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July 6, 2012 — “MEMS will continue to see steady, sustainable, double-digit growth for the next 6 years, with 20% compound average annual growth (CAGR) in units and 13% growth in revenues, to become a $21 billion market by 2017,” said Laurent Robin, Activity Leader, Inertial MEMS Devices & Technologies at Yole Développement, which published its “Status of the MEMS Industry” report.

Figure. MEMS forecast through 2017. SOURCE: Yole.

Almost all micro electro mechanical systems (MEMS) players had a growth in sales in 2011 compared to 2010. Companies involved in inertial sensors and microphones are growing the most. New MEMS devices will emerge in the forecast period, with some experiencing >90% CAGR.

Yole expects continued strong growth in motion sensing and microfluidics, segments of the MEMS market that will grow to 25% (motion sensing accelerometers, gyroscopes, magnetometers and combos) and 23% (microfluidics) of the total MEMS arena in 2017.

Yole broke out combo sensors as a separate category in its market data and forecasts this year. The market for discrete inertial sensors is beginning to decline, but the growth for inertial combo solutions will be huge. Combo sensors will grow from <$100 million today to a $1.7 billion opportunity by 2017.

The MEMS market is still very fragmented, with limited high-volume MEMS applications. New MEMS devices and emerging-MEMS devices are hitting markets or nearing completion. Some of them have the possibility to ramp up to large volumes quickly: especially those that can be applied to mobile devices (RF MEMS switches, oscillators, auto-focus MEMS, etc). New sensors — humidity, touchscreen — and actuators — switches, energy harvesting — are driving future growth. Existing sensors are also expanding into new market spaces, sometimes using new types of integration (e.g. pressure sensors).

The report includes case studies on the STMicroeletronics (ST) and Bosch business models, as STMicroeletronics is becoming the dominant player in MEMS. ST has been able to diversify its MEMS offer with a wide range of MEMS devices and 90% of its IDM business done with 2 devices only (accelerometers, gyroscopes). It anticipated the growth with early investment in high-volume manufacturing infrastructure with an 8” wafer production line and diverse partnerships to speed time to market and enlarge its product offering. Bosch benefits from its captive fab infrastructure primarily dedicated to automotive applications, which helps Bosch to decrease prices.

In 2011, both the number and values of MEMS mergers and acquisitions (M&A) boomed. A total of $1.7B MEMS acquisition value was realized in 2011. Early-stage MEMS companies are acquired at high prices — SensorDynamics, Pixtronics — because there are a limited number of private candidates with solid technology. Large companies are looking to enter the attractive MEMS market, placing high value on these targets.

Companies cited in the report:

AAC, AGILTRON, AICHI MI, AKM, ALPS, ALTIS, AMKOR, ANALOG DEVICES, APPLE, ASE, ASIA PACIFIC MICROSYSTEMS, ASMC, AUDIOPIXELS, AVAGO TECHNOLOGIES, BAE, BLUECHIIP, BOEHRINGER INGELHEIM MICROPARTS, BSE, BTENDO, CANON, CAVENDISH KINETICS, CEA LETI, COLIBRYS, DEBIOTECH, DELFMEMS, DENSO, DISCERA, DNP, DRS, ENDVCO, EPCOS, EXCELITAS, FAUN INFRARED, FLIR SYSTEMS, FORMFACTOR, FOXCONN, FREESCALE SEMICONDUCTOR, FUJITSU, GE SENSING, GETTOP, GLADIATOR TECHNOLOGIES, GLOBAL FOUNDRIES, GOERTEK, GOODRICH-AIS, HEWLETT PACKARD, HITACHI, HONEYWELL, HOSIDEN, IDT, IMEC, IMT, INFINEON TECHNOLOGIES…

The 2012 edition of “Status of the MEMS Industry” includes MEMS device markets, key players strategies, key industry changes and trends and MEMS financial analysis. It also includes major MEMS manufacturing evolutions as well as an update on the “emerging” MEMS devices markets.

The Status of the MEMS industry report is written by Eric Mounier, PhD, co-founder and market analyst for MEMS, equipment and material, at Yole Développement and Laurent Robin, head of MEMS & Sensors market research at Yole Développement.

Yole Développement is a group of companies providing market research, technology analysis, strategy consulting, media in addition to finance services. Learn more at www.yole.fr.

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July 4, 2012 — Worldwide sales of semiconductors reached $24.4 billion for the month of May 2012, a 1.4% increase over April’s sales of $24.1 billion, reports the Semiconductor Industry Association (SIA).

Figure. Worldwide Semiconductor Revenues. SOURCE: WSTS and SIA.

