Semiconductors

SEMICONDUCTORS ARTICLES



Top 5 counterfeited semiconductors: Analog ICs top the list

04/05/2012 

The top-5 most commonly counterfeit components (based on reported cases) are analog ICs, microprocessors, memory ICs, programmable logic devices, and transistors, shows IHS.

MOSAID multi-chip package stacks 16 NAND Flash die on 1 channel

04/05/2012 

MOSAID Technologies Inc. is sampling a 16-die stack NAND Flash device operating on a single high-performance channel, the 5126Gb HLNAND.

Nanophotonics researchers install NanoInk patterning tool at Osaka U

04/04/2012 

Osaka University’s Photonics Advanced Research Center in Japan installed a NanoInk NanoFabrication Systems DPN 5000 System for patterning various materials with nanoscale accuracy and precision. Osaka University scientists will develop and fabricate nanoscale plasmonic and nanophotonics devices.

Semiconductor foundry integrates Nova metrology for CMP at various nodes

04/04/2012 

Metrology tool supplier Nova Measuring Instruments Ltd. (NASDAQ:NVMI) will provide the production tools of record performing CMP metrology at a leading foundry.

Sensor fusion enables "connected, intelligent devices," says Maxim (MXIM) exec

04/03/2012 

Combining sensors with analog technology to enable sensor fusion will create intelligent devices for automotive, consumer, and industrial markets, said Vijay Ullal at Maxim Integrated Products (MXIM).

Semiconductors see some softness in Q1 2012

04/03/2012 

Semiconductor lead times decreased at the end of February 2012, reports analyst firm Gartner Inc. Although Gartner still expects the semiconductor industry to grow in 2012, Q1 showed some signs of softness.

Hynix brings NAND Flash memory to NOR maker Spansion

04/03/2012 

Spansion Inc. (NYSE:CODE) and SK Hynix formed an alliance to deliver Spansion SLC NAND Flash products at the 4x, 3x, and 2x nodes to the embedded market. Spansion is known as a NOR Flash memory provider.

Semiconductor sales flat through February 2012

04/03/2012 

The Semiconductor Industry Association (SIA) measured worldwide semiconductor sales at $22.9 billion in February 2012, down 1.3% from January’s $23.2 billion and 7.3% from February 2011.

Semiconductor makers spend record amount on materials for second straight year

04/03/2012 

The global semiconductor materials -- wafer fabrication and packaging materials -- market increased 7% in 2011 compared to 2010, with record revenues of $47.86 billion, said SEMI.

Analog appraised: Demand and inventories at top chip makers

04/02/2012 

Sterne Agee analyzes top analog semiconductor companies and the analog sector as a whole. Demand is stable (industrial, automotive) to improving (computing), and distributor inventories are low.

SEMICON West heralds 22nm, EUVL, 450mm, mobile electronics speakers

04/02/2012 

Intel, SEMATECH, and other top chip makers, suppliers, and research organizations will send speakers to SEMICON West, July 10-12 in San Francisco. The event will single out new transistor architectures, advanced lithography, 450mm wafers, and other major developments.

Bruker bolsters CT imaging line with SkyScan buy

04/02/2012 

Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.

Qualcomm IC design and engineering R&D center to bolster Singapore hub

03/30/2012 

Qualcomm Incorporated (NASDAQ:QCOM) will establish an integrated circuit (IC) design and engineering R&D center in Singapore.

Top 10 semiconductor foundries in 2011

03/30/2012 

The worldwide semiconductor foundry market totaled $29.8 billion in 2011, a 5.1% increase from 2010, according to Gartner. Given aggressive foundry spending in 2010 and 2011, oversupply was "inevitable," Gartner says.

SUSS buys Tamarack for lithography, laser structuring lines

03/30/2012 

SUSS MicroTec has acquired Tamarack Scientific Co. Inc. in a share purchase of $9.34 million. Tamarack makes UV projection lithography tools and laser micro-structuring systems.

MOCVD advances, InGaN enable record HEMT material from Kopin

03/29/2012 

Kopin Corporation achieved record 1290cm2/V.s electron mobility and 240ohms/square sheet resistance results from GaN-based high electron mobility transistor (HEMT) materials.

Transparent memory chip under development at Rice U

03/29/2012 

Rice University is developing transparent, flexible memory devices based on silicon oxide, enabling future consumer applications with flexible touchscreens, transparent batteries, see-through ICs, and more.

Semiconductor wafer fab utilization rates bucked expectations in late 2011

03/29/2012 

The Global Semiconductor Alliance (GSA) released its GSA Q1 Wafer Fabrication & Back-End Pricing Reports, tracking fab utilization rates, wafer and mask costs, and package pricing.

Single-chip optical interface achieved at ODIS

03/29/2012 

ODIS has developed an optical interface chip that is the first step in achieving a single device capable of interconnecting multiple processors by waveguide and/or fiber to transport ultra-high speed signals.

CMOS power amplifiers grab market share from GaAs

03/28/2012 

In its report, "RF filters, PAs, Antenna Switches & Tunability for Cellular Handsets," Yole Développement notes that new technologies are changing the power amplifier sector. PAs are strategic RF components in cell phones.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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