October 11, 2011 — Cascade Microtech Inc. debuted InfinityQuad, a multi-contact probe head capable of automatically probing aluminum (Al), copper (cu), or gold (Au) pads as small as 30 x 50
Tag Archives: Advanced Packaging
October 11, 2011 — All Silicon System Integration Dresden (ASSID), a microelectronics packaging center under the Fraunhofer IZM Institute, installed a single-wafer, multi-chamber AltaCVD 300 from Altatech Semiconductor in its 970sq.m. Dresden cleanroom.
ASSID started pilot production of 3D ICs using the 300mm chemical vapor deposition (CVD) tool. The AltaCVD 300 deposits conformal dielectric liners inside through silicon vias (TSV) in die stacks for 3D ICs and system-in-packages (SiP). TSV aspect ratios are up to 10:1, with hole diameters as small as 10
October 7, 2011 — DuPont Microcircuit Materials, part of DuPont Electronics & Communications, uncrated its DuPont GreenTape 9K5 low temperature co-fired ceramic (LTCC) packaging material, offering good dielectric constant properties for higher speed, frequency, and reliability applications.
GreenTape 9K5 suits LTCC antennas within high-speed, high-reliability subsystems, such as automotive radar and other 50GHz+ applications. GreenTape 9K5 LTCC has a dielectric constant of 5.80 (at 10 GHz), compatible with the commercial DuPont GreenTape 9K7 LTCC System. Full commercial rollout will occur next year.
At IMAPS 2011, DuPont will showcase the product and present on LTCC dielectric characterization for high-frequency microwave and millimeter-wave packaging.
"Introducing the DuPont GreenTape 9K5 LTCC System with Low Dielectric Constant," will be presented on October 12, during the Ceramic and LTCC Packaging I Session (WA3) of IMAPS 2011. Deepukumar M. Nair, applications development manager, will present initial characterization of the new DuPont GreenTape 9K5 LTCC system consisting of low-k dielectric tape, gold and silver conductors to evaluate the effects of chemistry, processing conditions, processing latitude, microstructure and microwave performance. Test coupons with various transmission and resonating structures are designed, fabricated, and tested for the evaluation of transmission losses and dielectric properties. Stability of the material system over multiple re-fire steps is also examined. Nair also will present "Bulk and In-Circuit Dielectric Characterization of LTCC Tape Systems Through Millimeter Wave Frequency Range," as part of the Ceramic and LTCC Packaging II Session (WP3) on the same day.
DuPont Microcircuit Materials develops and manufactures specialized thick film compositions for electronic applications in the automotive, display, photovoltaic, biomedical, industrial, military and telecommunications markets. It is part of the global materials supplier DuPont (NYSE:DD). For more information on DuPont Microcircuit Materials, visit http://mcm.dupont.com.
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October 6, 2011 — Test equipment provider Multitest installed a MT9928 XM Gravity Test Handler at a semiconductor production facility after a 1-year+ benchmarking against two major competitors.
Customer benchmarking included an off-line evaluation phase as well as real production package test. The job includes multi-site test handling of leaded and leadless semiconductor packages. The production facility installed the MT9928 XM due to its excellent jam rate and fast package conversion, even between leaded and leadless package types.
Multitest improved test yield at the site, replacing competitor
October 6, 2011 — Thanks to MEMS, 3D packaging, LEDs, power devices, and other applications, thinned wafers will be the majority of wafers in the market by 2016, according to Yole D
October 5, 2011 – BUSINESS WIRE — Analog Devices Inc. (ADI) introduced a packaging technology for digital isolators that achieves a minimum of 8mm creepage distance required by global industry standards to ensure safe operation in high-voltage medical and industrial applications.
Incorporating Analog Devices’ iCoupler digital isolation technology, the package achieves 8.3mm creepage. The new design is Canadian Standards Association certified. It suits advanced medical diagnostic, measurement and monitoring; and industrial and instrumentation systems that operate up to 220-250V AC.
Creepage is the shortest distance over an insulating surface — an IC package in this case — over which an arc may travel between two galvanically isolated conductors. A 220-250V working voltage requires a minimum of 8mm. The JEDEC-standard 16-lead SOIC has 7.6mm of creepage; ADI extended the package length by 2.5mm to enlarge the creepage path, while remaining compatible with JEDEC standard footprint. ADI developed the package to replace lower-performing optocouplers, delivering 4x the data rate and using 90% less power, according to the company.
