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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Novellus Systems subsidiary Peter Wolters GmbH introduced a new version of its microLine double side lapping system for prime silicon wafers. The AC-2100L system features independently driven inner and outer pin rings, automatic force calibration, and in-situ wafer thickness metrology.
USHIO America will start marketing the nano-imprint vacuum ultra violet (VUV) ashing system "CHIPs (Compact HiPower System)" in the US. Incorporated into nano-imprint lithography (NIL) equipment, the CHIPs allows non-contact and damage-free cleaning, surface improvement, and ashing of templates and workpieces.
With electron beam lithography and etching, quantum dot size and position can be controlled and replicated. Tests at the NIST confirm that these etched quantum dots emit single particles of light, boosting prospects for powering new types of devices for quantum communications.
A prototype implantable eye pressure monitor for glaucoma patients is believed to contain the first complete millimeter-scale computing system. And a compact radio that needs no tuning to find the right frequency could be a key enabler to organizing millimeter-scale systems into wireless sensor networks.
Veeco Instruments' new TurboDisc MaxBright GaN MOCVD multi-reactor system is poised to take advantage of what the company believes is an accelerated rate of LED TV penetration. The new system targets manufacturing of HB-LEDs and is capable of single- or multi-chamber layer growth.
InVisage Technologies, image sensor technology start-up, received its series C round of venture funding, led by Intel Capital. The undisclosed amount will be used to bring the company's quantum-dot-based QuantumFilm technology and products into mass production.
Horacio Mendez, executive director of the SOI Industry Consortium, discusses how planar FD-SOI technology enables substantial improvements in performance and power consumption. The SOI Industry Consortium recently announced results of an assessment and characterization of FDSOI, based on the ARM Cortex processor as a prototyping vehicle.