Tag Archives: Advanced Packaging

November 8, 2011 — PVA is introducing the PVA6000 flexible coating and dispensing tool at productronica in Munich, Germany. New features based on customer feedback improve accessibility for maintenance and improve ease of use.

The updated motion platform on the PVA6000 increases stability in motion. Conformal coating and dispensing tasks are performed with a high level of accuracy and repeatability.

The PVA6000 combines PVA’s traditional extruded aluminum frame with sheet metal finishing. A hatch replaces service doors for easier access. All pneumatics, ventilation, and facilities are fully enclosed in a cabinet at the rear of the machine.

The system operates on PVA’s Portal Software, including process control and monitoring, and unlimited program storage capability, fluid level monitoring, integration of vision systems, bar code readers, flow monitors, and other options.

productronica takes place November 15-18 in Munich, Germany. Visit PVA at stand 443, hall A2.

PVA supplies conformal coating systems and fluid dispensers for solar, semiconductor packaging, printed circuit board assembly, medical device manufacturing, and consumer electronics makers. Learn more at www.pva.net.

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November 7, 2011 — SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information. This Dashboard, managed by SEMATECH’s 3D Enablement Center, will help develop standards in the 3D packaging field with the help of IEEE Standards Association, JEDEC, SEMI, and Si2.

3D heterogenous integration lacks uniform standards for key manufacturing parameters, which are neccessary for an orderly supply chain and high-volume production. Because standards are needed in many areas and over broad technology bases, the Dashboard is designed to improve information sharing, which will accelerate standard development and adoption, and avoid duplication of effort.

Companies involved in 3D production can use the 3D Standards Dashboard to find existing standards as well as to identify and track standards development activities in areas such as design, testing and production. Additionally, the 3D Standards Dashboard provides a proactive forum for facilitating collaborative discussions on perceived gaps in standardization activities and for identifying which standards development organizations (SDO) will best meet the need for a specific standardization activity.

SEMATECH, IEEE, JEDEC, SEMI, and Si2 invite fabless, fab-lite and IDM companies, outsourced semiconductor assembly and test (OSAT) suppliers, and EDA process tool and materials suppliers worldwide to participate by visiting http://wiki.sematech.org/3D-Standards.

Example of 3D packaging standards collaborations:

November 4, 2011 — Numerous global semiconductor suppliers maintain assembly and test operations in Thailand. Many of these facilities have been affected by the disaster. IHS iSuppli pulled together a list of those affected, and those that have thus-far escaped damage.

Semiconductor suppliers whose test and assembly operations have been affected include ON Semiconductor, ROHM Semiconductor, Lapis Semiconductor, Hana Semiconductor, Stars Microelectronics, Vigilant Technology, STATS ChipPac and Toshiba.

ON Semiconductor: ON Semiconductor Corporation (Nasdaq:ONNN) believes that its SANYO Semiconductor division’s Thai operations in the Rojana Industrial Park in Ayutthaya, Thailand have been severely damaged by the flood. Another facility in Bang Pa In, previously unaffected, is now flooded. Read details on ONNN’s closings here.

ROHM: Sole facility in Thailand has been closed since Oct. 19. The facility conducts assembly and test for integrated circuits, discrete transistors, diodes, resistors and tantalum capacitors. ROHM is attempting to shift production to other locations.

Lapis: Rojana Industrial Park operation is closed. Lapis is looking to supply product from alternative locations.

Hana Semiconductor, a subcontractor for Microchip, Texas Instruments (TI) and others: Thai facility is currently flooded, and no assessment is possible. TI and Microchip are relocating as much production as possible to other qualified locations.

Stars Microelectronics: Ayutthaya facility has been flooded. A subcontractor for Microchip, Stars is relocating operations to other sites and anticipates that the impact on production of Microchip

November 4, 2011 — Amkor Technology, Inc. (Nasdaq:AMKR) will convert all of its 19mm through 31mm body size plastic ball grid array (PBGA) packages to pin-gate molding (PGM) over the next few years. 

Amkor cites better quality, reliability, and performance, and potentially lower cost than traditional corner gate molding. The transition to pin-gate molding for PBGAs will also extend the use of wire-bonding for smaller silicon nodes, said Pat O

November 4, 2011 – BUSINESS WIRE — Nordson Corporation will honor the life of Steven J. Adamson, former Nordson ASYMTEK marketing specialist and electronics industry mentor, by funding a $3,000 annual scholarship in Adamson’s name with the IMAPS Educational Foundation, whose role is to support student activities related to the study of microelectronic packaging, interconnect and assembly.

Adamson passed away October 28, 2011, after a 15-month battle with cancer. Donations to the fund in his honor can be made at: www.microelectronicsfoundation.org. "This donation supports the mission of the educational fund, which Steve was instrumental in establishing. We are glad we can honor the memory of Steve in this way," said Michael O’Donoghue, executive director, IMAPS.

Just days before he passed away, Adamson received the Daniel C. Hughes, Jr., Memorial Award from IMAPS. He was IMAPS president in 2008 and chairman of the Society’s Microelectronics Foundation in 2009. Last year, he was given IMAPS’ President’s Award.

Adamson started with Nordson ASYMTEK in 1998 as applications lab manager, and most recently was market development manager for the semiconductor packaging and hard disk drive industries. He contributed to the Axiom and DispenseJet product lines. Adamson previously held positions with Kodak, Motorola in the US, and Plessey International Computers Ltd in the UK. He was awarded five US and two UK patents. Originally from the UK, he held a Higher National Certificate in Electrical Engineering from Stockport College of Technology. In 2005 he was presented an award by the San Diego Engineering Council for "Outstanding Service to Electrical Engineering."