Combined global sales for the March-April-May period increased over December-January-February by the highest rate (6.4%) since June 2010. Additionally, May marked the third consecutive month that sales have grown over the previous month — the longest streak of sequential monthly growth since September 2010. However, sales from May 2012 were 3.4% lower than the May 2011 total of $25.2 billion, and 2012 year-to-date sales were lower across all regions than at this time last year. All monthly sales numbers represent a three-month moving average.

Tables. May 2012 Semiconductor Sales

 

Month-to-Month Sales ($B)

Market

Last Month

Current Month

% Change

Americas

4.56

4.48

-1.8%

Europe

2.82

2.84

0.8%

Japan

3.38

3.35

-0.6%

Asia Pacific

13.31

13.71

3.1%

Total

24.07

24.39

1.4%

Year-to-Year Sales ($B)

Market

Last Year

Current Month

% Change

Americas

4.63

4.48

-3.2%

Europe

3.29

2.84

-13.6%

Japan

3.34

3.35

0.4%

Asia Pacific

13.98

13.71

-1.9%

Total

25.24

24.39

-3.4%

Three-Month-Moving Average Sales ($B)

Market

Dec/Jan/Feb

Mar/Apr/May

% Change

Americas

4.41

4.48

1.6%

Europe

2.72

2.84

4.4%

Japan

3.38

3.35

-0.7%

Asia Pacific

12.41

13.71

10.5%

Total

22.92

24.39

6.4%

“The upward trend of global semiconductor sales is encouraging,” said Brian Toohey, president & CEO, Semiconductor Industry Association. “Recent sales totals are in line with industry projections of modest growth for the remainder of 2012, but a sluggish global economy continues to provide substantial headwinds, limiting more robust growth.”

Regionally, semiconductor sales increased in Asia Pacific (10.5%), Europe (4.4%) and the Americas (1.6%) over a three-month moving average, but fell slightly in Japan (-0.7%). However, Japan realized an increase in sales from May 2011 to May 2012 (0.4%), while Asia Pacific (-1.9%), the Americas (-3.2%) and Europe (-13.6%) all saw year-to-year decreases.

The Semiconductor Industry Association (SIA) represents the US semiconductor industry. Learn more at www.sia-online.org.

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July 2, 2012 – GLOBE NEWSWIRE — Micron Technology Inc. (Nasdaq:MU) will acquire and support bankrupt DRAM maker Elpida Memory Inc.’s assets, paying 200 billion Yen (approximately US$2.5 billion) total consideration, less certain reorganization proceeding expenses. Micron has been the favored candidate to take over the DRAM maker since Elpida declared bankruptcy in Tokyo courts in February.

Micron will acquire 100% of the equity of Elpida for 60 billion Yen (approximately US$750 million) to be paid in cash at closing. In addition, 140 billion Yen (approximately US$1.75 billion) in future annual installment payments through 2019 will be paid from cash flow generated from Micron’s payment for foundry services provided by Elpida, as a Micron subsidiary.

As a result of these payments, all pre-petition debt obligations of Elpida will be fully discharged under the corporate reorganization proceedings. "Micron’s sponsorship of Elpida will enable stable payment of creditor claims and help to streamline approval of the reorganization plan by the creditors and the Tokyo District Court," said Yukio Sakamoto, co-trustee of Elpida.

More to the story:

The agreement also calls for Micron to provide certain financing support for Elpida capital expenditures, subject to specified conditions, and to maintain Elpida’s operations and employees. Elpida’s assets include a 300mm DRAM fab in Hiroshima, Japan; an approximate 65% ownership interest in Rexchip, whose assets include a 300mm DRAM fabrication facility located in Taiwan; and a semiconductor assembly and test facility located in Akita, Japan. In a related transaction, Micron also announced today a separate agreement with Powerchip Technology Corporation, a Taiwanese corporation, and certain of its affiliates to acquire the Powerchip group’s 24% share of Rexchip Electronics Corporation for approximately 10 billion NTD (approximately US$334 million). Together with the Rexchip shares acquired from Powerchip, Micron will control approximately 89% of Rexchip’s outstanding shares. The fab assets of Elpida and Rexchip together can produce more than 200,000 300mm wafers per month, which would represent an approximate 50% increase in Micron’s current manufacturing capacity.

The acquisition join’s Elpida’s portfolio of mobile-enabled DRAM chips with Micron’s enterprise DRAM solutions for networking and servers. Micron will also balance its DRAM assets with NAND and NOR Flash memory architectures.

The transactions are subject to certain conditions, including approval by Elpida creditors, the Tokyo District Court, and other customary antitrust approvals. Elpida’s reorganization plan is currently anticipated to be submitted to the Tokyo District Court for approval in August 2012. The transactions are expected to close in the first half of calendar 2013. Micron’s purchase of the Powerchip group’s Rexchip shares will occur upon close of the Elpida transaction.

Elpida Memory Inc. manufactures DRAM chips. Elpida’s portfolio features such characteristics as high-density, high-speed, low power and small packaging profiles. More information can be found at http://www.elpida.com.

