Power Electronics

POWER ELECTRONICS ARTICLES



Osamu Nakamura named President of SEMI Japan

06/03/2014  Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Global semiconductor leaders develop plan to promote worldwide industry growth

05/28/2014  The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.

IEDM announces 2014 Call for Papers

05/28/2014  The 60th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Top 10 power supply vendors vie in tumultuous market; rankings shift for the year

05/21/2014  The global market for AC-DC and DC-DC power supplies rose by a modest 2.4 percent last year, but much of this growth was limited to specific markets, leading to some substantial shifts in the rankings of major players.

ON Semiconductor introduces new family of low voltage power MOSFETs

05/20/2014  ON Semiconductor has introduced a new family of six N-channel MOSFETS that have been designed and optimized to deliver efficiency.

Increase in first quarter 2014 silicon wafer shipments

05/20/2014  Worldwide silicon wafer area shipments increased during the first quarter 2014 when compared to fourth quarter 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SMIC and other groups collaborate to setup the "IC Advanced Technology Research Institute"

05/19/2014  China's, largest and most advanced semiconductor foundry, today announced that SMIC, Wuhan Xinxin, Tsinghua University, Beijing University, Fudan University and the Chinese Academy of Sciences and Microelectronics have collaborated to setup the "IC Advanced Technology Research Institute" to create the most advanced IC technology research and development institution in China.

Domestic outsourcing: A key component in successful reshoring

05/16/2014  After nearly a quarter of a century, the off-shoring manufacturing trend that decimated the U.S. manufacturing sector and played a significant role in the slow pace of the current economic recovery seems to be ending.

Improving financial predictability – is it chasing a mirage?

05/15/2014  There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

New policy helps combat counterfeit semiconductors

05/14/2014  A newly finalized Department of Defense (DoD) rule reduces the risk of counterfeit semiconductor products being used by our military by implementing needed safeguards in the procurement of semiconductors and other electronic parts.

Transphorm obtains exclusive licensing rights to Furukawa Electric's GaN patent portfolio

05/14/2014  Transphorm Inc. today announced that it has obtained a sole worldwide license to Furukawa Electric Co., Ltd.'s extensive Gallium Nitride (GaN) power device portfolio that includes approximately 40 U.S. issued patents and 110 Japanese issued patents.

Element Six's GaN-on-diamond wafers proven to provide three times improvement in power density in RF devices

05/14/2014  Element Six today announced that its Gallium Nitride (GaN)-on-Diamond wafers have been proven by Raytheon Company to significantly outperform industry standard Gallium Nitride-on-Silicon Carbide (GaN-on-SiC) in RF devices.

Mentor Graphics launches MicReD industrial power tester for power cycle testing of electronic components

05/13/2014  Mentor Graphics Corporation today announced the new MicReD Industrial Power Tester 1500A for power cycling and thermal testing of electronics components to simulate and measure lifetime performance.

New low-stress silicone encapsulant from Dow Corning

05/13/2014  Dow Corning today introduced Dow Corning EE-3200 Low-Stress Silicone Encapsulant – the latest addition to its portfolio of advanced solutions designed to expand performance and durability of solar micro-inverters, power optimizers and other high value components.

Dow Corning launches power electronics industry's first SiC wafer grading structure

05/12/2014  Dow Corning today established a higher industry standard for silicon carbide (SiC) crystal quality by introducing a product grading structure that specifies ground-breaking new tolerances on killer device defects, such as micropipe dislocations (MPD), threading screw dislocations (TSD) and basal plane dislocations (BPD).

First quarter semiconductor trends and update

05/08/2014  Given the slow economic growth in the U.S. during the first quarter, coupled with challenging geo-political developments around the world,uncertainty once again permeates the industry outlook for the year.

Julian Styles of GaN Systems elected to board of Power Electronics Industry Collaborative

04/25/2014  GaN Systems, a developer of gallium nitride power switching semiconductors, has announced that Julian Styles, Director of Business Development USA, has been elected to the Board of the Power Electronics Industry Collaborative (PEIC).

SEMI announces 2nd Vietnam Semiconductor Strategy Summit

04/18/2014  Following the successful inaugural event in 2013, the 2nd annual SEMI Vietnam Semiconductor Strategy Summit will be held September 16-17, 2014 at the InterContinental Asiana Saigon Hotel in Ho Chi Minh City.

SEMI announces Innovation Village at SEMICON Europa 2014

04/09/2014  After the successful premier of a program to connect early-stage companies with strategic investors and venture capitalists (VCs) in the U.S., SEMI is expanding the program to Europe as part of SEMICON Europa 2014 in Grenoble, France (October 7-9).

ROHM Semiconductor and imec join forces for ultra-low power radio R&D

04/07/2014  Nanoelectronics research center imec and ROHM Semiconductor Co. Ltd., a world-leading supplier of electronic components, announced today that they have entered into a strategic partnership for research collaboration on ultra-low power (ULP) radio technology for small battery-operated wireless devices.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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