11/16/2004  There's good news for nano center builders. New construction in the U.S. and the world at universities and national labs is adding more business to the economy. Building nano center facilities is a tricky job. Much of the complexity stems from the fact that the new or remodeled labs are often in the middle of existing campuses.

11/15/2004  (November 15, 2004) Munich, Germany—The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) announces the conclusion of the venture between Amkor, its Unitive subsidiaries, and SECAP to establish the world's first high-volume, 300-mm electroplated solder bumping line using Unitive's technology.

11/15/2004  November 15, 2004 - Global sales of chipmaking equipment in September rose 50% from a year before to $3596 million, a 14th straight year-on-year increase, as demand in Taiwan and South Korea grew sharply, a SEMI-SEAJ industry survey showed, said Jiji Press Ltd.

11/15/2004  The accomplishments of Molecular Imprints and its CEO led it to one top honor and a runner-up award in the 2004 Small Times' Best of Small Tech Awards. Molecular Imprints received the Company of the Year title. Norman Schumaker, president and CEO, won a runner-up award in the business leader category.

11/12/2004  Atomate Corp. has foregone the usual dreams of nanoscale manufacturing for a more practical macroscale market: the making of nano-fabrication equipment. The company has developed its own line of products to meet the special needs of the nanotech industry, where souped-up gear borrowed from the semiconductor falls short.

11/11/2004  (November 11, 2004) The Semiconductor Research Corporation (SRC) and the Semiconductor Industry Association (SIA) announce their co-sponsorship of a contest open to North American university students and faculty to create novel, low-power SoC designs that demonstrate the value of greater systems integration in IC design.

11/11/2004  November 11, 2004 - Samsung Electronics has developed the world's highest-capacity "fusion'' chip for wide-ranging applications in high-end mobile phones, according to a company statement, reported the Korea Times. The 1-gigabyte OneNAND fusion memory combines NAND flash memory, SRAM, and system logic in one chip.

11/11/2004  November 11, 2004 - Amkor Technology Inc., its Unitive subsidiaries, and the Semiconductor Equipment Consortium for Advanced Packaging (SECAP) have established a high-volume 300mm electroplated solder bumping line, according to SECAP. The line, which was set up in 2003 at Unitive Semiconductor Taiwan (UST), located in Hsinchu, Taiwan, has reached volume production.

11/10/2004  November 10, 2004 - AMD and Chartered Semiconductor Manufacturing have entered into sourcing and manufacturing agreements where Chartered will implement under license portions of AMD's automated precision manufacturing software suite and become an additional manufacturing source of AMD64 microprocessors, according to Asia Pulse Pte Ltd.

11/10/2004  November 10, 2004 - BOC Edwards has announced it is making major investments in 7 gas plant facilities to ensure bulk gas supply to 9 new semiconductor and FPD manufacturing fabs under construction, said the company. These pave the way for multiple supply contracts and are being developed as part of a US$75 million investment with BOC's JV partner, BOC Lienhwa Industrial Gases Company Ltd (BOCLH).

11/09/2004  November 9, 2004 - Sanyo Electric Co. said it has begun alternate production at its Gunma and Gifu semiconductor plants because it remains unclear when it can resume operations at its quake-hit factory in Ojiya, Niigata prefecture, northern Japan, said the Nihon Keizai Shimbun America Inc.

11/09/2004  November 9, 2004 - Toshiba Corp. has filed patent infringement lawsuits against South Korea's Hynix Semiconductor Inc. both in Japan and the US, claiming that it violated Toshiba's flash memory patents, according to several news agencies.

11/08/2004  (November 8, 2004) Taipei, Taiwan—After reporting flat revenues for the entire third quarter, Advanced Semiconductor Engineering (ASE) reports a 7.5% sequential uptick in net revenues for October 2004, amidst the holiday build season. Revenues were a record $235.1 million, 36.2% above the October 2003 level. Year-to-date net revenues for ASE through October 2004 are $2.006 billion.

11/04/2004  November 4, 2004 - Scientists from Royal Philips Electronics and the Kavli Institute of Nanoscience at Delft U., The Netherlands, claim they've achieved the first successful integration of III-V nanowires on germanium and silicon substrates.

11/04/2004  November 4, 2004 - Two announcements this week signify China's eagerness to absorb more leading-edge chipmaking technologies -- and US chipmakers' willingness to provide them, despite longstanding policies restricting exports of advanced technologies to the mainland.

11/04/2004  (November 4, 2004) Singapore—Advanced Interconnect Technologies (AIT) announces the availability of a new family of etched leadless packages (ELP) that delivers design flexibility, increased density, and a reduced footprint.

11/04/2004  (November 4, 2004) San Jose, Calif.—Worldwide silicon wafer area shipments in the third quarter increased 1% sequentially and 25% from the third quarter of 2003, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. Silicon wafer area shipments totaled 1,629 million sq. in. during the most recent quarter, compared to the 1,619 million sq. in. in shipments reported during the previous quarter.

11/04/2004  November 4, 2004 - Worldwide silicon wafer area shipments in 3Q04 increased 1% sequentially and 25% from the 3Q03, according to SEMI's Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

11/02/2004  November 2, 2004 - Inventory corrections are putting a damper on a traditionally strong month for semiconductor sales, but overall growth for the year is about on target with projections, according to the latest data from the Semiconductor Industry Association (SIA).

11/01/2004  November 1, 2004 - ASM International NV, Bilthoven, The Netherlands, has developed a new process that enables porous low-k insulator materials in copper interconnects for 65nm devices.