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The Electronic System Design Alliance, a SEMI Strategic Association Partner, today opened nominations for member company executives to serve on the ESD Alliance Governing Council for the next two-year term.

Elections, normally on a two-year cycle, were postponed in 2018 as the ESD Alliance became a SEMI Strategic Alliance Partner. During this cycle, up to nine members will be elected to a two-year term.

Current Governing Council members are:

  • Simon Segars, chief executive officer (CEO) of Arm Holdings
  • Lip-Bu Tan, president and CEO from Cadence Design Systems
  • Dean Drako, IC Manage’s president and CEO
  • Wally Rhines, CEO emeritus at Mentor, a Siemens Business
  • John Kibarian, president and CEO from PDF Solutions
  • Grant Pierce, CEO of Sonics
  • Aart de Geus, Synopsys’ chairman and co-CEO
  • Bob Smith, executive director of the ESD Alliance

Executives from member companies can nominate themselves or be nominated by someone from within a member company. Forms are available on the ESD Alliance website. Candidate statements will be posted on the website as they are received, with elections in mid-April. Results will be announced in May.

The Governing Council’s charter is to provide input and steer the direction of the organization. The ESD Alliance’s board of directors became the Governing Council when the ESD Alliance transitioned into SEMI as a SEMI Strategic Association Partner.

“Participating on the Governing Council offers executives a chance to help shape our industry, especially as the ESD Alliance’s global footprint expands and we increase our initiatives with the launch of ES Design West,” remarks Smith. “It’s a satisfying experience and we encourage executives from the electronic system and semiconductor design ecosystem to get involved.”

The Inaugural ES Design West

The ESD Alliance will host ES Design West co-located with SEMICON West 2019 at San Francisco’s Moscone Center, July 9-11. Dedicated to promoting the commercial successes of the Design and Design Automation Ecosystem™, ES Design West is the only event in North America that links the electronic system and semiconductor design community with the electronic product manufacturing and supply chain. For more information, visit the ES Design West 2019 website.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

A ride on the business cycle


February 19, 2019

By Walt Custer

Global growth slows in fourth quarter

World electronic industry growth moderated (or contracted) in many sectors in late 2018.  Compare Chart 1 (3Q’18 vs.3Q’17) to Chart 2 (4Q’18 vs.4Q’17). The length and color of the bars tell the story. The semiconductor industry felt more of a fourth-quarter slowdown than the end markets.  Semiconductor-related products are typically much more volatile than the electronic equipment markets they serve.

In the third quarter of 2018 SEMI equipment shipments were up 10.6 percent and semiconductors grew 15.2 percent compared to the same quarter in 2017. By comparison, in 4Q’18 SEMI capital equipment shipments declined 1.6 percent and semiconductor shipments rose only 0.6 percent. For the month of December 2018 alone the results were even more sobering – SEMI equipment down 8.9 percent and semiconductors down 9.1 percent.

Such are the business cycles in the global electronics industry!

Electronic equipment, semiconductors and SEMI equipment – Historical growth comparisons

Chart 3 compares the quarterly growth of “end market” equipment to semiconductors and SEMI capital equipment for 2013 through 2018. Notice the much higher volatility of SEMI equipment in the peaks and troughs of the business cycle.

Leading indicators

Predicting the future performance of our very volatile electronics business cycle is an important challenge. Taiwan wafer fab sales and Purchasing Manager Indices are two useful tools.

Wafer foundries

Chart 4 compares the composite monthly sales of 14 Taiwan-listed wafer fabs to global semiconductor sales. The foundry composite predicts a further decline in chip sales short term.  Taiwan-listed companies report their monthly revenues about 10 days after month-close, so they can be a very timely indicator of industry performance.

Chart 5 compares the 3/12 growth of these wafer foundries to global semiconductor and SEMI equipment shipments. The data point to further slowing ahead.

This leading indicator methodology can be useful in forecasting individual company sales. For details contact [email protected].

Walt Custer of Custer Consulting Group is an analyst focused on the global electronics industry.

Source: SEMI Blog

eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company’s growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.

Critical requirements to serve these markets include leading-edge, high-performance, differentiating semiconductor IP that is validated in advanced process nodes, a track record of successful design and fabrication of complex, FinFET-class ASICs and expertise in the design and manufacture of 2.5D package assemblies, including the integration of HBM memory stacks.

