Power Electronics

POWER ELECTRONICS ARTICLES



Power modules get their own upside-down C-SAM system

12/12/2013  Sonoscan has shipped the first of its new D9600Z C-SAM systems. This new model is designed expressly to facilitate the imaging of IGBT (Insulated Gate Bipolar Transistor) power modules.

EU project to industrialize world record high-density capacitors

10/23/2013  CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

Keys to success: Testing in the New Mobile World

01/24/2013  The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

Key market and technology trends in the sub-20nm era

01/24/2013  Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

The shift to materials-enabled 3D

01/24/2013  Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Coming year promises increased capital spending and continued need for effective industry collaboration

01/24/2013  For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

Outlook for semiconductors and the value chain in 2014

01/24/2013  We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

01/24/2013  In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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