Micron Technology Inc. (NASDAQ:MU) manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. To learn more, visit www.micron.com.

Visit the Semiconductors Channel of Solid State Technology!

June 28, 2012 — Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 at the Moscone Center in San Francisco, CA.

More previews:

Wafer fab and handling products

Packaging products

450mm WaferSense auto vibration system

CyberOptics Semiconductor added a 450mm form factor to its WaferSense Auto Vibration System family. Users put the wireless, wafer-like product through semiconductor fabrication processes to measure vibrations of wafer transfers in x, y and z dimensions. It can be used to observe and optimize wafer, cassette, SMIF and FOUP motions without exposing process areas to the environment. The data helps establish yield-based vibration standards for equipment, identify vibration sources, and set acceptable acceleration parameters for equipment. Companion vibration monitoring software allows engineers to set  low, high, and band pass filters of equipment vibration frequencies to troubleshoot for vibration-related contamination. The software allows engineers to collect and display acceleration data wirelessly to see the effects of adjustments in real-time. CyberOptics Semiconductor, South Hall, Booth 2406.

Low-cost cryogenic probe station

Lake Shore Cryotronics Inc. will feature its range of cryogenic and cryogenic-free probe stations. The Model TTPX cryogenic probe station is a lower-cost cryogenic micro-manipulated probe station, used for non-destructive testing of devices on full and partial wafers up to 51mm (2”) in diameter. The TTPX measures electrical, electro-optical, parametric, high Z, DC, RF, and microwave properties of materials and test devices. A wide selection of probes, cables, sample holders, and options enable customization for specific measurement applications. Other models are available to meet a variety of parameters, including magnet field, maximum number of probe arms, standard temperature range, high and low temperature options, maximum sample size, vacuum, and sample stage rotation. Lake Shore will also be highlighting the new lower-cost cryogen-free probe station, the Model CRX-6.5K. Lake Shore Cryotronics Inc., Booth 6458.

Hall effect measurement system

Lake Shore’s new 8400 Series Hall Effect Measurement System (HMS) uses AC Hall effect measurement to support researchers exploring the electronic and magneto-transport properties of low mobility electronic materials. The 8400 Series can measure Hall mobilities down to 10-3cm2/Vs, suiting solar cell, organic electronics, transparent conducting oxides, III-V and III-VI semiconductors, magnetoresistors, and other materials. Lake Shore Cryotronics Inc., Booth 6458.

X-Ray diffractometer and reflectometer

Jordan Valley’s Delta-X is a new-generation flexible X-ray diffraction instrument for materials research, process development, and quality control. Featuring fully automated source and detector optics with a horizontal sample mounting, the system can switch between standard and high resolution X-ray diffraction, and X-ray reflectivity modes under full computer/recipe control without the need to manually change configurations. Measurements can be run partially or fully automated, with user-customizable scripts handling the routine work. It is also possible to run the tool in a completely manual mode, to enable the development of new methods or to investigate new materials. Analysis of the data can be fully automated as part of the measurement routine, or analyzed off-line if required. Using RADS and REFS in automated mode, developed for semiconductor manufacturing lines, allows routine analysis to be performed and reported without any user intervention. RADS and REFS can also be installed off-line to allow more detailed analysis. It features high-precision sample positioning and scanning with 300mm Eulerian cradle and full 300mm wafer horizontal mounting and mapping. Pole figures and residual stress measurements are possible due to 100° tilt (Chi) and unlimited azimuthal rotation (Phi). Jordan Valley Semiconductors Ltd., Booth 2141.

Transmission X-ray topography system

The JV QC-TT is a dedicated quality control tool for non-destructive detection of crystalline defects in semiconductor wafers. It inspects Si, GaAs, InP, Sapphire, SiC and other substrates up to 300mm wafers. The tool supports dual resolution for fast detection and detailed examination of defects. Defects include edge defects, fault lines, slip lines, point detects, and embedded defects. Full wafer scan or selected areas scans are possible. X-ray topography can also be used to detect the first “known good wafer” in the ingot. The QC-TT eliminates the “defect-etching” process and the use of hazardous etching chemicals, with faster throughput. The JV-SIA software suite supports reporting on defects and creating defect maps and lists. Jordan Valley Semiconductors Ltd., Booth 2141.

In-line 450mm X-Ray imaging system

The JV SENSUS 450mm/300mm in-line system detects crystalline non-visual defects (NVD) such as edge defects, fault line & slip lines within substrate or product wafers using Transmission X-Ray diffraction. The product solves key issues in the use of expansive 450mm wafers in manufacturing environment, where the thermal stresses on larger wafer are much higher and the wafers are subjected to many more handling steps. Metrology can cover fast selected region or full wafer scan options. Cracks observed in the X-ray images can help determine if the wafer will break during annealing. It can also be used to search for the first “known good wafer” in the ingot. A slice is taken from the ingot and a measurement performed on the JVSenus. The absence of slip and other defects indicates the good region of ingot which can be used. The tool uses JV-SIA software. Jordan Valley Semiconductors Ltd., Booth 2141.

