet transistors, the switchable valves that control the flow of electrons in a circuit, cannot simply keep shrinking to meet the needs of powerful, compact devices; physical limitations like energy consumption and heat dissipation are too significant.

09/18/2014  The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

09/18/2014  Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

09/18/2014  Oxford Instruments is hosting its third series of annual seminars for the nanotechnology industry in India in November.

09/18/2014  Worldwide billings increased to $319 million in Q2 2014, an increase of 33 percent from the prior quarter but 11 percent below the same quarter a year ago.

09/11/2014  The long wait is finally over. From a sapphire industry standpoint, Apple killed the suspense within the first 10 minutes by announcing that its new 4.7” and 5.5” iPhone 6 and iPhone 6 plus will both feature a traditional ion-exchange strengthened glass display cover.

09/10/2014  The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.

09/10/2014  Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

09/10/2014  Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

09/09/2014  Different GS pixel architectures and technologies are presented and performances compared.

09/09/2014  You can’t fix what you can’t find. You can’t control what you can’t measure.

09/09/2014  Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.

09/09/2014  Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

09/09/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

09/09/2014  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

09/08/2014  The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

09/05/2014  NVIDIA today announced that it has filed complaints against Samsung and Qualcomm at the International Trade Commission and in the U.S. District Court in Delaware, alleging that the companies are both infringing NVIDIA GPU patents covering technology including programmable shading, unified shaders and multithreaded parallel processing.

09/05/2014  RF Micro Devices, Inc. today announced the preliminary results of its special meeting of shareholders held earlier this morning to approve its agreement and plan of merger and reorganization with TriQuint Semiconductor, Inc.