In the fall of last year, eSilicon announced availability of its neuASIC™ IP platform for AI ASIC design. The innovative IP platform includes an HBM2 PHY and AI mega/giga cells, including a convolution engine and accelerator builder software, all verified in 7nm technology. In that same time frame, the company announced that its 56G long-reach 7nm DSP SerDes was available for licensing.

In January, 2019, eSilicon announced a new high-performance test system to facilitate customer validation of its SerDes IP. At the recent DesignConshow, eSilicon demonstrated the new test system and its SerDes driving a five-meter copper cable at 56Gbps with very low error rates. Several customer engagements are underway with this SerDes IP, and customer feedback is validating its best-in-class capabilities. Also in January, eSilicon announced the formation of a technical advisory board for its AI initiatives staffed by three prominent technologists from academia and industry.

The company is in active production bring-up with two FinFET designs, including 2.5D technology utilizing its HBM2 PHY. All performance parameters are being met and both designs are on track to achieve full-scale production this year. One of the designs represents the largest ASIC eSilicon has ever built. It is believed to be the largest chip the foundry has ever produced as well.

“Our customers demand best-in-class IP, advanced ASIC and packaging expertise and the resources and technical depth to facilitate production bring-up of the final device,” said Hugh Durdan, vice president of strategy and products at eSilicon. “I am pleased to say we are delivering on all fronts. Recently, a tier one customer reported that they were usually quite critical of all IP. They went on to say they could find nothing to criticize after detailed evaluation of our SerDes.”

eSilicon will be presenting “A Sub-250mW 1-to-56Gb/s Continuous-Range PAM-4 42.5dB IL ADC/DAC-Based Transceiver in 7nm FinFET” at ISSCC in San Francisco on February 18. The company will be demonstrating its SerDes live at ISSCC that day as well. You can also find eSilicon at OFC in San Diego from March 5-7 (booth #5416), where the company will present two high-speed SerDes demonstrations and a demonstration if its HBM2 PHY.

By Mike Russo

For public policy lovers, civic-minded, engaged U.S. citizens, and people around the world interested in the U.S. President’s positions and priorities, the annual State of the Union address (SOTU) is “must-see TV.” This year, the anticipation and expectations were different than with past presidents. Trump is the first U.S. president who has used social media to the extreme that he has. Indeed, his Twitter feed is the most followed in history.

President Trump’s prolific Twitter feed has had an interesting impact on the SOTU. U.S. citizens and people from around the world already know President Trump’s positions on issues, his policy priorities and what gets him excited. There is an ongoing, direct line to the President’s thoughts throughout each and every day. In the past we looked to the SOTU for insights into what the sitting president is really thinking and his future policy priorities. Now, there isn’t much we don’t already know.

One looming question this year was whether President Trump would reach out in a conciliatory manner to help bridge the political divide and lay the groundwork to enable some public policy wins and avoid another government shutdown. While there were moments of conciliation, the President made it clear he would not move on areas that are most contentious with the other side of the aisle.

For example, the President unequivocally reiterated his intent to build “the wall.” While the message plays well to his base, it is, in effect, a frontal assault and challenge to Democrats. It’s hard to image that his staunch stance will help move the two parties to work together on substantive policy issues. It may also mean that the “wall” issue will occupy lawmakers time for the foreseeable future, sidelining debate on other important issues.

The best hope is that a bipartisan bill finds its way to the President’s desk that he can sign and use to “declare victory.” However, many political observers believe the likelihood of the President declaring a national security emergency is rising as a maneuver to ensure funding for “the wall” and avoid a shutdown. While such a declaration would most likely face a court challenge, the President could claim that his decision was a move of last resort and leverage the moment to position Democrats as obstructionists to his base. The scenario does not bode well for the bipartisan support necessary to address other issues.

What does this mean for our industry? Were there any points raised in the SOTU that would signal a change in what we are facing regarding trade, tariffs, export controls and immigration? Were any new issues or ideas raised that could help lift the global economy? In short, no. On one hand, the President cited his good relationship with the president of China, but on the other doubled down on his attacks on China, seeming to stand firm to bolster his position at the table as the U.S. and China trade talks continue.

What do these dynamics mean for SEMI Global Advocacy? In 2018 we were heavily engaged in efforts to prevent regulations that would inhibit our members’ ability to develop and deploy technologies and maintain global market access. We advanced our global advocacy model, leveraging our regional presence around the world. Many of the potential issues we faced emanated from the U.S., including those focused on controlling technology development, limiting trade and enhancing export controls. We also intensified our efforts to address industry talent pipeline issues.