Super-resolution digital microscope

KEYENCE’s VHX Series Digital Microscope integrates advanced zoom optics with a CCD camera and 17” display, light source, controller, and analysis/reporting software. It offers a magnification range from 0.1x – 5000x. Many lighting techniques are also supported including bright and dark field, transmitted, polarized, and differential interference observation. A color filter wheel allows users to choose a specific wavelength (red, green or blue) of light for their samples. A Super Resolution mode combines the blue filter with KEYENCE’s pixel shift technology, capturing images with 25% better resolution. The VHX-2000 can be equipped with a motorized XY stage along with motorized Z-axis lens control. Users can adjust movement in all three axes by using an included control pad. The Image Stitching function can now be completed with just the push of a button, and at much higher speeds, to produce up to a 20,000 x 20,000 pixel image that expands the viewing area by up to 200 times. Automated measurement functions simplify measurement tasks and help to remove variation between different users. The system also has the ability to save a portion of the image/measurements as a template to be used to measure future samples. KEYENCE, Booth 6651.

3D laser scanning microscope

The new KEYENCE VK-X Series 3D Laser Scanning Microscopes combine the capabilities of SEMs and non-contact roughness gauges with the simplicity of an optical microscope. It boasts 0.5nm Z-axis resolution with a magnification range spanning 200x to 24,000x. Usability and ease-of-use have been improved with the addition of the AI-Scan function, allowing users to easily image and measure a target. A short-wavelength laser scans across a target to provide non-contact profile, roughness and thickness measurements, even on targets with highly-angular surfaces.  By combining the laser with an industry-leading, 16-bit photomultiplier, the VK-X can obtain an image and measurement on nearly any type of material, as well as thickness measurements on transparent films and coatings. In order to simplify the operation of the VK-X, the AI-Scan function was developed to automate the scanning process.  Users can simply place their sample on the stage, and by clicking a single button, the system will automatically adjust the sensitivity of the photomultiplier, set the upper and lower limits of the scan range and re-scan the target as needed to make sure all of the necessary information was captured.  By using this function, even inexperienced users can quickly and easily obtain accurate measurement data and high-resolution images. Additional features include a new WIDE-Scan function that is 8x faster than conventional laser scanning microscopes, while also improving the quality of the captured image.  A high-speed auto-focus algorithm has been incorporated into the system, and images can be captured at up to 21.6 megapixels.  All of the measurement functions from our previous VK Series product line have been extended to the VK-X, including the ability to measure the thickness or profile/roughness of transparent materials. KEYENCE, Booth 6651.

RoHS, WEEE & REACH testing & certification

Manufacturers of electrical and electronic equipment who export to the European Union must comply with the REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals), WEEE (Waste of Electrical and Electronic Equipment) and RoHS (Restriction of Hazardous Substances) Directives, or risk losing access to market. TÜV Rheinland provides consulting, testing and labeling services for manufacturers and importers on all matters to do with the requirements of these directives to help companies gain European approvals. TÜV Rheinland, Booth 1825.

Top-load burn-in socket

Aries Electronics is introducing a top-load burn-in socket for new IC pin-out designs. It is delivered in 4 weeks at about $200 tooling costs, compared to other options that take up to three months and run over $30,000. Based on a modular design, the new socket can easily be configured to accommodate devices on 0.3mm-pitch and above, and can be used with BGA, µBGA, QFN, LGA and bare dies as well as a number of other devices like those used for MEMS testing with high acceleration rates. The top load socket helps reduce device damage for equipment under test (EUT) by minimizing several points of over-compression and errors in device insertion.  Devices are loaded and unloaded on the top of the socket without compressing the socket or holding it down.  When engaged, the socket also avoids over-compression with pressure pads that cover a larger surface area to distribute force on the device. A built-in hard stop also reduces insertion force on the PCB. The socket comes in a top load configuration, ready for device insertion, so no special tooling or push plates are required. The manual dual latches can be removed to allow the socket to open when the force is removed for efficient and quick testing of multiple devices. They are mounted and removed from the test board via 2 stainless steel alignment pins. The compression spring probes leave minimal witness marks on the bottom surface of the device pads for increased reliability. Compression spring probes are constructed of heat-treated beryllium-copper, and plated with a minimum of 30 micro inches gold per MIL-G-45204 over a minimum of 30 micro inches nickel per SAE-AMS-QQ-N-290. Contact forces are 15g/contact on a 0.30mm to <0.40mm pitch; 16g/contact on a 0.40mm to <0.50mm pitch and 25g/contact on pitches of 0.50mm or larger.  Estimated contact life is a minimum of 500,000 cycles and operating temperature is -55° to +150°C. Aries Electronics Inc., North Hall, Booth 6063.

