Semiconductors

SEMICONDUCTORS ARTICLES



Samsung starts mass producing industry’s first 3D vertical NAND flash

08/06/2013 

New technology represents a breakthrough in overcoming NAND scaling limit and ushers in a new 3D memory era.

STI Certified Electronics appoints new VP of business development

08/06/2013 

STI Certified Electronics announced the appointment of Jim Panfil as Vice President of Business Development.

Ultratech/Cambridge NanoTech expands operations

08/05/2013 

Ultratech, Inc. announced last week that it has moved Ultratech/Cambridge NanoTech to Waltham, Mass.

Graphene sees explosive demand in a variety of industries

08/05/2013 

Graphene has moved swiftly from the research laboratory to the marketplace, driven by demand from markets where advanced materials are required.

Crossbar unveils resistive RAM with simple, three-layer structure

08/05/2013 

Crossbar, Inc., a start-up company, unveiled a new Resistive RAM (RRAM) technology that will be capable of storing up to one terabyte (TB) of data on a single 200mm2 chip.

Understanding interface properties of graphene paves way for new applications

08/05/2013 

Researchers from North Carolina State University and the University of Texas have revealed more about graphene's mechanical properties and demonstrated a technique to improve the stretchability of graphene – developments that should help engineers and designers come up with new technologies that make use of the material.

Analyst: Image sensors market in U.S. will reach USD 3.7 billion in 2017

08/05/2013 

The U.S. image sensors market was worth USD 2.0 billion in 2011 and is forecasted to reach USD 3.7 billion in 2017 at a CAGR of 11.1 percent from 2011 to 2017.

Spansion and XMC announce licensing agreement

08/02/2013 

Spansion Inc., a developer of Flash memory-based embedded systems solutions, and XMC, China's fastest growing 300mm semiconductor foundry, today announced an agreement for XMC to license Spansion's floating gate NOR Flash technology.

Spansion completes acquisition of Fujitsu’s microcontroller and analog business

08/01/2013 

Spansion Inc., a provider of Flash memory-based embedded systems solutions, today announced that it has closed the acquisition of the microcontroller and analog business of Fujitsu Semiconductor Limited.

Apple confirms acquisition of Passif Semiconductor

08/01/2013 

Apple recently acquired Silicon Valley-based wireless chip developer Passif Semiconductor, though the terms of the acquisition have yet to be disclosed.

Micron and Elpida announce closing of sponsor agreement transactions

08/01/2013 

Micron Technology, Inc. and Elpida Memory, Inc. trustees announced today the closing of Micron’s acquisition of 100 percent of Elpida’s equity, pursuant to a Sponsor Agreement entered into on July 2, 2012 in connection with Elpida's corporate reorganization.

EUV vs TSV: Which one will become production ready first?

07/31/2013 

Israel Beinglass, CTO of MonolithIC 3D Inc., blogs about roadmap misses and the relationship between two seemingly unrelated technologies. 

IDC forecasts worldwide semiconductor revenue will grow 6.9% in 2013

07/30/2013 

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

Spansion announces new family of flash memory devices

07/26/2013 

Spansion Inc. today announced production of a new family of 16 Mb, 32 Mb and 64 Mb Spansion FL-1K Serial Flash memory devices.

Samsung now mass producing industry’s fastest embedded memory

07/26/2013 

Samsung announced today that it is mass producing the world’s fastest embedded memory – the industry’s first eMMC 5.0 devices – in 16 gigabyte (GB), 32GB and 64GB densities for next-generation smartphones and tablets.

Rudolph announces new metrology suite for advanced packaging

07/24/2013 

Rudolph Technologies, Inc., a provider of process characterization, photolithography equipment and software for the semiconductor, FPD, LED and solar industries, today released three new application-specific configurations of its industry-leading NSX 320 Automated Macro Defect Inspection System.

Foreign IC companies to represent 70% of China’s IC production in 2017

07/24/2013 

China’s total IC production is forecast to represent only 6% of the worldwide IC market in 2017.

Rebirth of mask process correction for better wafer lithography

07/24/2013 

Who knew that mask process correction (MPC) would again become necessary for the manufacturing of deep ultraviolet (DUV) photomasks?

Dialog Semiconductor announces Richard Beyer as new chairman of the board

07/23/2013 

Dialog Semiconductor plc, a provider of highly integrated power management, audio, AC/DC and short-range wireless technologies today announced that Richard Beyer, appointed to the board in February this year, as an independent non-executive director, will succeed Gregorio Reyes as chairman of the board. Greg will continue to serve as a board member.

OEM chip spending returns to growth in 2013

07/22/2013 

After a flat year in 2012, global purchasing of semiconductors by the world’s top electronic brands is set to return to growth in 2013, as Apple Inc. and Samsung Electronics contend to claim the title of biggest spender.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts