04/03/2014  While sometimes seen as a social, legal and regulatory obligation, sustainability is increasingly considered a differentiating factor in global competitiveness relative to the technologies and products being provided.

04/01/2014  SureCore Ltd has today announced that early testing of its innovative low power SRAM design confirms its simulations that deliver in excess of 50 percent power savings over other SRAM technologies.

03/19/2014  Today, GaN on Sapphire is the main stream technology for LED manufacturing. GaN-on-Si technology appeared naturally as an alternative to sapphire to reduce cost.

03/19/2014  Siemens Industry Automation Division and M+W Group have joined forces with the aim to advance the development of production technology for battery manufacturing and develop a complete control technology solution for the mass production of large-size batteries.

03/18/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

03/13/2014  Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

03/04/2014  Silicon Labs today announced the purchase of the full product portfolio and intellectual property of California-based Touchstone Semiconductor Inc.

02/26/2014  Renesas Electronics Corporation today unveiled the RX64M Group of microcontrollers (MCUs), its first product in the flagship RX Family of 32-bit MCUs to be fabricated in a 40nm process.

02/24/2014  International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

02/18/2014  Analysts at ReportsNReports forecast the Global Power Discrete market to grow at a CAGR of 8.43% over the period 2013-2018.

02/12/2014  At this week’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

02/06/2014  The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

01/30/2014  Called the Next Generation Power Electronics Institute, the new consortium will provide shared facilities, equipment and testing to companies from the power electronics industry, focusing and small and medium-sized companies.

01/14/2014  Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

01/14/2014  EV Group today announced that the Fraunhofer Institute for Silicon Technology (ISIT) has purchased an EVG 850TB/DB fully automated bonding/debonding equipment solution.

01/13/2014  It's known that electric vehicles could travel longer distances before needing to charge and more renewable energy could be saved for a rainy day if lithium-sulfur batteries can just overcome a few technical hurdles.

01/10/2014  This week in Las Vegas, the 2014 International Consumer Electronics Show focused on the Internet of Things, displaying many connected gadgets and services.

01/07/2014  Integrated Device Technology, Inc. today announced the industry’s first Qi-compliant single-chip wireless power transmitter solution supporting a 5V input.

12/20/2013  North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.

12/12/2013  A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.