 

“Smart” spectrometer

The Exemplar from B&W Tek is a miniature spectrometer with an embedded processor to enable on-board data processing, including averaging, smoothing, and automatic dark subtraction. In addition to these “smart” capabilities embedded directly into its compact form factor, the Exemplar also features “SuperSpeed” USB 3.0 communication with a data transfer of 900 spectra per second. Multichannel capabilities deliver an ultra-low trigger delay of 14 nanoseconds and a gate jitter of +/-1 nanosecond. The ability to control the CCD exposure time to within one microsecond allows users to have unparalleled control over the spectra’s signal-to-noise ratio. It is ideal for demanding applications such as high speed binning & sorting, reaction kinetics, and process monitoring. With the ability to support up to 16 simultaneous channels, the Exemplar is also the perfect solution for simultaneous multichannel analysis, such as multipoint sampling, and laser induced breakdown spectroscopy (LIBS). B&W Tek, Booth 2241.

Bond test tool

The Nordson DAGE 4000Plus Bondtester meets the requirements of emerging test applications including ribbon pull, pad cratering using hot pin pull, bend and fatigue testing. The 4000Plus bondtester uses the next-generation Paragon software providing semi-automatic test routines, automatic GR&R calculation, unique database search engine wizard and superior data reporting. Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), North Hall, Booth 5971.

X-ray inspection system

The Nordson DAGE XD7600NT Diamond X-ray Inspection System features the Nordson DAGE NT maintenance-free, sealed transmissive X-ray tube, providing 0.1 µm  feature recognition and up to 10 W of power, together with the 2 Mpixel XiDAT3 digital image detector makes this system the choice for the highest performance and highest magnification imaging tasks. The vertical system configuration, with the X-ray tube sitting below the isocentric ‘move and tilt’ of the detector, all controlled through the simple, joystick-free, ‘point and click’ operation of the Nordson DAGE Image Wizard Software provides the safe and collision-free inspection required for production applications. Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), North Hall, Booth 5971.

Watch the Solid State Technology website for many more product previews of SEMICON West.

Visit the Semiconductors Channel of Solid State Technology!

The high-volume consumer applications driving the fast growth of the micro electro mechanical system (MEMS) market are putting new demands on MEMS development and manufacturing. Goals? Get products to market faster, make them easier to integrate into systems, reduce die size; and better control processes to bring down costs. That’s attracted investment from the supply chain in a range of new solutions, from innovative new process technologies and tools developed specifically for MEMS sector needs, to more efficient integrated design software.

June 27, 2012 — The MEMS sector is poised for a multiyear period of steady double digit growth, with 20% average annual increases in unit demand, as systems makers find ever more uses for low cost, easy-to-integrate silicon sensors and actuators, reports Jean Christophe Eloy, founder and CEO of Yole Développement, driving the MEMS market to double, to reach $21 billion by 2017. Volume consumer markets are driving much of this growth, as consumer applications accounted for more than 50% of total MEMS industry revenue in 2011. And that’s turning the once artisanal niche into a high volume production business, and bringing rapid technology change, with a push for speeding time to market, sharply scaling down die size, increasing integration of multiple sensors into combination units, and bringing more packaging value to the wafer level. “2011 has been the year of the transition of the MEMS market into big business with wide diffusion,” says Eloy. “But the ability of MEMS manufacturers to continue to scale size and cost, and to simplify development and system integration will directly impact the growth of MEMS business.”

Figure. Common model of an accelerometer being used as a block in the control system design stage. A common model reduces design iterations by allowing teams to easily move between design stages to identify failures and optimize the system. SOURCE: Coventor.

 

Meeting time-to-market needs with more efficient design tools
While decreasing time to market and cost reduction have always been key drivers, the short product cycle times associated with mobile consumer devices have forever changed the industry. “Development time is now measured in months, not years,” notes Mattan Kamon, Coventor’s Principal Technologist. “However, design is still mostly done using traditional research approaches, where different models are used at different stages of the design, costing valuable time.” Coventor’s approach accelerates MEMS product development by using a common model for all stages of design. An engineering team can use a single model to develop and optimize the MEMS device concept, tune and validate the design using 3D simulations, perform system simulation together with the ASIC, investigate packaging effects, and optimize yield. All of these steps can be performed using a single model, enabling MEMS teams to easily move back and forth between the design stages, identify failure mechanisms, and optimize the system.

