Issue



Table of Contents

Solid State Technology

Year 2009
Issue 11

COLUMNS

Editorial


A reality check with Intel

Pete Singer, Editor-in-Chief


Industry_Forum


Technology development and commercialization velocity

Combinatorial development methods are especially useful in the memory sector because operating margins are low, and the difference between profit and loss is driven not by production capacity but by the technology mix of that capacity in the fabs.David Lazovsky, Intermolecular Inc.


DEPARTMENTS

World_News.html


World News


Tech_News


Ultratech: Melt LSA at sub-16nm, readying for FinFETs


Tech_News


S??ss MicroTec banks on ATM in new 3D probe station


Tech_News


KLA-Tencor goes for 2xnm trifecta


FEATURES

Cover_Article


Comparing SOI and bulk FinFETs: Performance, manufacturing variability, and cost

At the 22nd technology node, density scaling expectations are such that FinFETs begin to offer tangible advantages over planar technology.Horacio Mendez, SOI Industry Consortium; David M. Fried, IBM; Srikanth B. Samavedam, Freescale Semiconductor; Thomas Hoffmann, IMEC, Bich-Yen Ngyuen, Soitec


Advanced_Packaging


WCSP continues to grow as challenges are met

Today's challenges for wafer chip scale packaging (WCSP) are being met, and the path for the next gnerations of packaging—that will include integrating technologies and 3D structures—is evolving, David Stepniak, Craig Beddingfield, Chris Manack, Rajiv Dunne, Texas Instruments


Facilities


In situ monitoring for semiconductor fab chemical supplies

Though routine monitoring of chemical supplies is rare, it reduces human and mechanical error, improves process yield, and costs less than the labor needed to correct a single major incident.Marcus Kavaljer, Marja Kivenheimo, K-Patents OY; Ville Voipio, Janeesko OY; Thomas J. Moseman, NXP Semiconductor