In 2019, our public policy focus will be to continue to push back on tariffs, engage members to inform the rule-making process for export controls and to attempt to influence the immigration debate as it pertains to access to talent. In addition, while the U.S. R&D tax credit was made permanent through the tax cut in 2017, some of the provisions may have unintended consequences and will need to be modified. How the law is enacted will affect how businesses can deduct qualified research and development and other expenses from their taxable income, so we anticipate activity on the tax front as well.

It will also be a big year for SEMI on the workforce developmentfront. SEMI will continue to grow its existing High Tech U (HTU), university and mentor programs. In addition, SEMI will be positioning itself as the global leader in addressing issues related to the talent pipeline by approaching the problem with a full-spectrum, holistic approach that is intended to better address more immediate needs in attracting, training and retaining qualified talent. We’ll also focus on improving the industry image and exciting students at a younger age by providing experiential learning activities throughout a defined educational pathway. Stay tuned on this front as the full program unfolds.

In general, we will continue to build our relationships and stature as a leading voice for our members and the end-to-end semiconductor supply chain in the areas of “Talent, Trade, Tax and Technology” (SEMI’s “4 Ts”) and to ensure free and fair trade, access to markets, supply chain growth, IP protections and enhanced efforts to improve cybersecurity.

Mike Russo is VP of Global Industry Advocacy at SEMI. 

Source: SEMI Blog

KLA Corporation (NASDAQ: KLAC) today announced the appointment of Victor Peng to its board of directors.

Mr. Peng is president and chief executive officer of Xilinx, where he also serves as a member of the board of directors. Peng has over 30 years of experience leading technology transformation, defining and bringing to market FPGAs, SoCs, GPUs, high performance microprocessors and chip sets, and microprocessor IP products.

“We’re excited to have Victor Peng join the KLA board,” commented Edward W. (Ned) Barnholt, chairman of the board of KLA Corporation. “Victor is an accomplished semiconductor industry leader who brings significant business knowledge, technical expertise, and operational experience that will be invaluable to KLA as we execute our strategies for growth and market leadership.”

Peng joined Xilinx in 2008 and was named president and CEO of the company in January of 2018. Previously he was Xilinx’s chief operating officer, with responsibility for global sales, global operations and quality, product development, and product and vertical marketing. Prior to that, he served as the company’s executive vice president and general manager of Products, a position he held since July 2014. Mr. Peng previously held executive roles at AMD, ATI, and MIPS Technologies.

Peng serves on the board of the Semiconductor Industry Association. He earned a Bachelor of Science, Electrical Engineering from Rensselaer Polytechnic Institute and a Master of Engineering, Electrical Engineering from Cornell University. He holds four U.S. patents.

Intel names Robert Swan CEO


January 31, 2019

Intel Corporation (NASDAQ: INTC) today announced that its board of directors has named Robert (Bob) Swan as chief executive officer. Swan, 58, who has been serving as Intel’s interim CEO for seven months and as chief financial officer since 2016, is the seventh CEO in Intel’s 50-year history. Swan has also been elected to Intel’s board of directors.

Intel Corporation has named Robert Swan as its chief executive officer. His promotion was announced Jan. 31, 2019. Swan, who previously served as the company’s chief financial officer and interim CEO, is the seventh CEO to lead the company based in Santa Clara, Calif. (Credit: Intel Corporation)

Todd Underwood, vice president of Finance and director of Intel’s Corporate Planning and Reporting, will assume the role of interim chief financial officer as the company undertakes an internal and external search for a permanent CFO.

“As Intel continues to transform its business to capture more of a large and expanding opportunity that includes the data center, artificial intelligence and autonomous driving, while continuing to get value from the PC business, the board concluded after a thorough search that Bob is the right leader to drive Intel into its next era of growth,” said Chairman Andy Bryant. “The search committee conducted a comprehensive evaluation of a wide range of internal and external candidates to identify the right leader at this critical juncture in Intel’s evolution. We considered many outstanding executives and we concluded the best choice is Bob. Important in the board’s decision was the outstanding job Bob did as interim CEO for the past seven months, as reflected in Intel’s outstanding results in 2018. Bob’s performance, his knowledge of the business, his command of our growth strategy, and the respect he has earned from our customers, our owners, and his colleagues confirmed he is the right executive to lead Intel.”

