02/06/2013 

Dr. Steffen Schulz discusses the role of a flexible platform for computational lithography in a successful business strategy.

02/06/2013 

Dow Electronic Materials launched the first pads from its new IKONIC 2000 and IKONIC 3000 polishing pad series.

02/06/2013 

SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.

02/05/2013 

Global NAND flash memory market revenue fell 7 percent in 2012 as disappointing Ultrabook sales negated the impact of surging demand from Apple Inc. for its iPhone line, according to an IHS iSuppli Data Flash Market Tracker Report from information and analytics provider IHS (NYSE: IHS).

02/05/2013 

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.

02/01/2013 

Scientists at RTI International are advancing the state of science in electronic devices for optical systems by using superlattice structures to optimize the performance of germanium optical detectors on silicon chips.

01/31/2013 

C. Grant Willson and Jean M.J. Fréchet won the Japan Prize, an international award similar to the Nobel Prize, for their work on chemically amplified resists. 

01/30/2013 

KLA-Tencor Corporation (NASDAQ: KLAC) announced the eS805, a new electron-beam inspection system capable of detecting very small defects, and defects that cause electrical problems.

01/30/2013 

The Global Semiconductor Alliance (GSA) announced the appointment of three new members to the GSA Board of Directors.

01/30/2013 

SEMI announced that Joung Cho (JC) Kim, chairman, Edwards Korea Limited, is the recipient of the 14th annual SEMI Sales and Marketing Excellence Award.

01/29/2013 

Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about dealing with increased random variations and layout-dependent effects.

01/29/2013 

Newport Corporation introduced long-lived deep ultraviolet (UV) excimer laser mirrors with projected lifetimes greater than 30 billion pulses.

01/29/2013 

Cadence Design Systems, Inc. announced the availability of Virtuoso® Advanced Node, a new set of custom/analog capabilities designed for the advanced technology nodes of 20nm and below.

01/29/2013 

ProPlus Design Solutions announced it is shipping a new wafer-level, 1/f noise measurement system. Increasingly, circuit designers are interested in 1/f noise data at higher frequencies.

01/25/2013 

A particle as small as three microns in diameter, attached to the back side of the wafer—the dark side, if you will—can cause yield-limiting defects on the front side of the wafer during patterning of a critical layer.

01/25/2013 

Given the ascension of smartphones, it's no surprise that Samsung and Apple remain far and away the biggest end-users of semiconductors, and are widening their lead on the rest of the field, according to the latest Gartner rankings.

01/24/2013  The semiconductor industry is moving from a PC-centric, digital era to a communication and mobile world.

01/24/2013  Keeping up with Moore’s Law has always required significant investment and ingenuity, and this era brings additional challenges in device structures, materials and methodologies.

01/24/2013  For almost five decades, performance improvements and cost reduction of ICs have been cornerstones of the growth of the semiconductor industry.

01/24/2013  As far as the outlook goes for 2014-2015, investments coming from the semiconductor and microelectronics industries are going to be pretty robust.