Semiconductors

SEMICONDUCTORS ARTICLES



The shift to materials-enabled 3D

01/24/2013  Innovations in mobile computing and communications will continue to be a driving factor for the semiconductor equipment industry.

Coming year promises increased capital spending and continued need for effective industry collaboration

01/24/2013  For most of the past 15 years, the industry has displayed a fairly predictable pattern of fab equipment spending, characterized generally by two years of decline followed by two years of positive growth.

Outlook for semiconductors and the value chain in 2014

01/24/2013  We approach 2014 with a combination of positive policy, financial, and economic forces that will push world growth up to a +3% range.

Cyclical upturn continues in 2014: Positive yet cautious expectations persist

01/24/2013  In 2013, the IC industry emerged from a difficult 5-year period of minimal growth and started on its next cyclical upturn, a welcome piece of news.

MEMS microphones surge, thanks to Apple

01/23/2013 

The market for MEMS microphones has nearly quintupled in just the past three years, topping a projected 2 billion shipments in 2012, thanks mainly for capabilities the technology enables in high-end smartphones, according to IHS iSuppli.

Novati to use Ziptronix bonding tech for 3D assembly

01/18/2013 

Novati Technologies Inc. has licensed Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), to offer 3D stacking services and test to customers.

LED manufacturing investment declines as industry contemplates future directions

01/18/2013 

Spending on LED fab manufacturing equipment will decline 9.2% in 2013 as the industry faces weak long-term demand and consolidates manufacturing capacity.

Samsung grabs No.3 foundry spot on smartphone dominance

01/17/2013 

In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ranks again in 2012 thanks to its ubiquity in smart phone technology, according to updated rankings by IC Insights.

IBM team wins Feynman Prize for scanning probe microscopy

01/17/2013 

IBM Researchers won the prestigious Feynman prize given by the Foresight Group. The team was the first to produce images detailed enough to identify the structure of individual molecules, as well as metal-molecule complexes.

SRC, DARPA unveil university research center network

01/17/2013 

Semiconductor Research Corporation (SRC) and the Defense Advanced Research Projects Agency (DARPA) announced that $194 million will be dedicated during the next five years to STARnet, which encompasses six new university microelectronics research centers.

ISS 2013: Semiconductor leaders see massive industry transformation

01/15/2013 

The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).

CES: Phablets and table PCs break the PC mold

01/11/2013 

Among the usual confluences of useful and cool gadgets (not to mention bizarre) at this week's annual Consumer Electronics Show in Las Vegas, two types of devices with new formfactors aimed to rethink the PC model.

GlobalFoundries adding R&D facility to NY fab campus

01/11/2013 

GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing:  EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."

By the numbers: The rise of fabless IC sales, 1999-2010 and beyond

01/10/2013 

Fabless IC suppliers saw sales rise 6% in 2012, again outperforming IDMs and the total IC market, and by 2017 fabless ICs will make up a full third of the overall market, says IC Insights.

SEMI approves first HB-LED standards

01/09/2013 

SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.

Innovations in computational lithography for 20nm

01/08/2013 

Several innovations in computational lithography have been developed in order to squeeze every possible process margin out of the lithography/patterning process.  In this blog, Gandharv Bhatara of Mentor Graphicsl talks about two specific advances that are currently in deployment at 20nm.

Cymer hires AMAT roadmap exec to lead EUV development

01/08/2013 

Klaus Schuegraf, former exec at Applied Materials responsible for the company's semiconductor products technology roadmap, will now lead Cymer's EUV engineering and development programs.

Look for 4K LCDs, OLEDs at CES

01/07/2013 

As the annual Consumer Electronics Show and hordes of techie enthusiasts descends over Las Vegas this week, NPD DisplaySearch revisits the battle between two display technologies -- 4K × 2K vs. OLEDs.

2013: Advanced chemistry moves center stage

01/04/2013 

We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.

IDC: Semiconductor revenues will grow 4.9% in 2013

01/04/2013 

The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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