Semiconductors

SEMICONDUCTORS ARTICLES



Leti launches emulator service to boost ROI and speed time to market for European chipmakers

08/31/2017  Leti, a technology research institute of CEA Tech, and Mentor, a Siemens business, today announced Leti will provide access to the Mentor Veloce emulator to SMEs and startups and will introduce emulation technology to global companies beginning Q3 2017.

Silicon solves problems for next-generation battery technology

08/30/2017  Silicon - the second most abundant element in the earth's crust - shows great promise in Li-ion batteries, according to new research from the University of Eastern Finland. By replacing graphite anodes with silicon, it is possible to quadruple anode capacity.

Researchers validate UV light's use in improving semiconductors

08/29/2017  A discovery by two scientists at the Energy Department's National Renewable Energy Laboratory (NREL) could aid the development of next-generation semiconductor devices.

Two-dimensional semiconductor process and device simulator MicroTec: Development status update

08/28/2017  Siborg Systems Inc. develops new tools for practical optical sensor prototype development using MicroTec.

Littelfuse to acquire IXYS Corporation

08/28/2017  Acquisition significantly expands capabilities across high growth power semiconductor markets.

The ConFab announces mainstream semiconductor and emerging technologies 2018 conference focus

08/28/2017  The ConFab – an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – announces the 2018 event will be held at THE COSMOPOLITAN of LAS VEGAS on May 20-23.

New results reveal high tunability of 2-D material

08/28/2017  Berkeley Lab-led team also provides most precise band gap measurement yet for hotly studied monolayer moly sulfide.

SparkLabs launches $50M early-stage fund for South Korea

08/25/2017  SparkLabs Group, a network of accelerators and funds, is launching a $50 million early-stage fund (Series A & B) primarily focused on South Korea.

Analysis of global lithography metrology equipment market

08/25/2017  The lithography metrology equipment market is riding on the high wave of the semiconductor industry.

Recipe for safer batteries -- Just add diamonds

08/25/2017  Drexel researchers show nanodiamonds can prevent short-circuits and fires in lithium batteries.

Bond dissociation energies for transition metal silicides accurately determined

08/23/2017  American researchers develop method to determine bond dissociation energies for transition metal silicides to advance computation efforts and general understanding of chemical bonding.

Gary Locke joins nLIGHT, Inc. Board of Directors

08/23/2017  nLIGHT, Inc., a U.S. company in high-power semiconductor and fiber lasers, today announced the appointment of Gary Locke to its board of directors effective immediately.

North American semiconductor equipment industry posts July 2017 billings

08/23/2017  North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in July 2017.

SiFive and Rambus to provide IP to the 'DesignShare' economy

08/22/2017  SiFive, the first fabless provider of customized, open-source-enabled semiconductors, today announced it will partner with Rambus to make Rambus cryptography technology available for the SiFive Freedom platforms.

Silego announces shipping more than 3 billion configurable mixed-signal ICs

08/22/2017  Silego Technology today announced shipping three billion units since its introduction of the pioneering Configurable Mixed-signal ICs (CMICs). In addition, Silego announced it shipped more than one hundred million units in the month of July.

LTX-Credence ships the 600th PAx test system for testing RF front end devices

08/22/2017  LTX-Credence shipped the 600th PAx test system to Skyworks Solutions, Inc.

MRSI Systems launches high speed die bonder for photonics high volume manufacturing

08/22/2017  MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support photonics customers’ high volume manufacturing requirements.

Semiconductor industry capital spending forecast to jump 20% in 2017

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

TowerJazz and Tacoma announce a partnership for a new 8-inch fabrication facility in Nanjing, China

08/21/2017  TowerJazz to gain up to 50% of the planned fab loading capacity.

SEMI Foundation celebrates New York State United Teachers, Recognizes Applied Materials & KLA-Tencor Volunteers of the Year

08/21/2017  The SEMI Foundation today announced that it will be celebrating its 10th anniversary of partnership with New York State United Teachers (NYSUT) on August 22-23 in Latham, New York at the NYSUT headquarters.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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