11/21/2012 

Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.

11/20/2012 

Dr. Phil Garrou reports from the 2^nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?

11/20/2012 

Smart TVs, LED technology, and emerging markets will boost the IC market for TVs, says a new IC Insights study. Another trend: younger tech-savvy consumers are watching TV via the Internet and mobile devices.

11/19/2012 

Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.

11/16/2012 

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.

11/15/2012 

TELEFUNKEN Semiconductors is expanding its manufacturing capacity at the Roseville, California facility, to 220,000+ 8 inch wafers.

11/15/2012 

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.

11/15/2012 

In prep for Semicon Japan in December, Advantest announces three new tools: 2 SEMs and a litho system.

11/14/2012 

Swiss firm Adlyte, a developer of high-brightness laser-produced plasma (LPP) EUV light source for actinic mask inspection, is outlining its current expansion efforts, which includes appointing a longtime industry exec to its strategic advisory board.

11/14/2012 

After a nice spurt in 2Q12, worldwide silicon wafer area shipments fell back to a -slight decline in 3Q12, according to updated data from SEMI, and remain on track for cautious projections of flat growth for the full year.

11/13/2012 

Updating its "top 20" semiconductor supplier rankings from earlier this year, IC Insights finds most of the same trends holding true: a tough year overall for chipmakers, but fabless and foundry firms still showing very good growth.

11/13/2012 

In the sixth installment in a series called Process Watch, the authors discuss the ins and outs of parametric correlation when using measurements based on reflectometry, ellipsometry, or a combination of the two. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

11/13/2012 

Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr

11/13/2012 

Soitec says it has more than doubled production of bonded silicon-on-sapphire (BSoS) substrates to meet increased demand from partner Peregrine Semiconductor, which has surged its own production capacity for RF switches used in cellular handsets, including the newest iPhone 5.

11/12/2012 

FEI, Hillsboro, OR, has introduced its new Helios NanoLab 450 F1 DualBeam system designed to provide faster, better images of their most advanced device architectures.

11/12/2012 

Quartz Imaging Corp., Vancouver, BC, Canada, will be showing its newest FA-LIMS system (failure analysis laboratory information system) at the International Symposium for Testing & Failure Analysis.

11/12/2012 

imec announced two research collaboration efforts to advance STT-MRAM technology, an alternative high-density memory technology. The developments include working with Canon Anelva Corp. on its deposition tool and working with Tokyo Electron (TEL) on its Tactras etch tool, both installed in imec’s 300mm cleanroom.

11/12/2012 

Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?

11/12/2012 

X-Fab Silicon Foundries has inked a deal with Anvo-Systems Dresden to offer high-speed non-volatile memory (NVM) combining SRAM, DRAM, and SONOS flash technologies in a compact design.

11/12/2012 

This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.