Tag Archives: Rudolph Technologies

The ConFab 2018 Update

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A new wave of growth is sweeping through the semiconductor industry, propelled by a vast array of new applications, including artificial intelligence, virtual and augmented reality, automotive, 5G, the IoT, cloud computing, healthcare and many others. The big question facing today’s semiconductor manufacturers and their suppliers is how can they best position themselves to take advantage of this tremendous growth.

Finding answers to that question is the goal of The ConFab 2018, to be held May 20-23 at The Cosmopolitan of Las Vegas. Now in its 14th year, The ConFab is a conference and networking event designed to inform and connect leading semiconductor executives from all parts of the supply chain. It is produced by Solid State Technology magazine, the semiconductor industry’s oldest and most respected business publication.

Kicking things off will be IBM’s Rama Divakaruni, who will speak on “How AI is Driving the New Semiconductor Era.” This is hugely important to how semiconductors will be designed and manufactured in the future, because AI — now in its infancy — will demand dramatic enhancement in computational performance and efficiency. Fundamental changes will be required in algorithms, systems and chip design.  Devices and materials will also need to change.

Rama is well position to address these changes: As an IBM Distinguished Engineer, he is responsible for IBM Advanced Process Technology Research (which includes EUV technologies and advanced unit process and Enablement technologies) as well as the main interface between IBM Semiconductor Research and IBM’s Systems Leadership. He is one of IBMs top inventors with over 225+ issued US patents.

We’re also pleased to announce several other speakers at this point. Joining us will be George Gomba, VP of technology research at GlobalFoundries. George has overall responsibility for GlobalFoundries’ semiconductor technology research programs, including global consortia and strategic supplier management (and, like Rama, has a long history at IBM). The focus of George’s talk will be on EUV lithography.

Dan Armbrust, Founder and Director of Silicon Catalyst, the world’s first incubator focused exclusively on semiconductor solutions startups will also be on the dais. A frequent speaker at The ConFab, Dan has a great background, including President and Chief Executive Officer of SEMATECH, IBM VP, 300mm Semiconductor Operations, and Strategic Client Exec for IBM’s Systems and Technology Group.

Another great speaker is Tom Sonderman, President of SkyWater Technology Foundry. Tom also has a great background including GlobalFoundries’ VP of manufacturing technology, and two decases at AMD, where he had global responsibility for development, integration, support and scalability of automation and manufacturing systems in the company’s wafer fabrication and assembly operations. Prior to joining SkyWater, Prior to joining SkyWater, Tom was the group vice president and general manager for Rudolph Technologies’ Integrated Solutions Group. In this position, he created a Smart Manufacturing ecosystem based on big data platforms, predictive analytics and IoT.

We’re so excited about the other speakers we tentatively have lined up, our plans for several thought-provoking panels and much more, so stay tuned. You register and keep up-to-date by visiting www.theconfab.com. For sponsorship inquiries, contact Kerry Hoffman at [email protected].  For those interested in attending as a guest or qualifying as a VIP, contact Sally Bixby at [email protected].

Webcast on 3D Integration/Advanced Packaging, Lithography

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If you’ve been following the field of 3D integration for any time at all, then you’re familiar with Sitaram Arkalgud. In addition to being a great guy, he led the charge on 3D integration at SEMATECH in the early days. He’s now at Invensas and I’m very much looking forward to hearing from him again, this Thursday at 1:00 Eastern. You can hear from him too, by tuning into our webcast. But first you’ll have to register: https://event.webcasts.com/starthere.jsp?ei=1032084

Sitaram will be joined by Rich Rogoff, vp and general manager of the Lithography Systems Group at Rudolph Technologies. Rich recently wrote an interesting article “A square peg in a round hole: The economics of panel-based lithography for advanced packaging” and he’s going to expand on that in the second part of the webcast on Thursday.

Here’s a little more information on the webcast, Sitaram and Rich.

2.5/3D integration and advanced packaging enable better chip performance in a smaller form factor, meeting the needs of smartphones, tablets, and other advanced devices. However, 2.5/3D packaging creates a new set of manufacturing challenges, such as the need to fabricate copper pillars, TSVs, wafer bumping and redistribution layers – which may involve thicker photoresists, spin-on dielectrics and BCB coatings — and processing may be done on panels instead of round wafers. In this webcast, experts will detail various options, future scenarios and challenges that must still be overcome.

Sitaram Arkalgud is Vice President, 3D technology at Invensas Corp., where he leads the company’s 3D-IC research and development efforts. Prior to Invensas, he started and led 3D-IC development at SEMATECH, where the focus was on delivering manufacturable process technologies for 3D interconnects. Previously, Sitaram worked in a variety of roles spanning R&D and manufacturing in memory and logic technologies at Infineon/Qimonda and Motorola. He is the author of several publications and holds 14 U.S. patents. Sitaram holds a master’s degree and a Ph.D. in materials engineering from Rensselaer Polytechnic Institute in Troy, N.Y., and a bachelor’s degree in metallurgical engineering from Karnataka Regional Engineering College, Surathkal, India.

Richard Rogoff is Vice President and General Manager of the Lithography Systems Group at Rudolph Technologies. Prior to joining Rudolph he spent 23 years with ASML in various executive, operational and engineering positions. Most recently he served as Vice President of ASML optics business unit. He received a B.S. in Microelectronic Engineering from Rochester Institute of Technology and a M.B.A. from INSEAD Business School.