12/13/2011 

SEMI reports worldwide semiconductor manufacturing equipment bookings fell 38% year-over-year in Q3 2011; billings dropped 5% for the same quarter.

12/13/2011 

The Global Semiconductor Alliance named its 2011 awards recipients at a celebration last week in CA. Outstanding semiconductor companies worldwide were recognized for "success, vision and strategy in the industry." Winners include Broadcom, Intel, and lesser-known companies like Amalfi Semiconductor.

12/12/2011 

Dennis Buss, a visiting scientist at the Massachusetts Institute of Technology (MIT) and consultant at Texas Instruments (TI), presented "Research in self-powered electronic systems (#10.4)" at IEEE's International Electron Devices Meeting (IEDM) recently. He shares key results here.

12/12/2011 

SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.

12/09/2011 

Printed electronics materials and equipment suppliers, as well as academics and industry, were honored with annual awards at the IDTechEx Printed Electronics USA 2011 in Santa Clara, CA.

12/09/2011 

SMIC entered into a settlement agreement with Elpida Memory Inc. to settle all pending arbitration claims and counterclaims relating to the parties' Amended and Restated 200mm Wafer Products Business Agreement.

12/09/2011 

Fraunhofer CNT and semiconductor fab equipment supplier ASM International NV will collaborate under a Joint Development Agreement on various new projects over the next 5 years, including CVD and ALD process development.

12/08/2011 

Nikon Corporation released its NSR-S320F argon fluoride (ArF) lithography scanner for advanced 20nm node semiconductor device manufacturing. It boast high productivity and high accuracy, with stable operation in the field, Nikon reports.

12/08/2011 

Siltronic, Wacker Chemie AG

12/08/2011 

SuVolta Inc., developer of scalable low-power CMOS technologies, revealed its Deeply Depleted Channel (DDC) low-power transistor technology at IEEE's IEDM 2011 this week in Washington DC.

12/07/2011 

A number of big-name frontend equipment firms highlight TSMC's annual supplier awards in 2011, as the foundry expands its list of top suppliers.

12/07/2011  SEMATECH’s director of front end processes, Paul Kirsch, discusses two of the consortium’s papers presented at IEEE's International Electron Devices Meeting (IEDM) with Solid State Technology in a podcast interview

12/07/2011 

imec is presenting a record number of 17 papers at the IEEE International Electron Device Meeting (IEDM), ending today in Washington, DC.

12/07/2011 

KLA-Tencor Corporation (NASDAQ: KLAC) added to its SensArray portfolio of advanced wireless temperature monitoring wafers. The products use time-based, in-situ temperature monitoring to register process-environment effects on production wafers.

12/07/2011 

Semiconductor Research Corporation (SRC), university-research consortium for semiconductors and related technologies, is working with Cornell University researchers to develop on-chip silicon technologies for mobile devices. The aim is a micro-mechanical resonator for RF MEMS.

12/06/2011 

The WSTS' newest version of its twice-a-year semiconductor industry outlook shows some softer segments than just six months ago. Hope you enjoyed 2010's 30% blowout, because the next three years will flatline at low- to mid-single-digit growth.

12/06/2011 

SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $41.8  billion in 2011, decline in 2012, and rebound again in 2013. Front-end equipment experienced an increase in sales this year, while back-end tools saw a decrease.

12/06/2011 

Tokyo Electron Limited (TEL) has successfully demonstrated dynamicing -- device switching/dynamic characteristic (AC) -- of a power device at the wafer level.

12/06/2011 

ASM International N.V. created a new 14nm high-k gate dielectric process that achieved less than 6angstroms equivalent oxide thickness, while maintaining gate leakage below 1A/cm².

12/06/2011 

Asahi Kasei E-Materials Corporation purchased an IQ Aligner UV nanoimprint lithography (UV-NIL) system from EV Group (EVG).