Packaging

PACKAGING ARTICLES

Micron Technology appoints Rajan Rajgopal as VP of Quality

12/04/2013 Micron Technology, Inc. today announced that the company has named Rajan Rajgopal, vice president of Quality.

Soitec announces high-volume manufacturing of new eSI substrates

12/04/2013 Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.

Cellphones pass PCs as biggest systems market and IC user

12/03/2013 Tablets and wireless networks are expected to show highest growth rates through 2017.

Lab school brings manufacturing technologies to middle-school classrooms

12/03/2013 A partnership among the University of Virginia's (UVa) Schools of Education and Engineering and the Charlottesville Public Schools has led to the launch of Buford Engineering Design Academy, a laboratory school for advanced manufacturing.

Sankalp Semiconductor appoints Dan Clein into its management team

12/03/2013 Sankalp Semiconductor Private Limited, a leading Analog Mixed-Signal services and solutions company from India, announced today the appointment of Mr. Dan Clein into its management team. Dan will be based out of the North America region.

2013 semiconductor equipment sales forecast $32B; strong growth forecast for 2014

12/03/2013 SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.

Semiconductor industry leaders to examine the future of 3D NAND at Dec 10 event

12/02/2013 Manufacturing 3D NAND designs requires overcoming formidable technical challenges to create extremely complex high-aspect-ratio structures.

14) FinFETs Formed by Directed Self-Assembly

11/26/2013

11) 3D Integration of Diverse Technologies for Self-Driving Vehicles

11/26/2013

10) Nonvolatile Logic-in-Memory Technology

11/26/2013

9) Flexible High-Performance Nonvolatile Memory

11/26/2013

6) Dual-Channel Nanowire Transistors

11/26/2013

5) Eliminating Bulky Optics in Hyperspectral Cameras

11/26/2013

4) Strained FDSOI Devices for the 10nm Node

11/26/2013

3) Porous Silicon for Integrated On-Chip Energy Storage

11/26/2013

1) Pixel-Parallel Image Processing

11/26/2013

Dongbu HiTek starts volume production of 5 megapixel CMOS image sensor chips

11/25/2013 Dongbu HiTek today announced that it has begun volume production of 5.0 Megapixel (5M) CMOS Image Sensor (CIS) devices for Superpix Micro Technology Co., Ltd., a fabless customer based in Beijing.

Can Intel beat TSMC?

11/25/2013 It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

Unraveling the mind-body connection with power-efficient IC chip

11/22/2013 Despite the advances in neuroscience research, the human brain remains a complex puzzle with questions unanswered on how it controls human behaviour, cognitive functions and movements.

Open-Silicon and GLOBALFOUNDRIES demonstrate custom 28nm SoC using 2.5D technology

11/21/2013 Open-Silicon, Inc., and GLOBALFOUNDRIES today announced the industrys first demonstration of a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

PACKAGING ARTICLES

WEBCASTS