Table of Contents
Solid State Technology
Year 2009 Issue 11
| COLUMNS
Editorial A reality check with Intel
Pete Singer, Editor-in-Chief
Industry_Forum Technology development and commercialization velocity
Combinatorial development methods are especially useful in the memory sector because operating margins are low, and the difference between profit and loss is driven not by production capacity but by the technology mix of that capacity in the fabs.David Lazovsky, Intermolecular Inc.
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DEPARTMENTS
World_News.html World News
Tech_News Ultratech: Melt LSA at sub-16nm, readying for FinFETs
Tech_News S??ss MicroTec banks on ATM in new 3D probe station
Tech_News KLA-Tencor goes for 2xnm trifecta
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FEATURES
Cover_Article Comparing SOI and bulk FinFETs: Performance, manufacturing variability, and cost
At the 22nd technology node, density scaling expectations are such that FinFETs begin to offer tangible advantages over planar technology.Horacio Mendez, SOI Industry Consortium; David M. Fried, IBM; Srikanth B. Samavedam, Freescale Semiconductor; Thomas Hoffmann, IMEC, Bich-Yen Ngyuen, Soitec
Advanced_Packaging WCSP continues to grow as challenges are met
Today's challenges for wafer chip scale packaging (WCSP) are being met, and the path for the next gnerations of packaging—that will include integrating technologies and 3D structures—is evolving, David Stepniak, Craig Beddingfield, Chris Manack, Rajiv Dunne, Texas Instruments
Facilities In situ monitoring for semiconductor fab chemical supplies
Though routine monitoring of chemical supplies is rare, it reduces human and mechanical error, improves process yield, and costs less than the labor needed to correct a single major incident.Marcus Kavaljer, Marja Kivenheimo, K-Patents OY; Ville Voipio, Janeesko OY; Thomas J. Moseman, NXP Semiconductor
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