“In my role as interim CEO, I’ve developed an even deeper understanding of Intel’s opportunities and challenges, our people and our customers,” Swan said. “When I was first named interim CEO, I was immediately focused on running the company and working with our customers. When the board approached me to take on the role permanently, I jumped at the chance to lead this special company. This is an exciting time for Intel: 2018 was an outstanding year and we are in the midst of transforming the company to pursue our biggest market opportunity ever. I’m honored to have the chance to continue working alongside our board, our leadership team, and our more than 107,000 superb employees as we take the company forward.”

Swan is a proven leader with a strong track record of success both within and outside Intel. As interim CEO, Swan has managed the company’s operations in close collaboration with Intel’s senior leadership team. Swan has been Intel’s CFO since October 2016. In this role, he led the global finance, mergers and acquisitions, investor relations, IT and corporate strategy organizations. Prior to joining Intel, Swan served as an operating partner at General Atlantic LLC and served on Applied Materials’ board of directors. He previously spent nine years as CFO of eBay Inc., where he is currently a director. Earlier in his career, he was CFO of Electronic Data Systems Corp. and TRW Inc. He also served as CFO, COO and CEO of Webvan Group Inc., and began his career at General Electric, serving for 15 years in several senior finance roles.

Soitec (Euronext Paris), a designer and manufacturer of semiconductor materials, announced today an expanded collaboration with Samsung Foundry to ensure the volume supply of fully depleted silicon-on-insulator (FD-SOI) wafers. This agreement extends the current  partnership and provides a solid foundation for both companies to strengthen the FD-SOI supply chain and guarantee high-volume manufacturing for customers.

With the leadership from the two companies, today FD-SOI is one of the standard technologies for cost-effective, low-power devices used in high-volume consumer, 4G/5G smartphones, IoT, and automotive applications. The agreement is built on the existing close relationship between the companies and guarantees wafer supply for Samsung’s FD-SOI platform starting with 28FDS process.

“This strategic agreement validates today’s high-volume manufacturing adoption of FD-SOI,” said Christophe Maleville, Soitec’s Executive Vice President, Digital Electronics Business Unit. “Soitec is ready to support Samsung’s current and long-term growth for ultra-low power, performance-on-demand FD-SOI solutions.”

FD-SOI relies on a very unique substrate whose layer thickness is controlled at the atomic scale. FD-SOI offers remarkable transistor performance in terms of power, performance, area and cost tradeoffs (PPAC), making it possible to cover low-power to high-performance digital applications with a single technology platform. FD-SOI delivers numerous unique advantages including the ability to mitigate process, temperature, voltage and aging variations through body bias, near-threshold supply capability, ultra-low sensitivity to radiation, and very high intrinsic transistor speed, making it most likely the fastest RF-CMOS technology on the market.

“Samsung has been committed to delivering transformative industry leading technologies.  FD-SOI is currently setting a new standard in many high-growth applications including IoT with ultra-low-power devices, automotive systems such as vision processors for ADAS and infotainment, and mobile connectivity from 5G smartphones to wearable electronics,” said Ryan Lee, Vice President of Foundry Marketing at Samsung Electronics. “Through this agreement with Soitec, our long-term strategic partner, we hope to lay the foundation for steady supply to meet high-volume demands of current and future customers.”

Worldwide PC shipments totaled 68.6 million units in the fourth quarter of 2018, a 4.3 percent decline from the fourth quarter of 2017, according to preliminary results by Gartner, Inc. For the year, 2018 PC shipments surpassed 259.4 million units, a 1.3 percent decline from 2017. Gartner analysts said there were signs for optimism in 2018, but the industry was impacted by two key trends.

“Just when demand in the PC market started seeing positive results, a shortage of CPUs (central processing units) created supply chain issues. After two quarters of growth in 2Q18 and 3Q18, PC shipments declined in the fourth quarter,” said Mikako Kitagawa, senior principal analyst at Gartner. “The impact from the CPU shortage affected vendors’ ability to fulfill demand created by business PC upgrades. We expect this demand will be pushed forward into 2019 if CPU availability improves.”

“Political and economic uncertainties in some countries dampened PC demand,” Ms. Kitagawa said. “There was even uncertainty in the U.S. — where the overall economy has been strong — among vulnerable buyer groups, such as small and midsize businesses (SMBs). Consumer demand remained weak in the holiday season. Holiday sales are no longer a major factor driving consumer demand for PCs.”

The top 3 vendors boosted their share of the global PC market as Lenovo, HP Inc. and Dell accounted for 63 percent of PC shipments in the fourth quarter of 2018, up from 59 percent in the fourth quarter of 2017 (see Table 1).