ADI’s iCoupler technology is based on chip-scale transformers, offering power, stability, and data rate advantages over optocouplers’ LED or photodiode systems. The transformers are planar structures formed from CMOS and gold metal layers, fabricated directly on-chip using wafer-level processing. A high-breakdown thick polyimide layer under the gold insulates the top and bottom transformer coils. CMOS circuits connected to each coil provide the interface between each transformer and its external signals. iCoupler channels can be integrated with each other and other semiconductor functions.
| Coupler Digital Isolators Available in 16-Lead Certified SOIC Package | |
| ADuM220x | Dual-channel isolators |
| ADuM221x | Dual-channel isolators |
| ADuM225x | Isolators with non-latching bidirectional communication channels |
| ADuM240x | Quad-channel isolators |
| ADuM4160 | USB isolator |
| ADuM440x | Quad-channel isolators |
| ADuM6000 | Isolated dc-to-dc converter* |
| ADuM620x | Dual-channel 5-kV isolators with integrated dc-to-dc converter* |
| ADuM640x | Quad-channel isolators with integrated dc-to-dc converter* |
| ADM268xE | 5-kV rms signal and power isolated RS-485 transceivers* |
| *Certificate available in December. | |
Analog Devices provides data conversion and signal conditioning chips. Analog Devices’ common stock is listed on the New York Stock Exchange under the ticker "ADI" and is included in the S&P 500 Index. To watch a short video on the new iCoupler digital isolator packaging, visit http://www.analog.com/8mmpackaging.
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October 4, 2011 — Tamar Technology, precision metrology tool supplier, shipped its first fully automated WaferScan system to a major semiconductor fab. The system performs through silicon via (TSV) etch depth, deep trench depth, wafer thickness, photo-resist thickness, and hole diameter metrology.
The system includes Tamar Technology’s proprietary Wafer Thickness Sensor (WTS) to measure TSV depth and deep narrow trenches on single or bonded wafers. WaferScan uses a proprietary Visible Thickness Sensor (VTS) to measure photo resist, thick film, and various polymers’ thickness. It can measure at the surface and bottom of etched features, monitoring thickness variation and material presence. An integrated video microscope enables automated alignment and vision-based measurements, such as hole diameter.
The metrology tool uses optical and non-destructive methods, measuring "any TSV or trench regardless of the diameter or depth," noted David Grant, president of Tamar Technology.
The system can be configured with multiple sensors depending on measurement requirements. Programmed recipes and factory host integration via SECS/GEM allow fully automated operation. Process excursions are monitored in near real time.
For more information, contact Russ Dudley, Tamar
October 3, 2011 — IMAPS 2011, the 44th International Symposium on Microelectronics, will take place October 9-13 at the Long Beach Convention Center in Long Beach, CA. Ahead of the show, here are some of the highlights for attendees.
Take in the exhibits. Exhibit hall passes are free to all IMAPS 2011 attendees. This includes the exhibitor booths and welcome reception, as well as the keynote presentations and the Global Business Council Marketing Forum. Keynotes will be presented by Liam Madden, corporate VP, Xilinx Inc. and Dr. Ning-Cheng Lee, VP, technology, Indium Corporation.
New professional development courses this year cover counterfeit electronics, advanced packaging, and how to design and analyze an experiment.
The nearly 200 papers at IMAPS 2011 will be divided into 6 tracks:
- 3D Packaging
- Modeling/Reliability
- Next Gen. Materials
- Assembly & Packaging
- Advanced Technologies
- Focus Track: Adv. Packaging & System-Integration.
This year, the GBC forum is titled "Tomorrow’s Supply Chain: Overcoming Environmental & Societal Challenges." In the forum, IBM will look at how packaging is changing the data center, Medtronic will look at the impact of rework, and Hewlett-Packard (HP) will examine the electronics industry’s social and environmental roles.
Learn more before the show by visiting www.imaps2011.org.
IMAPS 2011 news:
Palomar Technologies to discuss pulsed heat eutectic solder and chain wire bonding for HB-LEDs
ALLVIA to present latest data for silicon interposers and embedded capacitors
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October 3, 2011 – BUSINESS WIRE — Rudolph Technologies Inc. (NASDAQ:RTEC), semiconductor and related process characterization equipment supplier, shipped its Wafer Scanner 3880 3D Inspection System, multiple NSX Macro Defect Inspection Systems and its Discover Yield Management Software Suite to a leading semiconductor manufacturer for use in developing through silicon via (TSV) structures in advanced 3D ICs. Rudolph cites system speed, accuracy, and flexibility in the multiple-tool win.
September 30, 2011 — Toshiba Corporation (TOKYO:6502.t) signed a non-binding memorandum of understanding for Amkor Technology, Inc. (Nasdaq:AMKR) to acquire Toshiba Electronics Malaysia Sdn. Bhd. (TEM), which is a semiconductor assembly operation in Malaysia. Amkor will also have the right to license certain related intellectual property rights.
TEM performs assembly and test of discrete and analog semiconductors, with a main focus on power semiconductors in recent years. The facility opened in 1973.
Toshiba sees power semiconductors as a growth driver for its business. Transferring TEM ownership to Amkor will bring TEM into a large-scale network of packaging/materials procurement capabilities. Toshiba will subcontract power semiconductor assembly and test to TEM. The TEM operations will become more efficient and Toshiba will benefit with a better back-end cost structure for power semiconductor assembly, the companies report.
Toshiba plans to focus its resources on front-end wafer fabrication for power semiconductors, reinforcing production at Kaga Toshiba Electronics Corporation in Japan