"We will miss Steve’s creativity, intellectual curiosity, and friendship. And the industry will miss his active participation and leadership," stated Greg Hartmeier, vice president, Nordson ASYMTEK.

Memorial services will be held 4pm, Monday, November 7, 2011 at the Oaks North Golf Course Community Center, 12578 Oaks North Drive, San Diego, in the Rancho Bernardo community.

The International Microelectronics And Packaging Society (IMAPS) leads the microelectronics packaging, interconnect and assembly community. Find out more at www.imaps.org.

Nordson ASYMTEK supplies precision automated fluid dispensing, conformal coating, and jetting technologies and designs and manufactures a full line of dispensing and coating systems. For more information, visit www.nordsonasymtek.com.

Nordson Corporation information can be found on the web at www.nordson.com.

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November 4, 2011 — Test equipment maker Multitest‘s Mercury contactor passed a "thorough BGA test evaluation," landing on the qualified contactors list for all business units of an international IDM.

The IDM evaluated cost-effective test contacting with strong first pass yields (FPY). Long probe life was also an important factor.

Multitest

November 3, 2011 — Amkor Technology Inc. (NASDAQ:AMKR) honored 7 companies with its 2011 Supplier Award, presented at Amkor Supplier Day in Seoul, South Korea.

Substrate suppliers:
Samsung Electro-Mechanics Co., LTD
Unimicron Technology Corp
Samsung Techwin Co. LTD

Raw materials suppliers:
Namics Corporation
Daewon Semiconductor Packaging Industrial Co., Ltd

Equipment suppliers:
EO Technics Co., Ltd.
Oerlikon Systems

These recipients "clearly demonstrated their excellence," said JooHo Kim, Amkor’s executive vice president, worldwide manufacturing operations, noting 2011’s "extraordinary supply chain challenges" caused by the Japan earthquake and tsunami in March.

Amkor is a leading provider of semiconductor assembly and test services to semiconductor companies and electronics OEMs. Amkor’s website: www.amkor.com.

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November 2, 2011 — Henkel Corporation will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high glass transition temperature (Tg).

The material is designed for chipscale packages (CSP) and ball grid array (BGA) devices and is particularly well suited for handheld communication and entertainment applications. This high Tg underfill also provides enhanced thermal cycling performance for small pitch wafer level chip scale packages (WLCSPs) unattainable with other low Tg reworkable underfills.

It cures quickly at moderate temperatures to minimize stress to other components and, when cured, provides excellent mechanical stress protection for solder joints.

The unique formulation offers superb reworkability while maintaining excellent drop and thermal cycling protection.

The underfill, as well as lead-free solders and new electrically conductive adhesives, among others, will debut on stand 263 in hall 4 of Productronica.

Henkel operates in three business areas: Laundry & Home Care, Cosmetics/Toiletries and Adhesive Technologies. Henkel

November 2, 2011 — Henkel Corporation will launch several new electronics assembly materials at Productronica, November 15-18 in Munich, Germany. The ABLESTIK ICP-4000 has been qualified to bond components to metal leadframes in plastic housings.

The high-end conductive silicone adhesive ABLESTIK ICP-4000 offers

November 2, 2011 – Marketwire — MOSAID Technologies Inc. (TSX:MSD) launched the 256Gb HLNAND2 (HyperLink NAND) semiconductor memory device, operating at up to 800MB/s per channel for mass storage applications.

The HLNAND2 Flash memory device is a multi-chip package (MCP) with a nine die stack: eight industry-standard NAND Flash dies, and one MOSAID proprietary ASIC interface chip. The MCP is packaged in a 100-ball ball grid array (BGA) measuring 18 x 14mm.

Winpac, a semiconductor packaging and test house specializing in fine-pitch BGA and wafer-level packaging (WLP), will package and distribute HLNAND devices for MOSAID. The companies signed a 5-year manufacturing license covering the 256Gb HLNAND2 (DDR533/DDR667/DDR800) and the production-ready 256Gb HLNAND (DDR266). Winpac mantains a manufacturing facility in Gyeonggi-do, Korea, and a sales and marketing operation in San Jose, CA.

MOSAID’s HLNAND Flash Memory Specification 2 has a high-speed, point-to-point ring topology, eliminating "power-hungry on-die terminations," said MOSAID’s Jin-Ki Kim, VP of R&D. SSDs using the memory can achieve data transfer rates into the multiple Gigabyte-per-second range. With a raw data rate of up to 800MB/s per channel, and 1600MB/s per channel with DuplexRW, HLNAND2 requires only one memory channel to reach a data transfer rate on the host interface exceeding 1 GB/s. The point-to-point interface creates a clean signaling environment with reduced loading, added Kim. Product features and specs are available at www.hlnand.com.

MOSAID is showcasing its HLNAND technology, and presenting a related paper, at Operating System Support for Next Generation Large Scale Non-Volatile Random Access Memory (NVRAMOS11) in Jeju, Korea, November 7-10, 2011.

MOSAID Technologies Inc. is a leading intellectual property company in the areas of semiconductors and communications, and develops semiconductor memory technology. For more information, please visit www.mosaid.com.
 
Winpac is a semiconductor packaging and device testing company. For more information please visit www.winpac.co.kr

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