11/07/2013  Efforts make embedded memory faster, cooler and simpler.

11/07/2013  Global semiconductor capital equipment manufacturer OEM Group, Inc. announced the opening of its new Sales and Service Center in Yokohama, Japan.

11/07/2013  SEMI, the global trade organization representing the nano- and micro-electronic manufacturing supply chains, today announced that next year’s Plastic Electronics Conference (PE2014) will be held in Grenoble, France and alternate with Dresden, Germany in future years to better address pan-European opportunities and challenges in Plastic Electronics.

11/07/2013  Development of voltage-tunable radio frequency inductors boosts semiconductor and defense industry applications.

11/07/2013  Fabless semiconductor company DecaWave announced today its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before.

11/07/2013  SK Hynix, MediaTek, Micron, and Qualcomm each forecast to show ?30% year-over-year growth.

11/05/2013  Clearly Moore's law is about cost, and Gordon Moore’s observation was that the optimum number of components (nowadays - transistors) to achieve minimum cost will double every year.

11/05/2013  Technology achievement marks significant step towards monolithic heterogeneous integration and non-silicon devices.

11/01/2013  Rubicon Technology announced the launch of the first commercial line of large diameter patterned sapphire substrates (PSS) in four-inch through eight-inch diameters.

11/01/2013  Columbia Engineers develop new device architecture for 2D materials, making electrical contact from the 1D edge.

11/01/2013  UPV/EHU-University of the Basque Country researchers have developed and patented a new source of light emitter based on boron nitride nanotubes and suitable for developing high-efficiency optoelectronic devices.

11/01/2013  SMT equipment market continues to derive demand from major downstream industry segments including telecommunications, computing and consumer appliances, which are the most prolific users of PCBs, according to a new report from Global Industry Analysts, Inc.

11/01/2013  Peregrine Semiconductor and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies.

10/31/2013  Toshiba Corporation today announced the launch of new embedded NAND flash memory modules integrating NAND chips fabricated with 19nm second generation process technology.

10/31/2013  In either a cautious or a more aggressive scenario, LED applications will certainly be the key drivers for the bulk GaN market, according to Yole Développement.

10/30/2013  Results can depend on the properties of the wafers used, the conditions of the implant, the conditions of the anneal process, and even the measurement technique.

10/30/2013  The move to 4500mm wafers will likely result in gas flow increased on process vacuum and abatement equipment.

10/30/2013  The next major roadblock to progress in the ongoing push to develop EUV lithography for volume production is the availability of defect-free mask blanks.

10/30/2013  3D atomic force microscopes can measure critical dimensions, line edge roughness and sidewall roughness in a way that is highly accurate, non-destructive and cost-effective.

10/30/2013  The choice between buying new systems from OEMs or fully capable refurbished gear from qualified used equipment vendors is examined.