Semiconductors

SEMICONDUCTORS ARTICLES



Lithography equipment supplier ASML to cut 1,450 jobs

12/18/2002  Dec. 18, 2002 - Veldhoven, Netherlands - Chip equipment maker ASML has announced that it will cut 1,450 jobs and sell or close loss-making US businesses, as it strives to reach break-even in the chip industry's worst-ever slump.

Veeco, FEI merger delayed

12/18/2002  Veeco Instruments Inc. and FEI Co. said they won't merge as planned by year's end, citing delays in obtaining regulatory and shareholder approvals.

Numerical Technologies licenses phase-shift technology to Samsung

12/17/2002  Dec. 17, 2002 - San Jose, CA - Numerical Technologies Inc., the provider of subwavelength lithography-enabling technology to the semiconductor industry, today announced that Samsung Electronics Co. Ltd. has signed an agreement to license Numerical's phase-shifting technology for the production of its newest and most advanced SRAM product.

ASML restructuring announcement expected

12/17/2002  Dec. 17, 2002 - Veldhoven, Netherlands - Lithography equipment supplier ASML Holding NV will shortly unveil details of a large restructuring program, according to a person close to the company.

AMD reorganizes memory group

12/16/2002  Dec. 16, 2002 - Sunnyvale, CA - Advanced Micro Devices has reorganized its flash memory chip operations as it attempts to take better advantage of increased memory needs in advanced electronics products, reports CBS MarketWatch.

Novellus to redeem SpeedFam-IPEC's notes

12/16/2002  Dec. 16, 2002 - San Jose, CA - Novellus Systems Inc. has announced that it has called for the redemption of all of its subsidiary SpeedFam-IPEC Inc.'s six-and-one-quarter percent Convertible Subordinated Notes, due in 2004.

Semiconductor industry showed slight growth in 2002

12/13/2002  December 13, 2002 -- The worldwide semiconductor industry returned to positive growth in 2002, with revenue totaling $155.4 billion in 2002, a 1.4 percent increase from 2001, according to preliminary statistics by Dataquest Inc., a unit of Gartner Inc. In 2001, worldwide semiconductor revenue declined 32 percent.

UPDATE: EFP filtration system gets favorable report

12/13/2002  DEC. 13--HENDERSON, NEV.--Emergency Filtration Products Inc. (EFP) has received favorable preliminary results from the testing of its nanotechnology-enhanced 2H Technology filtration system, which will be incorporated into an Environmental Isolation Mask.

SUSS launches nanoimprinting tools

12/12/2002  SUSS MicroTec AG said it has launched new embossing equipment for nanoimprinting technology.

Infineon withdraws from Taiwan chipmaker ProMOS

12/11/2002  Dec. 11, 2002 - Taipei, Taiwan - Germany-based Infineon Technologies AG said it will sell its 30% stake in Taiwan's ProMOS Technologies Inc. and stop buying from the joint venture.

Novellus Systems closes acquisition of SpeedFam-IPEC

12/09/2002  Dec. 9, 2002 - San Jose, CA - Novellus Systems Inc. has closed its acquisition of SpeedFam-IPEC Inc., a global supplier of CMP systems used in the fabrication of advanced copper interconnects.

EFP begins testing nano-environmental mask

12/04/2002  DEC. 4- LAS VEGAS--Emergency Filtration Products Inc. (EFP) has begun testing its nanotechnology-enhanced 2H Technology filtration system to be incorporated into an environmental isolation mask.

DuPont Photomasks reduces headcount

12/04/2002  Dec. 4, 2002 - Round Rock, TX - DuPont Photomasks Inc. plans to streamline its European operations by consolidating trailing-edge photomask production in Rousset, France and Hamburg, Germany, into its manufacturing facility in Corbeil, France. These initiatives are expected to reduce the global workforce by approximately 8%, or 140 positions, once fully implemented.

SPECIAL STAFF REPORT: An OASIS by the sea at BACUS 2002

11/29/2002  The atmosphere of the 22nd BACUS Photomask Symposium, held recently in Monterey, CA, was oddly upbeat, with a record 156 papers and high attendance, in spite of depressed industry conditions. The mask industry has been hard hit by the slow shift to 130nm and beyond, since most of industry revenue comes from such advanced reticles.

Nat Semi begins construction of semiconductor manufacturing facility in China

11/25/2002  Nov. 25, 2002 - Suzhou, China - National Semiconductor Corp., Santa Clara, CA, has begun construction of its first manufacturing facility in China with groundbreaking ceremonies in Suzhou Industrial Park, the site of the company's planned semiconductor assembly and test facility.

Asyst gets large FOUP order

11/25/2002  NOV. 25--FREMONT, CA--Asyst Technologies, Inc., a provider of semiconductor manufacturing productivity automation, has announced that a leading global silicon wafer manufacturer has placed a large production order for Asyst's G3 front-opening unified pod (FOUP) wafer carriers.

TEL to participate in Albany NanoTech Initiative

11/21/2002  Nov. 21, 2002 - Albany, NY - Tokyo Electron (TEL), announced its participation in Albany NanoTech's new 300mm semiconductor research center at a press conference held on the campus of the U. at Albany-State University of New York (UAlbany).

TSMC and Cadence collaborate on signal integrity closure

11/18/2002  Nov. 18, 2002--San Jose, CA--Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and Cadence Design Systems Inc. have collaborated to solve design challenges in 130 and 90nm process technology signal integrity (SI) closure.

Hitachi, NEC to inject some $366M into Elpida

11/18/2002  Nov. 18, 2002 - Tokyo, Japan - Hitachi Ltd. and NEC Corp. plan to inject an additional 44 billion yen ($365.6 million) into their chip venture, Elpida Memory Inc., by the end of March.

Infineon, Nanya seal DRAM cooperation by founding production JV

11/13/2002  Nov. 13, 2002 - Munich, Germany, and Taoyuen, Taiwan - Infineon Technologies and Nanya Technology Corp. have signed final contracts concerning strategic cooperation on standard memory chips (DRAM).




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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