Semiconductors

SEMICONDUCTORS ARTICLES



NSF and SRC announce research awards to 10 universities

09/23/2014  The National Science Foundation (NSF) and Semiconductor Research Corporation (SRC) today announced nine research awards to 10 universities totaling nearly $4 million under a joint program focused on Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS).

NANIUM launches the industry’s largest WLCSP in volume production

09/23/2014  NANIUM today announced it has successfully launched the industry’s largest Wafer-Level Chip Scale Package (WLCSP) in volume.

Physicists heat freestanding graphene to control curvature of ripples

09/22/2014  An international team of physicists, led by a research group at the University of Arkansas, has discovered that heating can be used to control the curvature of ripples in freestanding graphene.

NVIDIA unveils Maxwell GPU architecture

09/19/2014  In a major leap forward for gaming, NVIDIA today introduced the first high-end products based on its Maxwell chip architecture -- the new GeForce GTX 980 and 970 GPUs -- delivering unmatched performance, major new graphics capabilities and twice the energy efficiency of the previous generation.

Northeastern University researchers develop novel method for working with nanotubes

09/19/2014  Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

Photonics community celebrates bipartisan passage of Revitalizing American Manufacturing and Innovation Act

09/19/2014  Photonics community leaders including SPIE, the international society for optics and photonics, are celebrating bipartisan passage by the U.S. House of Representatives of a bill designed to stimulate development and commercialization of new technologies and promote growth of high-value jobs.

North American semiconductor equipment industry posts August 2014 book-to-bill ratio of 1.04

09/18/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

ProPlus Design Solutions expands sales operations to Europe

09/18/2014  ProPlus Design Solutions, Inc. announced today it expanded its sales operations to Europe.

EMCORE Corporation announces CEO transition plan

09/18/2014  EMCORE Corporation, a provider of compound semiconductor-based components and subsystems for the fiber optic and space solar power industries, today announced a transition plan of its Chief Executive Officer position in connection with the announced sale of its Space Photovoltaics business.

For electronics beyond silicon, a new contender emerges

09/18/2014  Silicon has few serious competitors as the material of choice in the electronics industry. Yet transistors, the switchable valves that control the flow of electrons in a circuit, cannot simply keep shrinking to meet the needs of powerful, compact devices; physical limitations like energy consumption and heat dissipation are too significant.

Making quantum dots glow brighter

09/18/2014  Ultrathin layers of metal oxides can change the way quantum dots behave, in some cases turning them into more efficient light emitters.

Samsung now mass producing industry’s first 20nm 6Gb LPDDR3 mobile DRAM

09/18/2014  The new mobile memory chip will enable longer battery run-time and faster application loading on large screen mobile devices with higher resolution.

Mentor Graphics appoints Vice President for Embedded Technologies

09/18/2014  Mentor Graphics Corp. today announced the appointment of Glenn Perry to the role of vice president of the company's Embedded Systems Division.

Rudolph introduces new acoustic metrology and defect inspection technology

09/18/2014  Rudolph Technologies has introduced its new SONUS Technology for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs).

SEMI releases second quarter 2014 worldwide PV equipment market statistics report

09/18/2014  Worldwide billings increased to $319 million in Q2 2014, an increase of 33 percent from the prior quarter but 11 percent below the same quarter a year ago.

David Bell joins Triad Semiconductor's Board of Directors

09/17/2014  Triad Semiconductor, Inc. today announced that David B. Bell former President & CEO of Intersil and former President of Linear Technology Corporation was appointed to the company's board of directors.

Veeco Ion Beam Deposition technology reaches significant milestone to support EUV commercialization roadmap

09/17/2014  Veeco Instruments Inc. announced today that its new Odyssey Ion Beam Deposition (IBD) Upgrade for the NEXUS IBD-LDD System has repeatedly produced photomask blanks with zero deposition defects larger than 70nm.

Element Six selected by European Consortium as a partner to develop ultrafast pulse disk lasers

09/16/2014  Element Six today announced it has been selected by the European Commission’s Seventh Framework Programme for Research and Technological Development to help develop a new ultrafast pulse disk laser.

eBeam Initiative Survey indicates new eBeam expectations for photomask production

09/16/2014  Continued semiconductor scaling drives new mask design requirements; use of complex mask shapes predicted to increase

Outlook: Healthy equipment spending into 2015

09/10/2014  The general consensus for the semiconductor industry is for this year’s positive trend to continue into 2015 as both revenue growth and unit shipment growth are expected to be in the mid- to high- single digit range.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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