Semiconductors

SEMICONDUCTORS ARTICLES

Murata researches reconfigurable radio ICs with imec

06/27/2012

In a 3-year research collaboration, research organization imec and semiconductor provider Murata Manufacturing Co. Ltd. will work on reconfigurable radio IC design.

CEA-Leti installs Soitec CVD tool for HKMG and PCM research

06/27/2012

CEA-Leti installed a CVD tool from Altatech, a subsidiary of Soitec, to research sub-20nm phase-change memory (PCM) and high-k metal gate (HKMG) semiconductor devices.

Canon intros lithography stepper for high-volume MEMS and LED production

06/27/2012

Canon Inc. launched the FPA-3030i5+ i-line stepper for manufacturing MEMS and energy-efficient green devices such as power semiconductors in solar and wind applications and LEDs.

SEMICON West 2012 exhibits preview: Lithography focus

06/27/2012

SEMICON West is taking place July 10-12 in San Francisco, CA. Following are new products for lithography, including photoresist coaters and ashers.

3D and 2.5D Integration: A Status Report preview with TechSearch International

06/26/2012

Solid State Technology is hosting 3D and 2.5D Integration: A Status Report, sponsored by EVG and ALLVIA, and is free for all attendees. This preview shares a sneak peek at

Xilinx speaker joins 3D packaging webcast roster

06/26/2012

Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.

Edwards tailors vacuum pump for LED, compound semiconductor manufacturing

06/26/2012

Edwards (NASDAQ:EVAC) introduced the new iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in LED and compound semiconductor manufacturing.

JPSA picosecond laser micromachining platform reduces debris and thermal damage

06/26/2012

JP Sercel Associates Inc. released the IX-6168-PS picosecond-laser-based micromachining platform, using lasers with 5-500 picosecond pulse lengths.

Wafer fabs to spend 8.9% less on equipment in 2012; utilization rates improve

06/25/2012

Worldwide wafer fab equipment spending will total $33 billion in 2012, down 8.9% from 2011s $36.2 billion spending level, say Gartner analysts. Chipmakers will spend more than $35.4 billion on WFE in 2013, ramping 7.4% over this year.

EUV lithography update: 1st adopters and supplier support

06/25/2012

Barclays Capital checks in on the EUV lithography market potential and which semiconductor manufacturers will press adoption. The analysts also update their expectations for lithography tool suppliers on the EUV front.

Lercel to lead SEMATECH's metrology work, new Nanodefect Center

06/25/2012

SEMATECH added Michael Lercel as senior director for nanodefectivity and metrology, taking the helm on SEMATECHs ongoing semiconductor wafer metrology program and the new Nanodefect Center in NY.

New speaker added for 3D and 2.5D Integration webcast

06/25/2012

Solid State Technology will present 3D and 2.5D Integration: A Status Report on June 27, free for all attendees. William Chen, ASE, will join speakers David McCann, GLOBALFOUNDRIES and E. Jan Vardaman, TechSearch International.

Electron backscatter diffraction arrives at EAG for crystalline material characterization

06/24/2012

Evans Analytical Group Inc. (EAG) added electron backscatter diffraction (EBSD) to its analytical and testing services.

Linde supports semiconductor manufacturer with expansion in OR

06/22/2012

Linde North America is expanding its capacity to supply ultra-high purity (UHP) gases to a major global semiconductor manufacturers Pacific Northwest location.

Semiconductor makers focus on flow control and treatment at leading edge; H20 reuse rises

06/22/2012

Semiconductor manufacturers will spend $2.3 billion in 2012 for flow control and treatment products, shows McIlvaine Company. Even more pure water is required as the line sizes on chips are decreasing. This aspect, coupled with the opportunity for water reuse, is creating new opportunities.

Global semiconductor funding rose in May

06/22/2012

The Global Semiconductor Alliance (GSA) shows more than 100% increase in semiconductor company investment Y/Y in May, in the Global Semiconductor Funding, IPO and M&A Update.

North American semiconductor fab tool makers see 4th month of positive book-to-bill ratio

06/22/2012

North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI.

MIT team models electronic behavior of OLEDs and other organic electronics

06/22/2012

A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.

Rudolph buys NanoPhotonics to bolster advanced packaging inspection offering

06/21/2012

Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.

STT-MRAM scale up boosts magnetic metrology orders at MicroSense

06/21/2012

MicroSense reports an increase in orders for its MRAM magnetic metrology systems. The metrology tools characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

SEMICONDUCTORS ARTICLES

WEBCASTS