Semiconductors

SEMICONDUCTORS ARTICLES



New Jersey pools its resources for faster-to-market small tech

11/12/2002  The goal of the New Jersey Nanotechnology Consortium, a nonprofit corporation headquartered at Bell Labs, is to leverage the center's 40 years of experience commercializing technology. CTO Om Nalamasu says that companies that want to unlock the commercial potential of small tech need to pool resources.

Small Times magazine announces Best Of Small Tech Award winners

11/12/2002  Small Times magazine has announced its 2002 Small Times Magazine Best of Small Tech Awards, recognizing the best people, products and companies in nanotechnology, MEMS and microsystems.

Philips to close Albuquerque fab next year

11/11/2002  Nov. 11, 2002-Amsterdam, Netherlands--Royal Philips Electronics announced plans for the phased closure of its semiconductor fabrication operation in Albuquerque, New Mexico, at the end of 2003.

Silicon etch system

11/08/2002  Nov. 6, 2002 - Fremont, CA - Lam Research Corp.'s 2300 Versys Star system, for 200mm and 300mm applications, builds on the 2300 Versys, expanding process capability for etching the complex structures required for sub-90nm applications.

248nm bilayer resist system

11/07/2002  Aug. 30, 2002 - Marlborough, MA - Shipley Co. LLC's SiBER is an ultrahigh-resolution, 248nm, silicon bilayer resist system that is composed of a silicon-containing top imaging layer and a planarizing, light-absorbing, polymeric bottom layer.

DuPont completes acquisition of ChemFirst

11/07/2002  Nov. 07, 2002-Wilmington, DE--DuPont has completed the acquisition of ChemFirst Inc. in a cash merger with a ChemFirst price/share of US$29.20 and a total transaction value of approximately US$400 million.

ALD/PVD copper barrier/seed system

11/07/2002  July 22, 2002 - Santa Clara, CA - Applied Materials' Endura iCuB/S integrated Cu barrier/seed system deposits the critical barrier and seed layers in 65nm-generation (and beyond) copper interconnects.

Nanometrics' laser profiler for copper CMP

11/06/2002  Nov. 6, 2002 - Milpitas, CA - Nanometrics Inc., which supplies the semiconductor industry with integrated and standalone metrology tools, has announced the introduction of its newest metrology system, designed to control the copper CMP process.

K&S considers future of non-core operations

11/05/2002  Nov. 5, 2002 - Willow Grove, PA - Kulicke & Soffa Industries, the supplier of semiconductor assembly and test interconnect equipment, materials and technology, has announced that it is exploring options for certain of its non-core business units.

Micron files suit against Korean DRAM subsidies

11/04/2002  Nov. 1, 2002 - Boise, ID - Micron Technology Inc. has filed a countervailing duty case with the US Department of Commerce and the International Trade Commission against DRAM semiconductor products manufactured in South Korea.

Shipley Co., Numerical partnership for low K1 lithography imaging

11/01/2002  Nov. 1, 2002 - Marlborough, MA - Shipley Company L.L.C., a provider of electronic materials and process innovations for advanced circuit board technology, semiconductor manufacturing, and advanced packaging, has established a partnership for low k1 lithography imaging with Silicon Valley-based Numerical Technologies Inc.

Progress!

11/01/2002  Editors and other people with the luxury of observing and commenting have been exhorting the packaging part of the semiconductor industry to work more closely with the front-end portion of it.

Fujitsu cuts 1,700 jobs

10/31/2002  Oct. 31, 2002 - Tokyo, Japan - Fujitsu Ltd. will trim its work force at its three US subsidiaries by 10% as part of major restructuring efforts, which include halting the marketing of transmission devices for long-distance communications and substantially scaling down information systems-building services for corporate clients in North America, company sources said.

ASE ready for flip chip production

10/30/2002  OCT. 30--SANTA CLARA, CA--Advanced Semiconductor Engineering Inc. says its 300 mm wafer flip chip bumping line is ready for production.

Cymer to open new facility

10/25/2002  Cymer Inc. is to build a new manufacturing facility for its advanced lithography light sources, and will implement a new organizational structure. The new facility is designed to accommodate the high-volume production of the company's light source portfolio. This will include the new XL Series product line, which utilizes the dual-gas-discharge-chamber Master Oscillator Power Amplifier (MOPA) architecture.

Sematech and DuPont forge test photomask cross-licensing agreement

10/22/2002  Oct. 22-Austin and Round Rock, TX-Through a recently signed cross-licensing agreement, International Sematech (ISMT) and DuPont Photomasks have combined their intellectual property (IP) for producing test photomasks. The goal is to use test masks based on the combined IP to strengthen industry standards for photomask inspection and repair systems at the leading-edge technology nodes.

Varian issued angle control patent

10/22/2002  Oct. 22 - Gloucester, MA - Varian Semiconductor Equipment Associates Inc. has been issued U.S. Patent Number 6,437,350 for "Methods and Apparatus for Adjusting Beam Parallelism in Ion Implanters."

QinetiQ launches MEMS prototyping

10/22/2002  QinetiQ has launched a new program for MEMS prototyping, according to Semiconductor Business News.

AMAT receives orders worth over $45M from Tower Semiconductor

10/21/2002  Oct. 21, 2002 - Santa Clara, CA - Applied Materials Inc. has received orders for chipmaking equipment worth more than $45 million from Tower Semiconductor Ltd., an independent wafer-foundry in Migdal Haemek, Israel.

Nikon files complaint in US

10/21/2002  Oct. 21, 2002 - Belmont, CA - Nikon Corp. and Nikon Precision Inc., a wholly-owned subsidiary located in Belmont, have filed a patent infringement action against ASML Netherlands BV, a Dutch corporation and ASM Lithography Inc., a US company in the US District Court for the Northern District of California, asserting infringement of eight Nikon patents relating to primary structures in stepper and scanner machines.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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