Lenovo surpassed HP Inc. to move into the No. 1 position in the global PC market in the fourth quarter of 2018. A major factor for Lenovo’s share gain was credited to a joint venture with Fujitsu formed in May 2018. Lenovo also had a strong quarter in the U.S. The company has recorded three consecutive quarters of double-digit year-over-year shipment growth, despite the stagnant overall market.

Table 1. Preliminary Worldwide PC Vendor Unit Shipment Estimates for 4Q18 (Thousands of Units)

Company 4Q18 Shipments 4Q18 Market Share (%) 4Q17 Shipments 4Q17 Market Share (%) 4Q18-4Q17 Growth (%)
Lenovo 16,628 24.2 15,697 21.9 5.9
HP Inc. 15,380 22.4 16,092 22.4 -4.4
Dell 10,915 15.9 10,763 15.0 1.4
Apple 4,920 7.2 5,112 7.1 -3.8
ASUS 4,211 6.1 4,716 6.6 -10.7
Acer Group 3,861 5.6 4,726 6.6 -18.3
Others 12,710 18.5 14,590 20.3 -12.9
Total 68,626 100.0 71,696 100.0 -4.3

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads (see “Market Definitions and Methodology: PCs, Ultramobiles and Mobile Phones”). All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.
Numbers may not add up to totals shown due to rounding.
*Lenovo’s results include Fujitsu units starting in 2Q18 to reflect the joint venture that closed in May 2018.

Source: Gartner (January 2019)

The fourth quarter of 2018 was a challenging one for HP Inc. The company experienced a shipment decline after four consecutive quarters of growth. HP Inc.’s shipments declined in most key regions, except Asia/Pacific and Japan. Dell registered positive growth as the company outperformed in EMEA and Japan, but it experienced a decline in Asia/Pacific and Latin America.

In the U.S., PC shipments totaled 14.2 million units in the fourth quarter of 2018, a 4.5 percent decline from the fourth quarter of 2017 (see Table 2). Four of the top six vendors experienced a decline in U.S. PC shipments in the fourth quarter of 2018. Lenovo’s growth was well above the U.S. average while Dell’s shipments increased slightly compared with a year ago. The overall decline in the U.S. was attributed to weak consumer demand despite holiday season sales as well as SMBs.

“The fourth quarter is typically a buying season for small office/home office (SOHO) and small business buyers in the U.S. as they want to use up the untouched budget before the tax year ends,” said Ms. Kitagawa. “Our early indicator showed that SOHO and small business buyers held off on some new PC purchases due to uncertainties around the political and economic conditions.”

Table 2. Preliminary U.S. PC Vendor Unit Shipment Estimates for 4Q18 (Thousands of Units)

Company 4Q18 Shipments 4Q18 Market Share (%) 4Q17 Shipments 4Q17 Market Share (%) 4Q18-4Q17 Growth (%)
HP Inc. 4,738 33.4 5,130 34.6 -7.6
Dell 3,645 25.7 3,613 24.3 0.9
Lenovo 2,150 15.2 1,743 11.7 23.4
Apple 1,762 12.4 1,800 12.1 -2.1
Microsoft 472 3.3 542 3.7 -12.9
Acer Group 458 3.2 587 4.0 -21.9
Others 953 6.7 1,430 9.6 -33.3
Total 14,178 100.0 14,843 100.0 -4.5

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.

Source: Gartner (January 2019)

PC shipments in EMEA totaled 20.9 million units in the fourth quarter of 2018, a 3.8 percent decline year over year. There were some positive signs, such as in Western Europe’s demand for desktops and ultramobiles that fueled SMB shipments, while the government sector also benefited from further Windows 10 renewals. Demand in Russia continued to recover, and some parts of Eastern Europe, such as the Czech Republic and Hungary. However, demand was not strong enough to offset declining shipments to consumers.

The Asia/Pacific PC market totaled 24.2 million units in the fourth quarter of 2018, a 4.6 percent decline from the fourth quarter of 2017. Due to uncertainties of the U.S.-China trade relations, and the volatile equity market, there was cautionary demand, especially among consumers and the SMB segment. In the fourth quarter of 2018, PC shipments in China declined 2.5 percent year over year, but shipments grew 5.6 percent sequentially.

Seventh Consecutive Year of Worldwide PC Shipment Decline

For the year, worldwide PC shipments totaled 259.4 million units in 2018, a 1.3 percent decrease from 2017 (see Table 3). This was the seventh consecutive year of global PC shipment decline, but it was less steep compared with the past three years.

