Semiconductors

SEMICONDUCTORS ARTICLES



Dresden hopeful to create nanotech research center

06/10/2004  The German city of Dresden is one of the country's shining stars with its plans to create a nanotech research center focusing on advanced chip development are successful. The government announced this week that it is in advanced talks in hopes of creating the center.

SEMATECH picks Carl Zeiss for 193nm development

06/09/2004  June 9, 2004 -International SEMATECH has selected German lithography firm Carl Zeiss SMT to develop a defect review tool for 193nm immersion lithography photomasks.

Elpida to build mammoth DRAM fab

06/09/2004  June 9, 2004 -- Elpida Memory Inc. plans to invest up to 500 billion yen over three years to construct what would be the world's largest DRAM facility.

Cadence and ASML agree to develop advanced DFM solutions

06/08/2004  June 8, 2004 -- Cadence Design Systems Inc. and ASML MaskTools have agreed to a multi-year, multimillion dollar software licensing and joint development agreement for advanced RET software solutions.

Cavendish announces memory technology

06/08/2004  Cavendish Kinetics, a Holland-based semiconductor company working to integrate MEMS devices into standard CMOS processes, announced its Nanomech technology for creating submicron structures for use as computer memories.

Elpida, Rambus extend memory pact

06/07/2004  June 7, 2004 - Elpida Memory Inc. has extended the terms and duration of its licenses to SDRAM and DDR DRAM patents from Rambus Inc., Los Altos, CA.

Nantero teaming with LSI Logic on carbon nanotube project

06/07/2004  June 7, 2004 -- Nantero Inc., Woburn, MA, says that it is teaming with LSI Logic Corp., Milpitas, CA, to develop semiconductor process technology, expediting the effective utilization of carbon nanotubes in CMOS fabrication.

Intel narrows 2Q outlook

06/04/2004  June 4, 2004 - In its mid-quarter update on Thursday, Intel tightened its outlook for 2Q04 revenue to $8.0-$8.2 billion, at the higher end of previous predictions of $7.6-$8.2 billion, due to increasing strength in its flash memory business.

New coalition seeks DFM standards

06/03/2004  June 3, 2004 - A new group has been formed to create open standards for unifying IC design and manufacturing information, in order to counter increasing costs and complexities associated with design for manufacturability (DFM).

SIA: Another month, another record for chip sales

06/03/2004  June 2, 2004 - April proved true to its historical roots as a strong month for the industry, as worldwide chip sales continued to venture into territory not seen in four years, according to the latest data from the Semiconductor Industry Association (SIA).

Novellus to acquire Germany's Peter Wolters AG

06/03/2004  June 2, 2004 -- Novellus Systems Inc. has signed an agreement to acquire Peter Wolters AG, a privately held manufacturer of high-precision machine manufacturing tools headquartered in Rendsburg, Germany

Renesas purchases two Tokyo fabs from Hitachi

06/01/2004  May 31, 2004 -- Renesas Technology Corp. has purchased two semiconductor plants located in the Tokyo suburb of Ome from Hitachi Ltd. for 1.2 billion yen, the Nihon Keizai Shimbun recently reported, citing sources familiar with the matter.

Extraction Systems looks to capitalize on market opportunity

06/01/2004  Extraction Systems Inc. (www.extractionsystemsinc.com), a provider of molecular contamination control and measurement products, recently doubled its manufacturing capacity at its headquarters here in anticipation of a market upswing and changes in the competitive landscape.

Applying Moore's Law to Wafer Test

06/01/2004  Gordon Moore's 1965 observation that the number of transistors per square inch of silicon was doubling every year has, with modest variations, continued to characterize growth in the semiconductor industry.

Semicon West to be reunited in 2005

05/28/2004  May 28, 2004 -- Due to expanded facilities at San Francisco's Moscone Center, the front-end and final manufacturing segments of Semicon West will be reunited in San Francisco next year, according to Semi, the organization that runs the event.

Applied Materials and Praxair sign service alliance

05/27/2004  May 27, 2004 -- Applied Materials Inc. and Praxair Electronics have announced a joint initiative program to streamline fab operations for semiconductor manufacturers.

Air Liquide signs 15-year deal with TI

05/27/2004  May 27, 2004 -- Air Liquide America has signed an exclusive 15-year carrier gas supply agreement for Texas Instruments' 300mm semiconductor manufacturing facility to be constructed in Richardson, TX.

STMicroelectronics, CEA-Leti, and AIXTRON develop ultra-thin gate-insulation process

05/26/2004  May 26, 2004 -- STMicroelectronics today announced that ST, CEA-Leti, and AIXTRON have developed an advanced process technology for the creation of ultra-thin transistor-gate-insulation layers for low-power applications at the 65nm and 45nm CMOS transistor technology nodes.

Small-tech trio faces stiff competition in MIT's $50K challenge

05/25/2004  Advanced Diamond was one of three small tech business plans to squeak into MIT’s famed $50K Entrepreneurship Competition this year, with its diamond-copper composite that acts as a coolant for microchip components. Other small-tech finalists were Active Spectrum, using MEMS to build a transceiver for wireless devices, and LumArray, with a nanoscale lithography technique that eliminates costly design masks.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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