Issue

To succeed as a player in the analog space, foundries must think like analog IDMs that have demonstrated time and again how to design, develop and manufacture best-in-class analog products. Lou N. Hutter, Dongbu HiTek Co., Ltd., Seoul, S. Korea

As energy costs and environmental concerns escalate, the subfab offers opportunities for significant economies without raising the carbon footprint of IC manufacturing. P. Chandler, A. Neuber, P. Fisher Applied
Materials, Santa Clara, CA USAAs energy costs and environmental concerns escalate, the subfab offers opportunities for significant economies without raising the carbon footprint of IC manufacturing. P. Chandler, A. Neuber, P. Fisher Applied Materials, Santa Clara, CA USA

Interest in power management is fueled by the explosion of portable power and consumer electronics, however, the technical requirements are quite rigorous across silicon, metallization, and packaging. Lou Hutter, Felicia James, Dongbu HiTek, Seoul, S. Korea

To effectively reduce energy consumption for the longterm, companies must identify energy-intensive operations, develop a strategy to achieve appropriate reductions in the near- and long-term, and encourage a corporate culture committed to further improving energy effciency in all aspects of operation. Sunil Thekkepat, Texas Instr ume nts, Dallas, TX USA

Successful volume manufacturing for varied advanced packaging processes demands innovation and joint collaboration efforts within the entire manufacturing and equipment supply chain. Manish Ranjan, Ultratech, San Jose, CA USA

The electroless deposition of nickel and gold (ENIG) is a well established process for printed circuit board manufacturing; applied to electronic wafers, it offers a cost efficient under bump metallization for soldering, Ag sintering or gluing applications. Dirk K??hler, Fraunhofer Institute for Silicon Technology ISIT, Itzehoe, Germany