Semiconductors

SEMICONDUCTORS ARTICLES



2D transistors promise a faster electronics future

06/03/2014  Faster electronic device architectures are in the offing with the unveiling of the world’s first fully two-dimensional field-effect transistor (FET) by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab).

Synopsys and Intel collaborate on 14nm Tri-Gate design platform

06/03/2014  Synopsys, Inc. and Intel Corporation today announced broad SoC design enablement for Intel's 14nm Tri-Gate process technology for use by customers of Intel Custom Foundry.

Plasma-Therm ranked first in customer satisfaction

06/03/2014  Plasma-Therm, a global provider of semiconductor equipment, has again been ranked number one in an independent survey of customers, the company announced today.

Georgia Tech research develops physics-based spintronic interconnect modeling for beyond-CMOS computing

06/03/2014  Georgia Institute of Technology researchers collaborating with and sponsored by Intel Corporation through the Semiconductor Research Corporation (SRC) have developed a physics-based modeling platform that advances spintronics interconnect research for beyond-CMOS computing.

Osamu Nakamura named President of SEMI Japan

06/03/2014  Nakamura will succeed Yoichi Nakagawa, who is retiring from SEMI.

Samsung's 14nm finFET process technology ecosystem solidly in place for mobile consumer and SoC applications

06/02/2014  Samsung today announced that the IP and design enablement ecosystem for its foundry’s 14nm FinFET process technology is firmly in place as customers begin their early design work.

Critical test issues up for debate at Test Vision 2020

06/02/2014  Test professionals who want to learn, forecast and debate the future of semiconductor test will attend the 7th annual IEEE Test Vision 2020 Workshop, held in conjunction with SEMICON West 2014 (July 8-10) in San Francisco.

New cost-effective nanoimprint lithography methodology improves ordering in periodic arrays from block copolymers

06/02/2014  A work led by the Institut Català de Nanociència i Nanotecnologia (ICN2) Phononic and Photonic Nanostructures Group suggests a new method to produce hexagonal periodic arrays with high fidelity while reducing time and costs.

ams wins patent validity lawsuit launched by Melexis

05/29/2014  ams, a manufacturer of high performance sensor and analog solutions, announces that the company has won a last-instance verdict against Melexis.

Noel Technologies names Siavash Parsa Director of Technology

05/29/2014  Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Siavash Parsa to its growing management staff.

NanGate releases 15nm open source digital cell library

05/29/2014  NanGate, Inc. – a provider of design-specific standard cell library IP and EDA tools for layout automation – announced that it has released the first edition of a new 15nm open cell library (OCL).

Down to 5nm: Scaling with the usual suspects - performance, cost

05/29/2014  The semiconductor industry never lacks for challenges and/or controversy as it forges ahead from one technology node to the next.

Global semiconductor leaders develop plan to promote worldwide industry growth

05/28/2014  The Semiconductor Industry Association (SIA) today announced that global semiconductor industry leaders reached an agreement at the 18th annual meeting of the World Semiconductor Council (WSC) last week on a series of policy proposals to strengthen the industry through international cooperation.

IEDM announces 2014 Call for Papers

05/28/2014  The 60th annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

Strategic investors to connect with startups at SEMICON West event; Bob Metcalfe to keynote

05/28/2014  SEMI today announced that SEMICON West 2014 will feature Bob Metcalfe, professor at the University of Texas at Austin, as the Silicon Innovation Forum’s keynote speaker.

Amkor and Carsem announce patent infringement settlement

05/28/2014  Amkor Technology, Inc. and Carsem today jointly announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor's MicroLeadFrame (MLF) patents.

ams reaches out to Chinese engineering community with new micro-site

05/27/2014  ams AG, a provider of high performance analog ICs and sensors, has launched a new micro-site in China in an initiative designed to provide a more direct channel for communication with China's one million-strong electronic design and engineering community.

Penn research combines graphene and painkiller receptor into scalable chemical sensor

05/27/2014  Researchers from the University of Pennsylvania have led an effort to create an artificial chemical sensor based on one of the human body's most important receptors, one that is critical in the action of painkillers and anesthetics..

UT Dallas team creates flexible electronics that change shape inside body

05/27/2014  Transistors maintain electrical properties after implantation.

Intel to collaborate with Rockchip

05/27/2014  Intel Corporation today announced it has entered into a strategic agreement with Rockchip to expand the breadth of and accelerate the rate at which it brings its Intel architecture and communications-based solutions to market for a range of entry-level Android tablets worldwide.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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