Kamon argues this methodology has the accuracy to address integration effects and can optimize the nominal behavior and the range of behavior across a wafer due to fabrication variations. Coventor’s approach couples a library of high-order finite element models specialized for MEMS with judicious use of low-order finite element simulations, and uses the same simulators, namely MATLAB, Simulink, and Cadence Virtuoso, that are most widely used for analog/mixed-signal design. This holds potential for a MEMS verification flow that closely parallels the verification flow for analog/mixed signal design, and paves the way for a fabless MEMS industry complete with MEMS design kits (MDKs).

New processes to make low-cost cavities without etching

Finnish startup Scannano proposes that MEMS die size and cost could be significantly reduced, and performance improved, by creating sealed cavities in devices by using a controlled diffusion process, instead of by the traditional method of etching sacrificial layers and bonding on a cap wafer.

Following on from research with Nokia’s Research Center and Cambridge’s Cavendish Laboratory, company founders Andrei Pavlov and Yelena Pavlova came up with the idea of shrinking away buried layers in a device by through diffusion to create a vacuum gap, allowing the use of standard CMOS materials and equipment. The process deposits a proprietary multi-layer diffusion material, builds the MEMS structure over it, and then submits it to a series of processing steps to shrink the diffusion material. This creates a very accurate sealed vacuum cavity of the desired dimensions and configuration. “The gaps can be from a few nanometers to up to a micron deep, and can be vertical or at an angle, or multiple gaps could surround a structure, opening up the possibility of new types of MEMS designs,” says Pavlov. He also claims that shrinking features to 50-100nm can also reduce operating voltage to only a few volts and reduce heat, while the very smooth surfaces help to improve sensitivity, signal-to-noise ratio and performance.

The first application for Scannano’s Deep Vacuum Gap Technology is a tunable capacitor and switch for multiband tunability for mobile phones, under development with STMicroelectronics and tentatively targeted for initial trial production on a CMOS line by the end of the year. The new device adjusts operating frequencies by changing capacitance through moving membrane-like MEMS structures, created by adjusting gap dimensions above and below the membrane. Pavlov says work with ST has been progressing for about a year, and is now moving towards final device design and testing. Scannano is also working with other European CMOS device manufacturers to develop sensors for the automotive market, monolithically integrated with the ASIC in their CMOS fabs.

Figure. MEMS structures with aspect ratios of >100:1. SOURCE: Applied Materials.

Volume markets attract investment in dedicated MEMS processes and tools

Fast growing MEMS volumes have also attracted the attention of more semiconductor players, including equipment giant Applied Materials. Applied has invested aggressively in development of new film and process technologies to support current and future generations of MEMS production at ≤200mm wafer sizes, focusing on shrinking die size, improving throughput, and integrating MEMS processes into CMOS fabs, says Mike Rosa, MEMS product line manager. This includes DRIE technology critical for both increased productivity and process flexibility as next generation MEMS devices enter the sub-micron range of critical dimensions, with aspect ratios of >100:1 (see the figure above).

Applied Materials is also working on modifying its PVD and CVD equipment to make a variety of enabling films of new materials for MEMS, including thick (>20µm), low temperature CVD films (SiO2, SiGe, etc.); and PVD films such as magnetically aligned NiFe, high uniformity AlN and thick Al.

Tool vendors will need to be increasingly attuned to the MEMS device capability and technology requirements of their customers’ customers, the fabless device designers and systems companies, notes Rosa. “In the MEMS industry there is no traditional roadmap, like the ITRS, to define the future,” he says. “It will take a much more collaborative effort by all parties — tool vendors, device manufacturers, and end-market product developers — to define and deliver the next generation MEMS designs that are destined for the newest ‘next big thing’ products.”

Also focusing on enabling tools for next generation MEMS is Nikon, with a new stepper with a large depth of focus specifically for the 200mm MEMS market. Though MEMS makers have traditionally used lower cost aligners to make their relatively large patterns, now finer features and tighter design rules may increasingly require the higher resolution and better alignment accuracy of steppers. But IC steppers are typically expensive and not well suited to the extreme topographies of MEMS. This Mini Stepper has ≤0.35µm overlay accuracy and resolution to 2µm, and depth of focus capabilities up to 26 µm for the thick resists and deformed substrates typical of MEMS, reports Junpei Fukui, Nikon Engineering assistant manager. It also offer flexible alignment to compensate for MEMS’ process-induced distortions, as well as alignment by pattern matching and backside marks.

These and other speakers including IDT, Hanking Electronics, Teledyne DALSA, Micralyne and NIST discuss solutions for growing the MEMS sector to the next level at SEMICON West, July 10 -12 in San Francisco. See http://semiconwest.org/Segments/MEMS for the complete agenda, and http://semiconwest.org/Participate/RegisterNow to register.

Read on for a SEMICON West preview from Doe on collaboration in the MEMS ecosystem.

June 27, 2012 — SEMICON West is taking place July 10-12 at the Moscone Center in San Francisco, CA. Following are new products for the lithography step of semiconductor manufacturing, including photoresist coaters and ashers.

