03/20/2014  Applied Materials, Inc. today announced that it was named a 2014 World's Most Ethical Company by the Ethisphere Institute, an independent center of research promoting best practices in corporate ethics and governance.

03/19/2014  Synopsys, Inc. today announced that MediaTek Inc., a fabless semiconductor company for wireless communications and digital multimedia solutions, has initiated deployment of Synopsys' IC Compiler place and route solution for hierarchical design implementation.

03/19/2014  Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC presented the SEMICON China 2014 opening keynote yesterday and was given a SEMI Outstanding EHS Achievement Award.

03/19/2014  Research from University of California, Berkeley scientists sponsored by Semiconductor Research Corporation (SRC) promises to revolutionize portable radio frequency (RF) electronics and communication systems via advancements in on-chip inductors by leveraging embedded nanomagnets.

03/18/2014  To meet the increasing demand for smaller, faster, and more powerful devices, a continued decrease in the dimensions of active parts of devices is required. The new methodology is a unique tool developed to address the gap existent in the metrology of sub-10nm line patterns.

03/18/2014  MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, today announced it has agreed to purchase the assets of Granville-Phillips, a division of Brooks Automation, Inc., for $87 million in cash.

03/18/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has opened a new, wholly owned subsidiary in Shanghai, called EV Group China Ltd.

03/17/2014  GaN Systems, a developer of gallium nitride power switching semiconductors, today announced the appointment of Jim Witham as CEO of the corporation.

03/17/2014  Mega Fluid Systems Inc., a supplier of chemical and slurry delivery equipment, and Entrepix Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced a partnership agreement.

03/14/2014  Researchers have discovered that creating a graphene-copper-graphene “sandwich” strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.

03/14/2014  With anticipated economic limits to the continuation of Moore’s Law now on the horizon, it seems that moving into the 3rd dimension (3D) by stacking multiple layers of integrated circuits (IC) will be the ultimate expression of CMOS technology.

03/14/2014  Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.

03/14/2014  Toshiba Corporation announced that it has brought a civil suit against Korea’s SK Hynix Inc. at the Tokyo District Court, under Japan’s Unfair Competition Prevention Act.

03/13/2014  Coordinated by SEMI, the Silicon Innovation Forum is organized by leading strategic investment groups in the global semiconductor industry including: Applied Ventures, Dow Ventures, Intel Capital, Micron Ventures, TEL Venture Capital, BASF Ventures, and Samsung Ventures.

03/13/2014  These actions relate to the theft of trade secrets related to NAND flash technology by a former engineer of SanDisk who left the company in 2008 to work for SK Hynix.

03/12/2014  In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

03/12/2014  The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, New York.

03/12/2014  On May 13-15, the key industry players, science institutes and innovation business representatives will gather in Moscow at SEMICON Russia — the premier Russian semiconductor exhibition and conference.

03/12/2014  EV Group today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.

03/12/2014  STATS ChipPAC, a provider of advanced semiconductor packaging and test services, has designed and implemented an innovative new manufacturing method that is a significant paradigm shift from conventional wafer level manufacturing.