02/15/2016  At this week's SPIE Photonics West, imec will present a new set of hyperspectral sensor and camera solutions with extended spectral range, going from the visible light (VIS) up to near infrared (NIR).

02/12/2016  At next week’s SPIE Photonics West 2016, imec will demonstrate a lens-free microscope for large field-of-view live imaging at micrometer resolution.

02/12/2016  Mentor Graphics Corp. has announced that it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.

02/12/2016  University of Washington scientists have successfully combined two different ultra thin semiconductors to make a new two-dimensional heterostructure with potential uses in clean energy and optically-active electronics.

02/11/2016  EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies.

02/11/2016  Renesas Electronics Corp. reported the development of 90nm one-transistor MONOS (1T-MONOS) flash memory technology that can be used in combination with a variety of processes.

02/11/2016  Physicists at the Technical University of Munich (TUM) have developed a nanolaser, a thousand times thinner than a human hair. Thanks to an ingenious process, the nanowire lasers grow right on a silicon chip, making it possible to produce high-performance photonic components cost-effectively. This will pave the way for fast and efficient data processing with light in the future.

02/11/2016  SEMI, the global industry association serving the nano- and micro-electronic manufacturing supply chains, will once again be hosting SEMICON Southeast Asia.

02/11/2016  The FinFET technology market is expected to grow from $4.91 billion USD in 2015 to $35.12 billion by 2022, at a compound annual growth rate (CAGR) of 26.2% between 2016 and 2022.

02/11/2016  Teradyne, Inc. has appointed Gregory Smith as president of the Teradyne semiconductor test division, replacing Mark Jagiela who has been acting division president since 2014.

02/10/2016  An engineering research team at the University of Alberta has invented a new transistor that could revolutionize thin-film electronic devices.

02/10/2016  Worldwide silicon wafer area shipments increased 3 percent in 2015 when compared to 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

02/10/2016  Orbotech Ltd. today announced that, Nippon Mektron Mektec, a maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection (AOI) systems in multiple factories.

02/09/2016  As of December 2015, roughly half of the world’s total IC wafer production capacity was located in seismically active areas.

02/09/2016  How Texas Instruments got greener, safer and saved money.

02/09/2016  SUNY Polytechnic Institute (SUNY Poly) and GLOBALFOUNDRIES today announced the establishment of a new Advanced Patterning and Productivity Center (APPC), which will be located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y.

02/08/2016  SEMICON Russia 2016 on 7-9 June will provide insights into market developments, technology, and business opportunities, short and long-term.

02/08/2016  A novel SACVD PMD invention sets the benchmark for helium reduction efforts by achieving four key objectives: cost reduction, quality, process robustness and productivity.

02/08/2016  A new 5D solution utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.

02/08/2016  TSMC this weekend announced that the earthquake of 6.4 magnitude which struck southern Taiwan at 3:57 am on February 6, 2016 did not cause any serious personnel injuries nor any structural or facility damage to the Company’s Fab 14 and Fab 6 manufacturing sites in the Tainan Science Park.