09/05/2014  RF Micro Devices, Inc. today announced the preliminary results of its special meeting of shareholders held earlier this morning to approve its agreement and plan of merger and reorganization with TriQuint Semiconductor, Inc.

09/05/2014  Ongoing growth in cellular and Wi-Fi applications will continue to drive GaAs device revenues higher.

09/04/2014  Move over, graphene. An atomically thin, two-dimensional, ultrasensitive semiconductor material for biosensing developed by researchers at UC Santa Barbara promises to push the boundaries of biosensing technology in many fields, from health care to environmental protection to forensic industries.

09/04/2014  GLOBALFOUNDRIES, a provider of advanced semiconductor manufacturing technology, announced today that Louis “Lou” Lupin has joined the company as senior vice president and chief legal officer.

09/04/2014  Contour Semiconductor, Inc., a developer of non-volatile memory technologies, today announced it has been awarded three new patents to back its Diode Transistor Memory (DTM) technology, the world's lowest production-cost, non-volatile memory technology.

09/04/2014  Fujitsu Semiconductor America (FSA) today announced that Shinichi "James" Machida, who led the company from late 2008 until spring of 2011, has been named as the new president and CEO of FSA.

09/03/2014  ProPlus Design Solutions, Inc. today announced Samsung Electronics has extended its partnership with ProPlus through the deployment of ProPlus' BSIMProPlus modeling platform for its 14-nanometer (nm) FinFET SPICE modeling.

09/03/2014  Credo Semiconductor today announced the appointment of Jeff Twombly as vice president of sales and business development.

09/03/2014  Edwards Limited announced today that it has marked an important milestone with the shipment of its 1,000th EZENITH integrated vacuum and exhaust management system, which will ship to a US-based semiconductor manufacturing fab in October 2014.

09/03/2014  Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $24 billion in the next two years on equipment and materials, powering excitement for SEMICON Taiwan 2014, which opened today in Taipei.

09/02/2014  Electronic circuits are based on electrons, but one of the most promising technologies for future quantum circuits are photonic circuits, i.e. circuits based on light (photons) instead of electrons.

09/02/2014  Following a second consecutive quarter of softer than expected demand, International Data Corporation (IDC) has lowered its worldwide tablet plus 2-in-1 forecast for 2014 to 233.1 million units.

09/02/2014  Rudolph Technologies, Inc. announced today that the SUNY College of Nanoscale Science and Engineering (CNSE), Albany, NY, has selected its Discover Enterprise Yield Management Software (YMS) to provide an integrated data warehouse and analytics system for the Global 450 Consortium (G450C) equipment development program.

09/02/2014  MEI Wet Processing Systems and Services revealed performance data today on its newly released Cu & TiW Critical Etch System for compound semiconductor manufacturing.

09/02/2014  Although operators will continue to face strong international competition, new opportunities in next-generation semiconductors and electronic inputs will encourage operators to invest in product development.

09/01/2014  Hopes remain high for EUV, but long delays has caused attention to shift to various alternatives.

09/01/2014  IBM’s NXE3300B scanner, at the EUV Center of Excellence in Albany, recently completed a “40W” EUV light source upgrade.

08/29/2014  United Microelectronics Corporation and Fujitsu Semiconductor Limited today announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300mm wafer manufacturing facility located in Kuwana, Mie, Japan.

08/29/2014  Bend them, stretch them, twist them, fold them: modern materials that are light, flexible and highly conductive have extraordinary technological potential, whether as artificial skin or electronic paper.

08/29/2014  An international team of scientists including physicist Jairo Sinova from the University of Mainz realises a tunable spin-charge converter made of GaAs.