Semiconductors

SEMICONDUCTORS ARTICLES



Tailored probes for atomic force microscopes

08/10/2016  3-D laser lithography enhances microscope for studying nanostructures in biology and engineering/ publication in Applied Physics Letters.

POET Technologies announces milestone toward commercialization integrated opto-electronics tech platform

08/10/2016  The milestone achieved is the first demonstration of functional Hetero-junction Field Effect Transistors (HFETs) down to 250nm effective gate lengths on the same proprietary epitaxy and utilizing the same integrated process sequence that was previously used to demonstrate high performance detectors.

Expanded focus areas and opportunities to exhibit at SEMICON Europa

08/10/2016  Europe's largest electronics manufacturing exhibition SEMICON Europa (25-27 October) will take place in Grenoble at ALPEXPO.

Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fill

08/09/2016  Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Toshiba debuts new technology, highlights latest memory and storage products at Flash Memory Summit

08/09/2016  Toshiba America Electronic Components, Inc. (TAEC) will be on hand at the Flash Memory Summit (FMS) this week to showcase its latest memory and storage solutions.

NREL technique leads to improved perovskite solar cells

08/09/2016  Scientists at the Energy Department's National Renewable Energy Laboratory (NREL), in collaboration with researchers at Shanghai Jiao Tong University (SJTU), devised a method to improve perovskite solar cells, making them more efficient and reliable with higher reproducibility.

Smarter self-assembly opens new pathways for nanotechnology

08/08/2016  To continue advancing, next-generation electronic devices must fully exploit the nanoscale, where materials span just billionths of a meter. But balancing complexity, precision, and manufacturing scalability on such fantastically small scales is inevitably difficult.

Making a solar energy conversion breakthrough with help from a ferroelectrics pioneer

08/08/2016  Philadelphia-based team shows how a ferroelectric insulator can surpass shockley-queisser limit.

Diamond-based light sources could lay a foundation for quantum communications of the future

08/08/2016  Electrified quantum diamond could become the heart of quantum networks and computers of the future.

ON Semiconductor joins Automotive Equipment Supplier Association

08/05/2016  ON Semiconductor (Nasdaq: ON) this week announced that it is joining the Original Equipment Suppliers Association.

IBM scientists imitate the functionality of neurons with a phase-change device

08/05/2016  Technology could lead to the development of neuromorphic computers with highly co-located memory and processing units to speed up cognitive computing and analyze IoT Big Data.

Cascade Microtech releases 1/f measurement solution with Keysight Technologies

08/05/2016  Cascade Microtech today announced the release of a comprehensive low-frequency noise measurement solution for device modeling, characterization and reliability testing with MeasureOne solution partner Keysight Technologies.

Park Systems launches Park NX20 300mm research AFM with full 300mm semiconductor wafer scan

08/05/2016  Park Systems announced NX20 300mm, the only AFM on the market capable of scanning the entire sample area of 300mm wafers using a 300mm vacuum chuck while keeping the system noise level below 0.5angstrom RMS.

Microsemi announces production release of second generation high performance Flashtec NVMe controllers

08/04/2016  Microsemi Corporation today announced the production release of its Flashtec NVM Express (NVMe)2032 and NVMe2016 controllers.

Intel appoints new CIO

08/04/2016  Intel appointed Paula Tolliver as corporate vice president and chief information officer (CIO), replacing Kim Stevenson who will take on a new role at the company.

Samco opens new office in Malaysia

08/04/2016  Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.

Huge 2H16 spending surge expected from Samsung, TSMC, and Intel

08/04/2016  Combined outlays from the “Big 3” spenders is forecast to almost double in 2H16 over 1H16.

Mouser Electronics appoints new VP to run Japan operation

08/03/2016  Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, today announced the appointment of Sam Katsuta as Vice President of Mouser Electronics-Japan.

GLOBALFOUNDRIES appoints Wallace Pai as General Manager to oversee China business development

08/02/2016  GLOBALFOUNDRIES announced that Wallace Pai has been appointed as vice president and general manager of China.

Global semiconductor sales increase in second quarter

08/02/2016  The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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