Semiconductors

SEMICONDUCTORS ARTICLES



ASML-SVG deal heads to US president

04/24/2001  April 24, 2001 - Washington, D.C. - The US Committee on Foreign Investment in the United States has apparently completed its 45-day investigation on the proposed sale of the Silicon Valley Group Inc. to Netherlands-based ASM Lithography Holding N.V.

TSMC Delays Wafer Projects

04/23/2001  April 23, 2001 -- Taipei -- A decline in demand for wafers has forced Taiwan Semiconductor Manufacturing Company to postpone the completion of two 12-inch wafer plants that had been planned for southern Taiwan.

Infineon set to equip German 300mm fab

04/23/2001  April 23, 2001 - Dresden, Germany - Infineon Technologies said it is ready to equip the 300mm production module for memory products that the firm started building in cooperation with Motorola in May 2000.

Numerical, Intel sign phase-shifting tech agreement

04/23/2001  April 23, 2001 - San Jose,CA - Numerical Technologies Inc. and Intel Corp. have signed multi-year, multi-million-dollar technology cross-licensing agreement for advanced photolithography solutions used in the production of high-end semiconductors.

TSMC plans fab delays

04/20/2001  April 20, 2001 - Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Co. (TSMC) is considering delaying plans to build two 300mm fabs in southern Taiwan until the economy shows signs of improvement.

TSMC touts 300mm pilot for 0.13m

04/19/2001  April 19, 2001 - Hsinchu, Taiwan - Taiwan Semiconductor Manufacturing Company has announced what it claims are two new foundry firsts for advanced technology development.

TSMC Completes 300mm, 0.13-micron All Copper Process Pilot

04/18/2001  April 18, 2001 -- HSINCHU, Taiwan -- Taiwan Semiconductor Manufacturing Company (TSMC) has completed a 300 mm pilot for 0.13-micron, all copper process of a 4 megabyte SRAM test vehicle.

DuPont Photomasks and Infineon to develop advanced photomask technology

04/18/2001  April 18, 2001 - Round Rock, TX & Munich, Germany - DuPont Photomasks, Inc. and Infineon Technologies have agreed to jointly develop advanced photomask technology to support the production of leading edge memory and logic semiconductor devices.

KLA-Tencor to buy Phase Metrics

04/13/2001  April 13, 2001 - San Jose, CA - KLA-Tencor Corp. has signed an agreement to purchase Phase Metrics, a top supplier of inspection/certification technologies to the data storage industry.

More Chip Companies to Cut Jobs

04/13/2001  April 13, 2001 -- More companies are resorting to job cuts, citing a downturn in the semiconductor market.

Sony Hits Zero Emissions Mark At Six Chip Plants

04/12/2001  April 12, 2001 -- TOKYO -- Sony Corp. has achieved zero emissions for waste from six of its chip making plants.

Axcelis unveils ion implant control system

04/12/2001  April 12, 2001 - Beverly, MA - Axcelis Technologies has introduced a next-generation control system that, according to the company, allows greater productivity and throughput for new and installed ion implanters.

Motorola launches advanced 0.13-micron CMOS process platform technology

04/11/2001  April 11, 2001 - Austin, TX - Motorola has unveiled an advanced 0.13-micron CMOS process platform technology. HiPerMOS7, or HiP7, has been designed to enable Motorola's Semiconductor Products Sector (SPS) to build system-on-a-chip solutions for applications from low -ower wireless to high-performance network and computer products. According to the company, HiP7 is its most dense, most modular, and lowest power system-on-chip platform process.

Legal warning to TSMC from UMC

04/11/2001  April 11, 2001 - Taipei - United Microelectronics Corp. has warned Taiwan Semiconductor Manufacturing that it may face legal action if it accepts orders from Silicon Integrated Systems Corp. (SIS).

FSA releases its 2001 Wafer and Packaging Demand Survey

04/09/2001  April 9, 2001 - San Jose, CA - The Fabless Semiconductor Association has released the results of its 2001 Wafer and Packaging Demand Survey in which 111 fabless companies participated.

Austin Area Semiconductor Executive Council Launches Eye-Opening Initiative

04/09/2001  April 9, 2001 -- AUSTIN, TX -- A new initiative aimed at creating more opportunities for those looking to get into the high tech field has been launched by the Austin Area Semiconductor Executive Council.

Hitachi claims new device narrows circuit lines

04/06/2001  April 6, 2001 - Tokyo, Japan - Hitachi Ltd. has unveiled a device that reportedly could extend the useful lives of today's steppers into tomorrow's future generations of microprocessors.

International Rectifier launches new buck controller

04/06/2001  April 6, 2001 - El Segundo, CA - International Rectifier Corp. has unveiled its new synchronous buck controller IC for on-board DC-DC converter applications.

Bumping technology

04/01/2001  Addressing industrial issues is key

TSMC's 0.15-micron technology in volume production

03/26/2001  Taiwan Semiconductor Manufacturing Company (TSMC), has successfully ramped 0.15-micron processes to full production status.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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