09/10/2014  It would be difficult to overstate how critical the development of a workable, high volume manufacturing EUV lithography solution is to the semiconductor industry.

09/10/2014  With changes coming in Washington, SEMI has important work ahead supporting the innovators and job creators of this country.

09/10/2014  Capital equipment suppliers must provide advanced analytical systems that leverage data generated by their tools to help their fab customers address the challenges of Big Data and advanced analytics.

09/10/2014  Front End fab equipment spending is projected to increase up to another 20 percent in 2015 to US$ 42 billion.

09/09/2014  Different GS pixel architectures and technologies are presented and performances compared.

09/09/2014  You can’t fix what you can’t find. You can’t control what you can’t measure.

09/09/2014  Fast and predictive 3D resist compact models are needed for OPC applications. A methodology to build such models is described, starting from a 3D bulk image, and including resist interface effects such as diffusion.

09/09/2014  Ziptronix Inc. today announced that its Direct Bond Interconnect (DBI) hybrid bonding has been implemented by Fermi National Accelerator Laboratory (Fermilab) to improve the performance of high-end 3D sensor arrays, which are used for particle detection in large-scale particle physics and x-ray imaging experiments.

09/09/2014  A new company, Epiluvac AB, has entered the scene with the ambition to supply the needed deposition equipment.

09/09/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, today announced the “GLOBALFOUNDRIES Undergraduate Research Scholarship,” a new scholarship recognizing and rewarding aspiring, leadership-oriented engineering students interested in careers in the semiconductor industry.

09/09/2014  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 9.62 billion in the second quarter of 2014.

09/09/2014  Major milestone in longstanding push to remove etch equipment from U.S. export control list.

09/08/2014  The Prophets of Doom greet every new process node with a chorus of dire warnings about the end of scaling, catastrophic thermal effects, parasitics run amok and . . . you know the rest.

09/08/2014  Lithography is a key enabling process with very demanding requirements. Shrinking feature sizes will raise the bar even further.

09/08/2014  Researchers from Empa and the Max Planck Institute for Polymer Research have now developed a new method to selectively dope graphene molecules with nitrogen atoms.

09/08/2014  Sandwiching layers of graphene with white graphene could produce designer materials capable of creating high-frequency electronic devices, University of Manchester scientists have found.

09/08/2014  Cree, Inc. has announced that its C2M, 1200V, 80mOhm SiC MOSFETs have been selected by Sanix Corporation, Japan, to be designed into their new 9.9kW three-phase solar inverters for use in the construction of commercial photovoltaic systems in the fast-growing Japanese solar energy market.

09/08/2014  Spending on microwave RF power semiconductors continues to tick upward as the availability of new gallium nitride (GaN) devices for 4 to 18GHz becomes more pervasive.

09/05/2014  eSilicon Corporation, an independent semiconductor design and manufacturing solutions provider, today announced the addition of two foundries -- Altis Semiconductor and TSI Semiconductor -- to its automated, instant online quote system for multi-project wafer (MPW) shuttles.

09/05/2014  Sidense Corp., a developer of non-volatile memory OTP IP cores, today announced that it successfully demonstrated read and write capability for its 1T-OTP bit-cell architecture on test silicon fabricated in a 16nm CMOS FinFET process.