Semiconductors

SEMICONDUCTORS ARTICLES



SPTS Technologies opens new office in Korea

02/13/2014  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets today announced the opening of a new office in Korea.

ROHM Semiconductor's operational amplifiers for sensor signal amplification

02/13/2014  ROHM Semiconductor today introduced the development of the BD5291G and the BD5291FVE low voltage, low offset operational amplifiers (opamp) designed to amplify signals from motion sensors such as accelerometers and gyroscopes.

Imec and Holst Centre demonstrate low-power ECG-acquisition chip at ISSCC 2014

02/12/2014  At this week’s International Solid State Circuits Conference (ISSCC2014), imec and Holst Centre, together with Olympus, demonstrated a low-power single channel implantable electrocardiography (ECG) acquisition chip with analog feature extraction, which enables precise monitoring of the signal activity in a selected frequency band.

Fujitsu Labs and imec develop wireless transceiver technology for medical devices

02/12/2014  Fujitsu Laboratories Ltd. and imec Holst Centre today announced that they have developed a wireless transceiver circuit for use in body area networks (BAN) for medical applications that adheres to the 400 MHz-band international standard.

Intermolecular and Guardian Industries expand collaboration

02/11/2014  Intermolecular, Inc. and Guardian Industries announced today the expansion and extension of their collaborative development program and strategic IP licensing agreement.

Rudolph announces shipments for 3D metrology of TSVs

02/11/2014  Rudolph Technologies, Inc. announced today the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a research organization based in Grenoble, France.

Chips that listen to bacteria

02/11/2014  A research team led by Ken Shepard, professor of electrical engineering and biomedical engineering at Columbia Engineering, and Lars Dietrich, assistant professor of biological sciences at Columbia University, has demonstrated that integrated circuit technology, the basis of modern computers and communications devices, can be used for a most unusual application—the study of signaling in bacterial colonies.

Silicon wafer revenues decline in 2013

02/11/2014  Worldwide silicon wafer revenues declined by 13 percent in 2013 compared to 2012 according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

EV Group unveils high-volume manufacturing photoresist processing system

02/11/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its most advanced 300-mm photoresist processing system for logic and memory high-volume manufacturing.

IBM continues to evolve: Semiconductor business up for sale; moving into the cloud

02/07/2014  The Financial Times (FT) is reporting that IBM Corp is exploring the sale of its semiconductor business and has hired Goldman Sachs to find potential buyers.

A square peg in a round hole: The economics of panel-based lithography for advanced packaging

02/07/2014  Moving from round wafers to rectangular panels saves corner space, delivering a roughly 10% improvement in surface utilization.

The impact on OPC and SRAF caused by EUV shadowing effect

02/07/2014  EUV’s off-axis mask illumination introduces a special problem in EUV OPC – the shadowing effect.

Executives debate innovation drivers and cost reduction in microelectronics supply chain

02/06/2014  The closing Executive Panel discussion at the SEMI Industry Strategy Symposium on January 15 provoked diverse views on the drivers and future of innovation in the microelectronics manufacturing supply chain.

Silicon reclaim wafer market increased 14% in 2013

02/06/2014  The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

The 2014 European 2.5/3DIC Summit

02/06/2014  SEMI’s second annual European 3D TSV Summit was held in Grenoble in late January. Three hundred and twenty attendees met to discuss the status of 2.5/3DIC and other advanced packaging technologies.

Intel elects five new corporate vice presidents

02/06/2014  Intel Corporation today announced that its board of directors elected five new corporate vice presidents.

Ballistic transport in graphene suggests new type of electronic device

02/06/2014  Using electrons more like photons could provide the foundation for a new type of electronic device that would capitalize on the ability of graphene to carry electrons with almost no resistance even at room temperature – a property known as ballistic transport.

New theory may lead to more efficient solar cells

02/04/2014  A new theoretical model developed by professors at the University of Houston (UH) and Université de Montréal may hold the key to methods for developing better materials for solar cells.

Diamond defects boosts quantum technology

02/04/2014  New research shows that a remarkable defect in synthetic diamond produced by chemical vapor deposition allows researchers to measure, witness, and potentially manipulate electrons in a manner that could lead to new "quantum technology" for information processing.

Entegris to acquire ATMI

02/04/2014  Entegris, Inc. and ATMI today announced Entegris will acquire ATMI for approximately $1.15 billion, or approximately $850 million net of cash acquired, including the net cash proceeds from the sale of ATMI’s LifeSciences business of $170 million.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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