11/18/2015  CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms.

11/18/2015  A team from Jülich and Aachen has now found a way to control the desired conducting properties of this type of material more precisely and reliably than ever before.

11/18/2015  TowerJazz announced today it has signed an agreement with Maxim Integrated Products, Inc. to purchase Maxim's 8-inch fabrication facility in San Antonio, Texas, United States.

11/18/2015  Novel, chemically precipitated sub-micron silver materials from Ames Goldsmith Corporation will be introduced Nov. 18 at Printed Electronics 2015 in Hall C, Booth R20.

11/17/2015  The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity.

11/17/2015  Due to their exciting properties, 2D crystals like graphene and transition metal dichalcogenides promise to become the material of the future.

11/17/2015  Vacuum technology trends can be seen over the period of innovation defined by Moore’s Law, particularly in the areas of increasing shaft speed, management of pumping power, and the use computer modeling.

11/16/2015  Graphene is the first truly two-dimensional crystal, which was obtained experimentally and investigated regarding its unique chemical and physical properties. There has now been a considerable increase in the number of research studies aimed at finding commercial applications for graphene and other two-dimensional materials.

11/16/2015  Researchers from RMIT University in Melbourne have helped crack the code to ultra-secure telecommunications of the future in an international research project that could also expedite the advent of quantum computing.

11/13/2015  Micron Technology, Inc. this week announced the production of 8GB DDR4 NVDIMM, the company's first commercially available solution in the persistent memory category.

11/13/2015  The theme for the January 27 through 29 exhibition at Seoul’s COEX is “Connect to the Future – Markets, Technology, and People.”

11/13/2015  Systematic – and predictive – cost reduction in semiconductor equipment manufacturing

11/13/2015  The availability of patterning alternatives in the lithography landscape represents a big opportunity to properly address the coming needs generated by the IoT.

11/13/2015  Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

11/13/2015  The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

11/12/2015  Method analyzes non-uniform conductors with a magnetic field.

11/12/2015  The squeaky wheel gets the grease, or so it seems in the semiconductor industry, as the high level of the design process seems to get the most attention. Meanwhile, the transistor level appears to have been largely forgotten.

11/11/2015  Ultratech, Inc. today introduced the Superfast 4G+ in-line, 3D topography inspection system.

11/11/2015  GLOBALFOUNDRIES today announced the availability of FX-14, an ASIC offering built on the company's next-generation 14nm FinFET process technology.

11/11/2015  Gartner, Inc. forecasts that 6.4 billion connected things will be in use worldwide in 2016, up 30 percent from 2015, and will reach 20.8 billion by 2020.