Semiconductors

SEMICONDUCTORS ARTICLES



SEMI forecasts three years of growth in chip equipment spending

07/14/2015  SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

Blood and tears at DAC

07/14/2015  At this year’s Design Automation Conference (DAC) in San Francisco, Brian Otis, a Director at Google, talked about how hundreds of millions of people are at risk of diabetes – and how a smart contact lens that continuously monitors blood glucose levels and transmits the data to a smartphone might just be the ideal solution.

ECAE improves sputtering target performance

07/14/2015  Because it can achieve extreme deformation, Equal Channel Angular Extrusion (ECAE) can deliver submicron, high strength and uniform microstructures. The resulting improvements in strength allow for monolithic targets with a longer target life of 20-100%.

Controlling measurements of WLP on high mix, high volume manufacturing

07/14/2015  The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM).

Applied Materials' new etch system provides atomic-level precision

07/13/2015  Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

Genmark Automation launches CODEX Stocker

07/13/2015  Genmark Automation, a developer of tool and factory automation solutions for the semiconductor and related industries, today announced the launch of its new CODEX Stocker.

Imec and Panasonic demonstrate breakthrough RRAM cell

07/13/2015  Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability.

Leti reports FinFET feasibility and circuit design with CoolCube tech

07/13/2015  CEA-Leti today announced its first results towards the demonstration of CoolCube’s feasibility in FinFET technology on its 300mm production line, and new CoolCube circuit designs that improve the trade off between area, speed and power.

GLOBALFOUNDRIES launches industry's first 22nm FD-SOI technology platform

07/13/2015  GLOBALFOUNDRIES today launched a new semiconductor technology developed specifically to meet the ultra-low-power requirements of the next generation of connected devices.

Applied Materials introduces high-performance ALD technology for the 3D era

07/13/2015  Applied Materials, Inc. today unveiled the Applied Olympia ALD system, featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

Substrate innovation for extending Moore and more than Moore

07/10/2015  Engineered SOI substrates are now a mainstream option for the semiconductor industry.

Graphene gets competition

07/09/2015  Graphene, the only one atom thick carbon network, achieved overnight fame with the 2010 Nobel Prize. But now comes competition: Such layers can also be formed by black phosphorous.

Micron Technology names Trevor Schulze as Chief Information Officer

07/09/2015  Micron Technology, Inc. today announced it has appointed Trevor Schulze as Chief Information Officer (CIO).

IoT platform, Silicon Impulse, energy efficiency and consumer applications focus of LetiDays discussion

07/09/2015  Smart devices for the Internet of Things are among the top three growth drivers for the semiconductor industry, but the IoT is a highly fragmented market where multiple applications have varying energy requirements.

IBM Research alliance produces industry's first 7nm node test chips

07/09/2015  IBM Research today announced that working with alliance partners at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functional transistors.

SEMI updates key safety guidelines for semiconductor manufacturing equipment

07/08/2015  SEMI today announced the cornerstone safety Standard S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) will be updated this month.

Could black phosphorus be the next silicon?

07/07/2015  New material could make it possible to pack more transistors on a chip, research suggests.

Down to the quantum dot

07/07/2015  Using a single molecule as a sensor, scientists in Jülich have successfully imaged electric potential fields with unrivalled precision.

EV Group ramps nanoimprint lithography into high-volume manufacturing with HERCULES NIL Track System

07/07/2015  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the HERCULES NIL—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's SmartNIL large-area nanoimprint lithography (NIL) process in a single platform.

Global semiconductor sales increase five percent in May 2015

07/06/2015  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced worldwide sales of semiconductors reached $28.2 billion for the month of May 2015, an increase of 5.1 percent from May 2014, when sales were $26.8 billion.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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