 

Microoptics-based homogenizers in CaF2

Jenoptik is demonstrating its manufacturing capabilities for micro-optical structures in CaF2, especially for 193-266nm wavelengths, presenting various CaF2 homogenizer arrangements. Homogenizers, such as microlens arrays or diffractive optical elements (DOEs), are used in optical systems of semiconductor and flat panel display manufacturing and inspection equipment to help define the distribution of light over a particular area in a certain plane of the optical beam path. CaF2 boasts a high damage threshold. Jenoptik uses an advanced micro-structuring process with grayscale technology and a sophisticated wafer-level etching process to fabricate customized refractive, diffractive and hybrid structures even with asymmetric shapes and radii. Free geometries are generated, and the microstructuring process is reportedly accurate and reproducible with various beam distribution patterns. Standard manufacturing processes are available for optical materials such as SiO2, GaAs, GaP, Al2O3, ZnS, ZnSe, Ge, Chalcogenide, etc. Qualified testing at operating wavelength guarantees the quality of optical product properties. Jenoptik Optical Systems division, South Hall, Booth 1641.

 

Photoresist coaters

Spintrac Systems will exhibit innovations in photoresist coater technology including centering, dispensing and indexing. Many of the company’s systems work in a 24/7 production environment while others are utilized in R&D facilities in nanotechnology, flat panel displays and process chemicals. Spintrac Systems has made innovations in its photoresist coating equipment including patent-pending dual-wafer centering for quick substrate size changes; self-centering, self-calibrating Traversing Dispense Arm (TDA) for accurate positioning and unique dispensing capabilities; and proprietary indexer for compact footprint and reduced maintenance.  Spintrac Systems, Inc., formerly SITE Services, Booth 2346.

 

New technology advances and manufacturing methods

SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) will report their latest advances in new materials and device structures and lithography with a special focus on addressing key opportunities and challenges in 3D interconnect technology. Raj Jammy, SEMATECH’s vice president of Materials and Emerging Technologies, “Emerging Semiconductor Technologies – a Heterogeneous World on Silicon,” July 10 at 10:30 a.m. Paul Kirsch, SEMATECH’s director of Front End Processes, “Challenges and Opportunities in High Mobility Ge/III-V Channels and Devices,” July 10 at 2:10 p.m. Stefan Wurm, SEMATECH’s director of Lithography, “EUV Lithography: Remaining Challenges to HVM Introduction,” July 11 at 10:30 a.m. Bill Ross, ISMI’s project manager, “Tool Obsolescence and Sustaining Legacy Manufacturing,” July 11 at 1:40 p.m. SEMATECH, international consortium of leading semiconductor device, equipment, and materials manufacturers, South Hall, SEMICON West TechXPOT Stage.

 

Photoresist asher

SPEC Equipment has developed a new PC-based system for the classic GaSonics photoresist asher. The SPEC 3510 PC replaces the legacy GaSonics L3510 with improved performance and efficiency. The 3510 PC is a downstream photoresist removal system that utilizes time-tested process hardware components, while replacing legacy control items and other obsolete devices and hardware. It offers a newly designed contemporary control system, a full-color GUI, real-time graphing, and saved data recall. Users have access to full diagnostic software, real-time graphics and feedback, and unlimited process recipes with a SECS II interface. Field upgrades take about 4 hours. The new system is capable of up to 4 MFCs. It features 75-200mm wafer capabilities; GaAs, sapphire, and silicon. SPEC Equipment, Booth 647.

 

Lithography for monolithic 3D integration

Monolithic 3D has invented several techniques to obtain monolithic 3D integration with crystalline silicon transistors and copper wires at the most advanced lithography. 3D Repair and Redundancy enables reliable operation for systems with multiple logic and delay defects, and can provide a high tolerance for soft errors and field repair. Ultra large system integration can be achieved without prohibitive yield issues. Monolithic 3D’s Gate Array IC technology can be applied to producing a monolithically stacked single crystal silicon wafer scale Continuous Array with custom, etched scribelines. Chiplets can be added with functions such as I/O and analog. Monolithic 3D, Booth 6775.

Check out more exhibits previews, for front-end wafer fab tools and wafer handling products, back-end packaging products, and more.

June 26, 2012 — Solid State Technology is hosting a free webcast, 3D and 2.5D Integration: A Status Report, airing live tomorrow at noon EST/9AM PST. A fourth presenter has just been announced, Brent Przybus, Senior Director, Product Line Marketing, Xilinx Inc.

3D and 2.5D Integration: A Status Report will cover through-silicon via (TSV) formation, interposers, and other die stacking methods. What is the present status of these advanced packaging technologies?

