Semiconductors

SEMICONDUCTORS ARTICLES



John Neuffer named president and CEO of SIA

12/11/2014  The Semiconductor Industry Association (SIA) announced that John Neuffer has been named president & CEO of the association.

Entegris launches next generation of 450mm wafer carriers

12/10/2014  Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the release and global availability of their next generation of 450mm wafer carrier solutions (P2) for the safe and reliable transport of 450mm wafers used in semiconductor manufacturing.

Lattice Semiconductor announces appointment of Jeff Richardson to Board of Directors

12/10/2014  Lattice Semiconductor Corporation today announced that its Board of Directors has appointed Jeff Richardson to the company’s Board of Directors and Audit Committee.

OCEASOFT harnesses SIGFOX IoT network in Cobalt S3 sensor family for cloud connectivity

12/09/2014  Industrial Internet of Things sensor-monitoring solution opens new vistas in pollution and environmental applications, other remote-sensing sectors.

Linde appoints new Executive Board members

12/09/2014  The Linde AG Supervisory Board has appointed Dr. Christian Bruch and Bernd Eulitz as new members of its Executive Board with effect from January 1, 2015.

TSMC recognizes outstanding suppliers at Supply Chain Management Forum

12/09/2014  TSMC held its 14th annual Supply Chain Management forum on December 4, 2014 to show appreciation for the support and contributions of its suppliers in 2014, and to recognize nine outstanding equipment and materials suppliers.

SEMI reports third quarter 2014 worldwide semiconductor equipment figures

12/09/2014  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 8.82 billion in the third quarter of 2014.

Crossbar to demonstrate resistive RRAM innovation at IEDM 2014

12/09/2014  Crossbar, Inc., a start-up company pioneering a new category of very high capacity and high-performance non-volatile memory, today announced it will be disclosing another major technology breakthrough in their development of Resistive RAM (RRAM) at next week’s IEEE International Electron Devices Meeting (IEDM).

Veeco completes acquisition of Solid State Equipment Holdings LLC

12/08/2014  Veeco Instruments Inc. announced that it has acquired privately held Solid State Equipment Holdings LLC (“SSEC”), based in Horsham, Pennsylvania.

High photosensitivity 2-D-few-layered molybdenum diselenide phototransistors

12/08/2014  Two-dimensional (2D) layered materials are now attracting a lot of interest due to their unique optoelectronic properties at atomic thicknesses.

ON Semiconductor adds new distribution partners to expand business in Japan and Asia-Pacific

12/04/2014  ON Semiconductor has announced new distribution channel partner agreements with two multi-national electronics trading franchises based in Japan. Ryosan Co., Ltd. and Macnica Inc. join the roster of ON Semiconductor channel sales partners to help expand domestic sales within Japan and work to drive sales growth in China and other Asia-Pacific geographies.

Global semiconductor sales increase in October; Substantial growth projected for 2014

12/03/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $29.7 billion for the month of October 2014, an increase of 9.6 percent from the October 2013 total.

Wireless nanorod-nanotube film enables light stimulation of blind retina

12/03/2014  Breakthrough could lead to artificial retinas for visually impaired. Combining semiconductor nanorods and carbon nanotubes, it could potentially form part of a future prosthetic device that replaces damaged retinal cells.

Imec partners with Huawei on high-bandwidth optical data link technology

12/03/2014  Nanoelectronics research center imec and global ICT leader Huawei announced today that they have taken a further step in their strategic partnership focusing on optical data link technology.

SEMI Industry Strategy Symposium to focus on changing supply chain ecosystem and directions for growth

12/03/2014  Microelectronics industry executives will convene at the SEMI Industry Strategy Symposium (ISS) on January 11-14 to discuss “Riding the Wave of Silicon Magic.”

Cypress and Spansion to merge in $4B all-stock transaction

12/03/2014  Cypress Semiconductor Corp. and Spansion, Inc. this week announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion.

Soitec announces new world record for solar cell efficiency at 46%

12/03/2014  The record multi-junction solar cell converts 46 % of the solar light into electrical energy.

SEMATECH reports significant progress in EUV resist outgas testing

12/03/2014  ?SEMATECH announced today that promising progress has been made in qualifying outgassing specifications for extreme ultraviolet (EUV) lithography.

Semiconductor equipment sales forecast: $38B in 2014 to nearly $44B in 2015

12/02/2014  SEMI projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3 percent to $38.0 billion in 2014, according to the SEMI Year-end Forecast, released today at the annual SEMICON Japan exposition.

SEMICON Korea focuses on breaking through the limitations of semiconductor technology

12/01/2014  Over 500 exhibiting companies from 20 countries and more than 40,000 attendees are expected to attend SEMICON Korea 2015, to be held February 4-6 at COEX in Seoul.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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