“The majority of the PC shipment decline in 2018 was due to weak consumer PC shipments. Consumer shipments accounted for approximately 40 percent of PC shipments in 2018 compared with representing 49 percent of shipments in 2014,” Kitagawa said. “The market stabilization in 2018 was attributed to consistent business PC growth, driven by Windows 10 upgrade.”

Table 3. Preliminary Worldwide PC Vendor Unit Shipment Estimates for 2018 (Thousands of Units)

Company 2018

Shipments

 2018 Market

Share (%)

 2017

Shipments

 2017 Market Share (%) 2018-2017 Growth (%)
Lenovo 58,467 22.5 54,669 20.8 6.9
HP Inc. 56,332 21.7 55,179 21.0 2.1
Dell 41,911 16.2 39,793 15.1 5.3
Apple 18,016 6.9 18,963 7.2 -5.0
Acer Group 15,729 6.1 17,087 6.5 -7.9
ASUS 15,537 6.0 17,952 6.8 -13.5
Others 53,393 20.6 59,034 22.5 -9.6
Total 259,385 100.0 262,676 100.0 -1.3

Notes: Data includes desk-based PCs, notebook PCs and ultramobile premiums (such as Microsoft Surface), but not Chromebooks or iPads. All data is estimated based on a preliminary study. Final estimates will be subject to change. The statistics are based on shipments selling into channels.

Source: Gartner (January 2019)

These results are preliminary. Final statistics will be available soon to clients of Gartner’s PC Quarterly Statistics Worldwide by Region program. This program offers a comprehensive and timely picture of the worldwide PC market, allowing product planning, distribution, marketing and sales organizations to keep abreast of key issues and their future implications around the globe.

Rudolph Technologies, Inc. (NYSE: RTEC) announced today that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packaging architectures. The shift from wire bonding is needed to achieve higher data speeds, superior power distribution and thermal properties using copper pillars, micro-bumps, and through silicon vias (TSVs) for stacked chip-to-chip interconnects.

Delivery of systems will be completed by the end of the first quarter, with additional orders expected throughout 2019 as memory manufacturers transition their high-speed DRAM from wire-bonded architecture to advanced packaging.

“Rudolph began working with our customers’ R&D teams nearly ten years ago to develop 2D/3D measurements of the emerging copper bump process. That long-term customer engagement has resulted in systems and software that we believe to be the industry standard for advanced packaging metrology,” stated Cleon Chan, vice president of global field operations at Rudolph. “Stacking die using TSVs and micro-bumps for HBM DRAM packages requires precise control of the copper features that will ultimately make the electrical connections between the stacked memory chips and the logic chip in the same package. After significant development in the package and the process control methods, these devices are now beginning high-volume manufacturing, which is being driven by the data speed and capacity demands from big data servers and graphics applications. These new, non-wire bonded memory architectures are creating a very healthy demand for our back-end process control systems. This customer is also using Rudolph systems for post-saw film-frame inspection looking for package defects.”

A combination of Rudolph’s 2D/3D inspection systems and metal metrology systems provide a total process control solution to help assure that height, diameter, location and coplanarity of copper micro-bumps, pillar bumps, and TSVs are precisely controlled. After the packages are molded and separated by sawing, additional Rudolph inspection systems provide outgoing quality checks for sidewall delamination and/or hairline cracks, which are considered killer defects for advanced memory packages.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $41.4 billion for the month of November 2018, an increase of 9.8 percent from the November 2017 total of $37.7 billionand 1.1 percent less than the October 2018 total of $41.8 billion. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“The global semiconductor industry continues to post solid year-to-year sales increases, and year-to-date revenue through November has surpassed annual sales from all of 2017, but growth has slowed somewhat in recent months,” said John Neuffer, SIA president and CEO. “Year-to-year sales increased in November across all major regional markets, with the China market standing out with growth of 17 percent. Double-digit annual growth is expected for 2018 once December’s sales are tallied, with more modest growth projected for 2019.”

Regionally, year-to-year sales increased in China (17.4 percent), the Americas (8.8 percent), Europe (5.8 percent), Japan(5.6 percent), and Asia Pacific/All Other (4.4 percent). Compared with last month, sales were up in Asia Pacific/All Other (1.1 percent), Europe (0.5 percent), and Japan (0.4 percent), but down slightly in the Americas (-2.2 percent) and China(-2.7 percent).