07/24/2013 

Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.

07/22/2013 

Cree, Inc. announces that its 1200 V SiC MOSFETs are being incorporated into the latest advanced power supplies from Delta Elektronika BV.

07/18/2013 

A variety of techniques and materials have been developed to successfully achieve bonding/debonding for 3D integration, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated.

07/17/2013 

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

07/10/2013 

Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.

07/09/2013 

Dow Corning announced Monday that it is among the newest member organizations to join imec, a leading research center for the advancement of nano-electronics.

07/09/2013 

Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer's wet deposition processes for 300mm high-volume manufacturing.

07/02/2013 

Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.

07/02/2013 

Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays. But frankly it’s been hard to build applications with much market pull without logic or memory as well, and those have been much harder to make.

07/02/2013 

This technology paves the way towards interconnect Cu metallization into the 7nm node and beyond.

06/24/2013 

Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, today announced it has named semiconductor industry veteran Chris Seams its new CEO.

06/17/2013 

Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.

06/14/2013 

In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult.

06/10/2013 

CEA-Leti announced today that researchers Dominique Vicard and Jean Brun received the Avantex Innovation Prize for the use of the E-Thread technology in textiles.

06/06/2013 

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

05/31/2013 

The foundry plans to unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes at next week’s 50th Design Automation Conference (DAC) in Austin, Texas.

05/29/2013 

The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging.

05/29/2013 

OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.

05/29/2013 

CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.