Semiconductors

SEMICONDUCTORS ARTICLES



Chinese chipmaker SMIC sees first quarterly losses

03/31/2005  March 31, 2005 - Semiconductor Manufacturing International Corp (SMIC), the biggest chipmaker on the Chinese mainland, saw its first quarterly losses in the 4Q last year, after becoming profitable a year ago, mainly due to compensation payments made to its competitor Taiwan Semiconductor Manufacturing Corp. (TSMC), said Asia Pulse Pte Ltd.

Ancora completes purchase of RVSI's SEG business

03/31/2005  March 31, 2005 - Ancora Management LLC today said it has completed the purchase of the assets of Robotic Vision Systems Inc.'s Semiconductor Equipment Group (SEG). The company had been operating under protection of the US Bankruptcy Court, which approved the sale of SEG. The business will operate as RVSI Inspection LLC and will continue to be based in Hauppauge, Long Island.

MagnaChip Semiconductor agrees to acquire IC Media

03/29/2005  March 29, 2005 - MagnaChip Semiconductor today announced that it has signed a definitive agreement to acquire IC Media Corp., a developer of CMOS image sensors, for an undisclosed amount. The transaction remains subject to certain closing conditions.

Entegris, Inc. and Mykrolis Corporation to combine in $1.3 billion merger-of-equals transaction

03/28/2005  Chaska, Minn. and Billerica, Mass., March 21, 2005 - Entegris, Inc. of Chaska, Minn., and Mykrolis Corporation, of Billerica, Mass., two leading suppliers to the global semiconductor and related industries, announced a definitive agreement to combine in a merger-of-equals transaction that creates a combined company valued at approximately $1.3 billion.

Toshiba to fight US court verdict on flash memory case

03/28/2005  March 28, 2005 - Toshiba Corp. said Friday it will fight a decision by a Silicon Valley jury that found it guilty of stealing trade secrets from Lexar Media Inc. in a suit over flash memory used in digital cameras, music players, and other devices.

AMI Semiconductor Offers 'Green' Packaging

03/25/2005  (March 25, 2005) Pocatello, Idaho — AMI Semiconductor (AMIS) now offers 'green,' RoHS-compliant packages, in accordance with the EU's WEEE environmental initiatives to replace lead-based packaging in the manufacturing process.

DuPont Photomasks receives Spansion award for yield improvements

03/25/2005  March 25, 2005 - DuPont Photomasks Inc. has received a Spotlight Award from flash memory device maker Spansion LLC for helping Spansion's FAB25 in Austin, TX, enhance wafer yield. Spansion's award recognizes DuPont Photomasks' role in a joint-development project aimed at boosting yield by targeting improvement of layer-to-layer registration when chip designs are etched on wafers. Spansion, formerly known as FASL LLC, is the flash memory subsidiary of AMD and Fujitsu Limited.

EV Group ships Gemini production wafer bonder to DALSA

03/24/2005  March 24, 2005 - EV Group today announced that it has successfully installed a Gemini production wafer bonder at DALSA Corp.'s Semiconductor Division in Bromont, Quebec, Canada. The Gemini wafer bonder is designed for alignment and low-temperature plasma bonding for a wide variety of wafer types and sizes.

Oki retools chip lines to handle different wafer sizes

03/23/2005  March 23, 2005 - Oki Electric Industry Co. has retooled the semiconductor manufacturing lines at Miyazaki Oki Electric Co. so that its three fabrication lines can handle different wafer sizes, said the Nihon Keizai Shimbun.

Photronics expands FPD mask fabrication, service into Taiwan

03/22/2005  March 22, 2005 - Photronics Inc. has announced plans to expand its flat panel display (FPD) mask capacity through the construction of a state-of-the-art FPD mask fabrication facility in Taichung, Taiwan. This new 10,100 sq. m. facility will support Taiwan's rapidly expanding FPD fabrication industry.

JDS Uniphase acquires commercial laser provider Lightwave Electronics

03/22/2005  March 22, 2005 - JDS Uniphase Corp. has announced a definitive agreement to acquire Lightwave Electronics Corp., a provider of solid-state lasers for commercial markets - including materials processing, semiconductor fabrication, and biotech - as part of its strategy to expand its product line of solid-state lasers and broaden its customer base in growing laser markets.

SES to consign output of wafer cleaning devices To Korean firm

03/18/2005  March 18, 2005 - SES Co., a manufacturer of semiconductor cleaning equipment, will consign the manufacturing of lower-priced models, designed to clean 200mm wafers, to a South Korean company, in a bid to cut production costs by 20%, company sources said, according to Nihon Keizai Shimbun.

Veeco nets AFM order from disk maker

03/18/2005  Veeco Instruments Inc. announced that it received an order for its Dimension X3D automated atomic force microscope from a leading global hard disk drive manufacturer.

Therma-Wave wins multimillion dollar order for metrology solutions

03/17/2005  March 17, 2005 - Therma-Wave Inc. has announced that a leading Taiwanese DRAM semiconductor manufacturer has selected multiple Therma-Wave metrology solutions for use in its 300mm factory. The multimillion dollar order includes multiple Opti-Probe 7341 thin film metrology tools with real-time, critical-dimension capability for use in 90nm technology node production, extendible to 65nm development work. The order also includes a Therma-Probe 630XP tool for ion implant metrology.

Sumitomo Mitsubishi Silicon to double 300mm output capacity

03/17/2005  March 17, 2005- Sumitomo Mitsubishi Silicon Corp. announced that it plans to hike its monthly production capacity of 300mm silicon wafers from 300,000 units to 600,000 by summer 2008, according to the Nihon Keizai Shimbun.

Aviza, Trikon spark buzz with proposed match

03/17/2005  March 18, 2005 - Aviza Technology Inc., Scotts Valley, CA, and Trikon Technologies Inc., Newport, Wales, UK, have agreed to merge to form a $160 million company combining Trikon's plasma etch, physical-vapor deposition (PVD), and chemical-vapor deposition (CVD) systems, with Aviza's thermal processing and ALD tools.

Keithley Receives Repeat Order for Test System

03/15/2005  (March 15, 2005) Cleveland — Keithley Instruments has received a repeat multiple-system order for its S680 DC/RF Parametric Test Systems from Icheon, Korea-based Hynix Semiconductor Inc.

SEMATECH Engineers Develop Colorful Testing Device to Ease High-k/Metal Search

03/15/2005  AUSTIN, TX -- (MARKET WIRE) -- 03/14/2005 -- SEMATECH engineers have developed an eye-catching test device that allows semiconductor technologists to measure the important electrical characteristic of work function on a single wafer, saving time and increasing accuracy.

SPIE Report: Canon, Nikon prep multistage immersion platforms

03/14/2005  New hyper-NA tools aim to boost throughput over ASML's Twinscan

By J. Robert Lineback, Senior Technical Editor

With no "showstoppers" identified yet in immersion lithography, rival scanner makers ASML, Canon, and Nikon are accelerating efforts to take 193nm "wet" exposure tools to the next level, quickly pushing numerical aperture lenses to their feasible limits in systems using water to boost depth of field and resolution for 65nm and 45nm processes.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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