10/19/2015  German chemical company Evonik Industries AG and Japanese FPD production equipment manufacturer SCREEN Finetech Solutions Co., Ltd. have signed a contract for a strategic partnership.

10/19/2015  New solar cell construction extends the cell's effective life in air by more than 10 times, with only a marginal loss of efficiency converting sunlight to electricity.

10/19/2015  Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

10/16/2015  A study published in Advanced Materials Interfaces by the Energy Materials and Surface Sciences Unit at the Okinawa Institute of Science and Technology Graduate University (OIST) reveals a cause for the short lifetime of perovskite solar cells with silver electrodes.

10/16/2015  SEMI announced the lineup of speakers for SEMICON Japan's keynote stage, which focuses on key market and technology challenges and developments, and their impact on the semiconductor supply chain.

10/14/2015  FlexEnable has successfully validated a new class of high performance organic semiconductors in a million pound project funded by Innovate UK.

10/13/2015  VeriSilicon Holdings Co., Ltd. and Vivante Corporation announced a definitive merger agreement.

10/13/2015  Japan has long played a critical role in semiconductor manufacturing and accounts for the largest portion of the global total installed fab capacity in 2015 according to the SEMI Fab database.

10/12/2015  Scientists from the University of Chicago and Penn State University accidentally discovered a new way of using light to draw and erase quantum-mechanical circuits in a unique class of materials called topological insulators.

10/12/2015  According to a new market research report published by MarketsandMarkets, the market is expected to grow at a CAGR of 6.83% between 2015 and 2020, and reach $4.94 Billion by 2020.

10/12/2015  Penn State materials scientists have discovered a way to give the transistor a boost by incorporating vanadium oxide.

10/08/2015  As the push for tinier and faster electronics continues, a new finding by University of British Columbia scientists could help inform the design of the next generation of cheaper, more efficient devices.

10/08/2015  Research reported in the Japanese Journal of Applied Physics by researchers at Mitsubishi Electric Corporation describes the development of a new power module made from a SiC metal-oxide-semiconductor field-effect transistor and a SiC Schottky barrier diode.

10/07/2015  CEA-Leti announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES' 22FDX (TM) technology platform.

10/07/2015  Nano-electronics research center imec and Cadence Design Systems, Inc. today announced that the companies completed the first tapeout of a 5nm test chip using extreme ultraviolet (EUV) and 193 immersion (193i) lithography.

10/07/2015  SEMI announced today that FlexTech Alliance has become the first SEMI Strategic (Association) Partner.

10/06/2015  DCG Systems announced the release of the Meridian M (TM) system for isolation of routine and challenging electrical faults at the wafer level.

10/06/2015  Entegris, Inc. has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper.

10/06/2015  The 2015 market for dielectric precursors is expected to total $230M, of which over $45M is attributed to low-k dielectrics.

10/05/2015  Altatech announced the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies.