10/20/2017  Many of today's technologies, such as, solid-state lighting, transistors in computer chips, and batteries in cell phones rely simply on the charge of the electron and how it moves through the material. In certain materials, such as the monolayer transition metal dichalcogenides (TMDs), electrons can be selectively placed into a chosen electronic valley using optical excitation.

10/20/2017  CEA Tech's contribution includes Liten's knowhow in magnetic materials and simulation and Leti's expertise in wide-bandgap semiconductors.

10/20/2017  Global semiconductor equipment billings of North American headquartered suppliers for September were $2.0 billion, down 12 percent from the peak level set in June of this year.

10/19/2017  The announcement comes as the company also introduces Mi-V RV32IMA and additional field programmable gate array (FPGA)-based soft CPU solutions ideally suited for designs utilizing RISC-V open instruction set architectures (ISAs).

10/19/2017  The ConFab, to be held May 20-23 at The Cosmopolitan of Las Vegas, is excited to announce IBM's Dr. Rama Divakaruni will be the opening keynote for the 2018 conference.

10/19/2017  Ferroelectric self-assembled molecular materials

10/19/2017  Strong growth to be driven by a 74% surge in the DRAM market and 44% jump in the NAND flash market.

10/18/2017  Praxair will build, own and operate a plant to support GLOBALFOUNDRIES’ advanced manufacturing processes at its Malta fabrication facility.

10/18/2017  Samsung Electronics Co., Ltd. announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

10/17/2017  Total wafer shipments this year are expected to exceed the market high set in 2016 and are forecast to continue shipping at record levels in 2018 and 2019.

10/17/2017  Showcasing critical issues shaping the entire electronics manufacturing supply chain.

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.

10/16/2017  Semiconductor Manufacturing International Corporation today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.

10/16/2017  sureCore to make its Low Power SRAMs available in 22FDX.

10/16/2017  The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the formation of an Automotive Birds of a Feather (BoF) Group to solicit industry input from original equipment manufacturers (OEMs) and their suppliers to enhance existing or develop new interface specifications for automotive applications.

10/13/2017  ArterisIP, the supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced it has joined the FDXcelerator Partner Program.

10/13/2017  A new method that precisely measures the mysterious behavior and magnetic properties of electrons flowing across the surface of quantum materials could open a path to next-generation electronics.

10/13/2017  ClassOne Group, provider of semiconductor processing systems, today announced a special new financing program that seeks to give more attractive options to equipment purchasers.

10/13/2017  A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers fades.