Semiconductors

SEMICONDUCTORS ARTICLES



UPDATED: Record semiconductor sales in 2011, 2012 outlook

02/08/2012 

The SIA shows 2011 worldwide semiconductor sales hit $299.5 billion, a 0.4% year-on-year increase and new record. Semico Research's forecast for 2012 shows a 10.11% growth in semiconductors revenues over 2011. Barclays Capital and Strategy Analytics also weigh in.

JPSA expands Ultrafast laser machining technology

02/08/2012 

JP Sercel Associates, Inc. (JPSA) expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques.

Novellus film deposition tool suits 3D Flash device fab

02/07/2012 

Novellus debuted the VECTOR Strata dielectric deposition tool for high-volume VIM Flash manufacturing. VECTOR Strata aims for ultra-smooth films with exceptional defect performance, enabling in-situ deposition of the alternating silicon-based layers used in the formation of the VIM structure.

Semiconductors to use most ultrapure water in 2012

02/07/2012 

The electronics industry will edge out coal-fired boilers as the biggest purchaser of ultrapure water systems and consumables in 2012, according to the McIlvaine report: Ultrapure Water World Markets.

EVG LED mask aligner offers COO improvement in gen-2

02/07/2012 

EVG uncrated the EVG620HBL Gen II fully automated mask alignment system for volume LED manufacturing. The second generation tool offers 55% higher wafer output per square meter of cleanroom space occupied, EVG reports.

Silicon wafer revenues increased, shipments tapered in 2011

02/07/2012 

Worldwide silicon wafer revenues improved 2% YOY, shows the SEMI Silicon Manufacturers Group. Worldwide silicon wafer area shipments, however, decreased 3%, indicating a loss of momentum in H2 2011, said Kazuyo Heinink, SEMI SMG.

SemiLEDs, LG Siltron, Epistar install Veeco MOCVD tools

02/07/2012 

Veeco Instruments (Nasdaq:VECO) reported 3 wins for its TurboDisc K465i GaN MOCVD tool : the same systems will be used for high-volume LED fab, GaN-on-Si research, and Si-based LED development.

Gigaphoton launches ArF excimer laser for multi-patterning immersion lithography

02/06/2012 

Gigaphoton uncrated the GT63A next-generation ArF excimer laser for multi-patterning immersion lithography scanners.

Rudolph sells metrology tool for back-end wafer packaging processes

02/06/2012 

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.

Micron (MU) CEO dies unexpectedly; company shares succession plan

02/06/2012 

Micron Technology Inc. (Nasdaq:MU) long-time CEO and chairman Steve Appleton passed away. MU named Mark Durcan, Micron president and COO, to fill the vacant CEO post, and serve on the Board.

Tokyo Electron (TEL) establishes organic EL and FPD departments, eliminates MEMS dev

02/03/2012 

Tokyo Electron Ltd. (TEL) restructured its organization, with a new "Organic EL Division" established under GM Takeshi Okubo, as well as other new and consolidating subsidiaries in the semiconductor and liquid crystal production segments.

X-FAB Silicon Foundries adopts SFT software

02/03/2012 

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18

AMD outlines SoC-centric strategy

02/03/2012 

AMD's (NYSE:AMD) new president and CEO Rory P. Read detailed what he called an "ambidextrous" strategy for the company, building on its x86 and graphics IP while incorporating other technologies and IP for differentiation in the electronics marketplace.

Smart mobile consumer electronics head for 25%+ growth

02/02/2012 

Consumer electronics devices are shifting from specific functions to multiple functions and Internet connectivity, creating an overlap of features and functions between product categories not only in the mobile segment, but also in other CE devices like digital TVs and set top boxes. This entire category is morphing into a larger "smart devices" grouping.

Wireless leads semiconductor-related OEM spending in 2011

02/02/2012 

Propelled by the appeal of Apple Inc.’s iPhone and iPad, the wireless communications sphere surpassed computers to lead all segments in semiconductor-related spending among top OEMs in 2011.

Tackling EUV lithography shadow distortions with OPC

02/02/2012 

James Word and Christian Zunia, Mentor Graphics, explore the current capabilities of model-based OPC software to model and correct for the shadowing distortions unique to extreme ultra-violet lithography (EUVL).

Soitec advances LED strategy with Altatech Semiconductor buy

02/01/2012 

Soitec (Euronext Paris) completed its acquisition of all of the outstanding shares of Altatech Semiconductor S.A. The final purchase price was EUR15 million.

Gore debuts high-purity 20nm PTFE filter for semiconductor, FPD fab

02/01/2012 

Gore introduced a 20nm-rated PTFE filter, available in a HDPE cartridge. The filter is optimized for bulk processing high-purity chemicals used in semiconductor and flat panel display manufacturing.

South Korean companies' IC sales surpass Japan for 1st time

01/31/2012 

North American companies made a minor gain in semiconductor marketshare in 2011, keeping the them in the majority worldwide. South Korean companies have gained more than two points of marketshare since 2009, says IC Insights.

Cambrios takes ITO-alternative to strategic phase with Samsung investment, new leader

01/31/2012 

Cambrios Technologies Corporation appointed John LeMoncheck as president and CEO, and announced a $5 million Series D-3 financing round from Samsung Venture Investment Corporation.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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