07/19/2013 

North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in June 2013 (three-month average basis) and a book-to-bill ratio of 1.10.

07/18/2013 

A variety of techniques and materials have been developed to successfully achieve bonding/debonding for 3D integration, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated.

07/18/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about an ASML presentation from Semicon West. This is a follow up to a previous post: "Dimensional Scaling and the SRAM Bit-Cell."

07/18/2013 

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.

07/17/2013 

Engineering samples of The Hybrid Memory Cube (HMC) are expected this summer, with high volume manufacturing coming next year. It will be one of the first high volume devices employing 3D integration and through silicon vias (TSVs), employing a bottom logic layer and 4-8 stacked DRAM layers.

07/16/2013 

42 percent increase in 2Q13 followed 22 percent gain in 1Q13.  DRAM ASPs to reach levels last seen in 4Q10.

07/16/2013 

World’s smallest semiconductor process node will feed the storage demands of consumer applications and data centers.

07/16/2013 

Researchers sponsored by Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, today announced that they have developed a more efficient purge technique that reduces the consumption of ultra-high purity (UHP) purge gases by more than 20 percent during the production of semiconductors.

07/15/2013 

SEMATECH's Mark Neisser provided a sobering overview of the challenges associated with extending Lithography technology to pattern device structures below a half-pitch of 20nm.

07/15/2013 

In the afternoon of the last day of SEMICON/West 2013, a session was devoted to updates from the International Technology Roadmap for Semiconductors (ITRS) Front End of Line Technologies.

07/11/2013 

cyberTECHNOLOGIES GmbH announced the addition of White-Light Interferometry (WLI) to its suite of production-proven CT SERIES non-contact surface metrology systems at SEMICON West 2013.

07/11/2013 

At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.

07/10/2013 

Leaders of research consortia from around the world sat down to share updates and insights with SEMICON West attendees on Wednesday morning.

07/10/2013 

Dr. Tedesco suggested that an “optical forever” solution using 193nm immersion lithography in combination with a pitch-multiplication strategy could well provide lithography solutions to very advanced nodes on the industry’s technology roadmap.

07/10/2013 

SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.

07/09/2013 

When Ajit Manocha, GlobalFoundries CEO, polled his audience during his keynote address on Tuesday at SEMICON West 2013, nearly 60 percent of the audience believed that the biggest challenge facing the semiconductor industry was the economy. However, during his presentation, Manocha seemed to suggest otherwise.

07/09/2013 

CEA-Leti said today that its multi-partner programs, IDEAL and IMAGINE, have demonstrated cost-effective solutions that extend 193nm immersion lithography for 1X nodes for critical levels such as contact and via, and for the cut layer, when multi-patterning is used.

07/09/2013 

At SEMICON West 2013, Element Six today announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year.

07/09/2013 

New method allows IC manufacturers to reach scaling levels at 20nm and beyond, without compromising speed and device cross-talk.

07/09/2013 

EV Group (EVG), a  supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG40NT automated measurement system.