Przybus will present

June 26, 2012 — Vacuum product and abatement system maker Edwards (NASDAQ:EVAC) introduced the iXH645H dry pump, optimized for metal-organic chemical vapor deposition, a key step in light-emitting diode (LED) and compound semiconductor (III-V materials) manufacturing.

The iXH645H delivers very high gas flow capability and can operate continuously at the high loads required for the latest-generation LED manufacturing tools. LED and compound semiconductor manufacturing processes typically use high flows of light hydrogen and highly corrosive ammonia gasses. The iXH645H reportedly offers superior hydrogen pumping performance and a corrosion-resistant design, including a patented nitrogen purge barrier to protect the pump seals. Its high-temperature capabilities help prevent condensation of any phosphorous compounds present.

Maintenance requirements are minimized to increase uptime. Advanced oil lubrication and seal technology eliminate periodic maintenance requirements, while its thermal and motor design prevent overheating, motor overloads or zones of limited operation. The pump’s optimized temperature control system ensures the pump is ready for process within approximately 30 minutes of start-up.

Also read: Growing market for LEDs fuels need for advanced abatement systems

Visit Edwards at North Hall, Booth 5351 during InterSolar and SEMICON West, taking place July 10-12 at the Moscone Center in San Francisco. More SEMICON West products here.

Edwards is a leading manufacturer of sophisticated vacuum products and abatement systems and a leading provider of related value-added services for the manufacture of semiconductors, flat panel displays, LEDs and solar cells, as well as other industries. Edwards’ American Depositary Shares trade on The NASDAQ Global Select Market under the symbol EVAC. Further information about Edwards can be found at www.edwardsvacuum.com.

Visit the LED Manufacturing Channel on Solid State Technology and subscribe to the LED Manufacturing News monthly e-newsletter!

MEMS in the mainstream — Music to my ears

June 25, 2012 — For the second year in a row, MEMS Industry Group was host to the Sensors Expo Pre-Conference Symposium, and this year’s theme was “MEMS in the Mainstream: Commercialization and Product Realization — Leveraging the MEMS Infrastructure.” I felt like a bandmaster — not trying to make the music, just trying to get the band with all its different instruments, rhythms, and tones to harmonize. 

It’s not a simple piece to orchestrate, because when you talk about commercialization and product realization and leveraging the micro electro mechanical systems (MEMS) infrastructure, you are talking about lots of different perspectives from equipment vendors to materials suppliers, from foundries to device manufacturers (some captive-fab, some fab-lite, some fabless), as well as from end-users and OEMs. Each of these “bands” has its own instrument, its own sheet music, its own style and its own “special sauce.” You can see where I am going with this analogy. Like in music, MEMS can either work like a 10-piece orchestra in total sync and harmony, or it can sound like something the cat dragged in!

Thankfully, at our Sensors Expo pre-conference, we sounded a lot more like the 10-piece orchestra. We focused on utilizing the MEMS infrastructure to produce harmonious communication with our customer and our customer’s customers, in order to get the product out in time, at cost, and in the right form factor.

Each of our presenters and panelists shared their own perspectives.  They didn’t always agree (oftentimes they didn’t) and that’s OKAY — because MEMS by its nature is not one-size-fits-all.  Approaching the topic of MEMS foundry models from differing angles, John Chong of Kionix and Rob O’Reilly of Analog Devices Inc. (ADI) both gave fantastic overviews of MEMS foundry models, digging into which approaches work for them and why.

IMT’s Craig Trautman and Silex’s Peter Himes carried the foundry discussion a little further. As foundry companies, they were able to rise above the idea that everyone should go fabless, in support of the diversity and maturity of the MEMS industry. I think Craig summed it up well when he said: “There’s no free lunch. There are pros and cons for various models of MEMS fabrication: fabless vs. captive). As a foundry, we have five customers ‘living’ at IMT. We give them free office space because a lot of the things that we do are really hard. The customer needs to collaborate to make it all work.”

I loved hearing from the end-users, and those working closest to the end-users as these are the people who are truly driving the market for MEMS (and our future). As eloquently stated by Jim Clardy of Dell, “I want to avoid end-user scenarios where people have to wave a tablet around to get magnetometer calibrated. Sensors are collecting ambient data. What are the privacy and security concerns? Data must be shared with the cloud. Someone must track the user, his/her location, etc. Whoever controls those ecosystems is going to know A LOT about the end-user. This could be an adoption barrier.”

We in the MEMS industry really need to listen to folks like Jim! We need to be thinking about the sensor fusion of all of these sensors; the security of that data; and the human who is interfacing with the device. We need to remember that MEMS is just an instrument. Sitting by itself untouched, it is nothing.  But when it’s played by the right artist, placed in the right band, it can harmonize and make beautiful music. And yes, that is music to my ears.

Contact Karen Lightman, managing director of MEMS Industry Group at [email protected], 412-390-1644. Read her other blogs: