02/03/2014  Element Six, a developer of synthetic diamond supermaterials and member of the De Beers Group of Companies, today presented new data and announced that its high purity single crystal chemical vapor deposition (CVD) diamond material has been proven for use in intracavity cooling of disc lasers and in development of the first ever tunable diamond Raman laser system.

02/03/2014  Zhihong Liu, Executive Chairman, ProPlus Design Solutions, Inc., San Jose, Calif. blogs on how the industry's move to FinFETs is impacting design.

02/03/2014  Ira Feldman blogs about the recent 2014 SEMI Industry Strategy Symposium (ISS).

01/31/2014  With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

01/31/2014  Achievements prove diamond’s viability as a material for solid-state laser engineering, even in the most demanding intracavity applications.

01/30/2014  Called the Next Generation Power Electronics Institute, the new consortium will provide shared facilities, equipment and testing to companies from the power electronics industry, focusing and small and medium-sized companies.

01/29/2014  Crocus Technology today announces it has licensed its Magnetic Logic Unit technology to ARM.

01/28/2014  Researchers with the U.S. Department of Energy (DOE)’s Lawrence Berkeley National Laboratory (Berkeley Lab) have developed a “process friendly” technique that would enable the cooling of microprocessor chips through carbon nanotubes.

01/28/2014  David G. Slimpin has been promoted to director of the Electronics Systems and Robotics Department in the Applied Physics Division at Southwest Research Institute (SwRI). He was previously a program manager in the department.

01/27/2014  Mobile PCs and smartphones will represent the top revenue opportunities for high-speed wireless integrated circuit (IC) suppliers by 2018, as these devices are projected to be the highest-volume applications in this market over the next five years.

01/27/2014  Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

01/27/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate processes.

01/27/2014  At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy.

01/24/2014  The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

01/23/2014  Synthetic diamond is ideally suited for thermal management of semiconductor packaging, as it combines exceptionally high thermal conductivity with electrical isolation.

01/23/2014  Improving economic competitiveness through cost reduction, cycle time improvement and more eco-friendly processing.

01/23/2014  A new plasma-enhanced atomic layer etch method delivers atomic-level etch precision with process times that are practical for use in a manufacturing environment.

01/23/2014  In addition to extending the fin-based design investments, augmenting the FinFET for improved performance allows an evolution of the process infrastructure for a few more nodes.

01/23/2014  The development of an 85µm diameter, 100µm deep SiC back-side via etch process for production is described.