Table of Contents
Solid State Technology
Year 2009 Issue 12
| COLUMNS-
Editorial Follow us on Facebook!
Pete Singer Editor-in-Chief
Industry Forum Taiwan DRAM consolidation: Where's the money coming from?
The Taiwan government faces real challenges in raising the capital for its DRAM consolidation effort, and it will expect the dubt to be repaid to its state-owned banks. Rupert Hammond-Chambers, US-Taiwan Business Council, Arlington, VA USA
|
|
DEPARTMENTS
World News.html World News
Tech News Targeting 22nm and beyond copper electroplating
Tech News New transistor noise model helps ID defects in gate stacks
Tech News IBM pushes AFM to image molecular structure
Tech News Mentor tips plans for unified Si test, yield analysis
Product News.html Product News
| |
FEATURES
Cover Article_ An analysis of potential 450mm CMP tool scaling questions
Simulations suggest that if the polishing pressure, relative sliding speed, and mean slurry thickness are held constant when scaling to 450mm, then slurry consumption will increase moderately and the wafer and pad temperature will be essentially unchanged. Leonard Borucki, Ara Philipossian, Araca Inc., Mesa, AZ USA; Michael Goldstein, Intel Corp., Santa Clara, CA USA
300mm Prime 300mm Prime and the prospect for 450mm wafers
300mm Prime efforts to date have failed to achieve the program goals of a 50% cycle time reduction and 30% cost reduction; however, simulations suggest that 450mm will be able to at least deliver close to a 30% cost reduction. Scotten W. Jones, IC Knowledge LLC, Georgetown, MA USA
New Materials EUVL resist and materials development for the 22nm node and beyond
The consortia model minimizes cost and risk, and seems to have emerged as the preferred business model to facilitate EUV introduction. Warren Montgomery, CNSE assignee to sematech; Bryan Rice, Intel assignee to sematech, Austin, TX USA
Coat_develop_bake Defect reduction using POU filtration in a new coater/developer
How defectivity improvements via enhanced point-of-use (POU) resist filtration can be reproduced on next-generation process equipment. Toru Umeda, Shuichi Tsuzuki, Toru Numaguchi, Pall Corp., Inashiki-gun, Ibarakiken, Japan
| |
|