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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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Chip suppliers are reporting rising inventory, but the swelling stockpiles do not represent a cause for concern at present, with demand on the rise in coming months, according to iSuppli Corp. Inventory levels are now more appropriately aligned with end-market demand, which was necessary given the level of under-shipment across many end-markets since 2HCY09, adds Doug Freedman, Gleacher & Company.
Applied Materials (NASDAQ:AMAT) today released Eterna, a new flowable CVD (FCVD) technology. Ajay Bhatnagar, director, global product management in the Gap Fill Dielectric Division, explains in-depth how it differs from conventional CVD. The technology is run on AMAT's Producer Eterna FCVD system. He also explains how it is being applied to new device architectures such as DRAM vertical transistors, NAND vertical bit stacks, and FinFETs.
Tom Gubiotti, product marketing manager at KLA-Tencor, discusses the design decisions that drove the company’s new film metrology tool -- the Aleris 8330 -- targeted for non-critical films at 32nm and below. Among the drivers -- especially for memory manufacturers -- is the need for high-throughput, low cost-of-ownership tools that are capable of recipe sharing around the fab, so-called, “future proofing.”
Actinic EUV inspection preserves the production paradigm with acceptable cost-per-inspection despite higher capital costs. Its development path is clear and achievable in time to meet technical and economic requirements for 16nm-hp production in 2015. Brian Haas, Gregg Inderhees, KLA-Tencor Corp., explain key elements of mask inspection and what actinic EUV inspection provides.
Brooks Instrument, provider of advanced flow measurement, control and level solutions, released product enhancements to the GF Series ultra-high purity mass flow controllers. Brooks has increased the range of flow rates available on the GF Series from the current 3 sccm to 30 slpm, to a new full-scale flow rate of 55 slpm. Along with a normally open valve option, this enables use in Epi, diffusion, batch CVD, and MOCVD.
In a podcast interview, Paul Semenza, SVP of Analyst Services at DisplaySearch, explains how a maturing OLED manufacturing capability is contributing to the surge in interest, as is consumer response to products that use OLEDs. One challenge, however, is scaling up vapor deposition, and solutions are being developed.