Semiconductors

SEMICONDUCTORS ARTICLES



Semitool to Include Royal Phillips Metrology In Deposition Products

07/17/2000  SEMICON West '00--July 14,2000--Semitool's Paragon line of electrochemical deposition tools will include Royal Phillips Electronics new integrated metal-film metrology system, say the companies.

Teradyne Debuts VLSI Test System

07/12/2000  SEMICON West '00--July 12, 2000--In San Jose, Cal., today, Teradyne Inc. introduced a VLSI test system that the company says will allow a full range of test capability without requiring hardware changes or system upgrades.

Boxer Cross Unveils Interconnect Measurement System

07/12/2000  SEMICON West '00--July 12, 2000--Boxer Cross unveiled a new metrology solution today in San Francisco, Calif. at the company's private exhibit at Zeum, the new art and technology center.

Compaq and Camstar Debut Semiconductor Manufacturing System

07/11/2000  CAMPBELL, Calif.--July 11, 2000--Compaq Computer Corporation and Camstar Systems, Inc. announced the release of a computer integrated manufacturing solution for semiconductor test, assembly and packaging.

Ultratech Named Exclusive Lithography Supplier by IEP/Casio

07/11/2000  SEMICON West '00--July 11, 2000--Ultratech Stepper Inc. has been awarded exclusive supplier status by IEP/Casio (Integrated Electronics & Packaging Technologies Inc.).

SVG Unveils New Lithography Systems, Receives 193-nm Order from Cypress Semiconductor

07/11/2000  SEMICON West '00--July 11, 2000--Fresh on the heels of two new product additions to its lithography portfolio, Silicon Valley Group (SVG) Lithography Systems has received an order for its Micrascan 193 step-and-scan lithography system from Cypress Semiconductor.

August Introduces High-Speed Wafer Defect Detection Tools

07/10/2000  SEMICON West '00--July 10, 2000--At SEMICON West, August Technology today introduced two high-speed wafer inspection systems for defects down to 0.5 ?m.

ASML Announces TWINSCAN 300mm Lithography Platform

07/10/2000  SEMICON West '00--July 10, 2000--ASML launches its first product from its new TWINSCAN 300mm photolithography platform, the AT:700S scanner.

Schlumberger Debuts Sub-Micron Metrology Tool

07/10/2000  SEMICON West '00.--July 10, 2000--In San Francisco, Calif. Schlumberger Semiconductor Solutions today introduced the next evolution of its sub-micron metrology tool, the IVS 135.

Adept FFE 200/300mm Front-End Systems Combine Wafer Sorting & SMIF Loading

07/10/2000  SEMICON West '00--July 10, 2000--Announced today in San Francisco, Calif., Adept's new Flexible Front-End Systems for 200mm and 300mm are described as combining wafer sorting and SMIF loading into one system.

Semitool Unveils Enhanced Wafer Cleaning System

07/10/2000  SEMICON West '00--July 10, 2000--Making its debut today in San Francisco, Calif., the Spectrum E automated modular batch wafer cleaning system from Semitool Inc. is the latest version of the company's Spectrum advanced surface preparation system.

Fujitsu Introduces New Stacked Packages

07/07/2000  SAN JOSE, Calif.--July 6, 2000--Fujitsu today introduced three versions of a multi-chip package with stacked flash memory and the company's fast cycle RAM.

Canon to Introduce Next-Gen Lithography Tools at SEMICON West

07/07/2000  SAN JOSE, Calif.--July 7, 2000--Canon is introducing its complete set of next-generation lithography tools at the SEMICON/West trade show.

Sony to Build Semiconductor Design Center for Broadband Applications

07/07/2000  PITTSBURGH, Penn.--July 7, 2000--Sony Electronics has announced plans to establish a semiconductor design center in Pittsburgh this fall to develop technologies for the broadband network.

Nova Measuring Instruments to Introduce Photolithography Tools

07/07/2000  SAN FRANCISCO, Calif.--July 7, 2000--Nova Measuring Instruments Ltd. will introduce a new dual-purpose integrated process control system for overlay registration measurement and full wafer macro defect inspection for photolithography manufacturing at the Semicon West show.

Nanometrics Debuts NanoSpec 9100 Automated Film Metrology System

07/07/2000  Sunnyvale, CA--July 7, 2000--Nanometrics Inc. has introduced the NanoSpec 9100, an automated, non-contact film metrology system designed to measure films on substrates used in wireless, optical telecommunication IC manufacturing and other semiconductor devices.

ST and Nortel to Develop Optical Network Support Technologies

07/07/2000  GENEVA, Swizerland--July 8, 2000--STMicroelectronics has announced that it will team with Nortel to develop optical network technology.

Motorola Semiconductor Triples Capacity, Completes 6-Inch Conversion of GaAs Fab

07/07/2000  PHOENIX, AZ--July 6, 2000--Completing the process three months ahead of time, Motorola's Semiconductor Products Sector has converted its Compound Semiconductor-1 (CS-1) Gallium Arsenide (GaAs) wafer fab facility from 4- to 6-inch wafers. The conversion triples the company's capacity.

Exitech Selects Extraction Systems' Vaporsorb II Filters

07/06/2000  FRANKLIN, MA--June 22, 2000--Exitech Ltd. of Oxford, England has selected Extraction Systems' Vaporsorb II filter technology for its 157 nm exposure tool to conduct advanced optical lithography development. The company will conduct the research in association with lithography equipment suppliers at International SEMATECH.

Dongbu Electronics Licenses Toshiba CMOS Technology

07/05/2000  TOKYO, Japan--July 5, 2000--Toshiba Corp. has agreed to license CMOS process technology to South Korea's Dongbu Electronics Co., Ltd.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts